Texas Instruments DAC8580, Руководство пользователя

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Bill of Materials
4.4 DAC Output Update Options
The DXP software also allows the user to choose several DAC output update options, as Figure 16
shows.
Figure 16. DAC Output Update Options
Table 7 lists the details on these options.
Table 7. Output Update Features
Options Detailed Description
Frame Sync The DXP software defaults to Frame Sync. The Frame Sync output of the MMB0
connects to the SYNC input of the DAC8581. The DAC output changes to the
corresponding level when the DAC latch is updated via SDI. Ensure the shunt jumper
on W6 is covering pins 2-3 (default is 1-2) to use this feature.
Latch with DSP Timer N/A
Latch with External Timer N/A
Update Rate User Input: Enter the desired DAC update rate; 1 MSPS is the default rate.
5 Bill of Materials
Table 8 displays the bill of materials.
Table 8. DAC8580/81EVM Bill of Materials
Item Qty Value Designators Description Vendor Vendor Part Number
1 10 0
Ω
(1)
R17 R25 R26 1/4W 1206 Thick Film Chip Resistor, ±5% Panasonic ERJ-8GEY0R00V
R27 R28 R31 Tol
(1)
R32 R33 R38
R39
2 2 1 μ F C9 C10 Multilayer Ceramic Chip Capacitor, 1206 TDK C3216X7R1H105KT
SMD, 50V, ±15% TC, ±10% Tol
3 5 0.1 μ F C1 C2 C3 C4 Multilayer Ceramic Chip Capacitor, 1206 TDK C3216COG1E104KT
C7 SMD, 25V, 0±30ppm/ºC TC, ±10% Tol
4 1 1 nF C12 Multilayer Ceramic Chip Capacitor, 1206 TDK C3216COG2J102KT
SMD, 630V, 0±30ppm/ºC TC, ±10% Tol
5 7 2 × 1 × 0.1 TH W7 W8 W9 Modified 0.025" Square Post Header Samtec MTSW-102-08-T-S-295
W10 W15
W16 W17
6 4 3 × 1 × 0.1 TH W1 W4 W5 Modified 0.025" Square Post Header Samtec MTSW-103-08-T-S-295
W14
7 1 5 × 2 × 0.1 SMT P6 10-PIN Socket Strip
(1)
Samtec SSW-105-22-F-D-VS-K
8 8 10 k Ω R1 R2 R3 R4 1/8W 1206 Thick Film Chip Resistor, ±1% Panasonic ERJ-8ENF1002V
R5 R6 R7 R12 Tol
9 1 2 k Ω R8 1/4W 1206 Thick Film Chip Resistor, ±5% Panasonic ERJ-8GEYJ202V
Tol
10 1 100 R13 1/4W 1206 Thick Film Chip Resistor, ±5% Panasonic ERJ-8GEYJ101V
Tol
(1)
P2, P4, and P6 parts are not shown in the schematic diagram. All the P-designated parts are installed in the bottom side of the
PCB opposite the J-designated counterpart. For example, J2 is installed on the top side whereas P2 is installed on the bottom
side opposite of J2. The following parts are NOT installed: J1, J5, R31, R32, and R33 and items 27 and 28. C16 and U4 are
optional; U4 can be substituted for U3 for external reference source. The DUT installed, U1, for the EVM, is either a
DAC8580 or DAC8581 device. For the DAC8581, the following parts are not installed in addition to the preceding listing:
R1, R2, R3, R4, R25, R28, R38, R39, W7, W8, W9 W10, and W17. Jumper wires are installed in lieu of W7, W8, W9, and
W10.
17 SLAU173A – December 2005 – Revised November 2009 DAC8580/81 Evaluation Module
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