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CC3235MODS, CC3235MODSF

SWRS224A – FEBRUARY 2019 – REVISED AUGUST 2019

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CC3235MODS CC3235MODSF

Applications, Implementation, and Layout

Copyright © 2019, Texas Instruments Incorporated

7.3

PCB Layout Guidelines

This section details the PCB guidelines to speed up the PCB design using the CC3235MODx . The
integrator of theCC3235MODx modules must comply with the PCB layout recommendations described in
the following subsections to minimize the risk with regulatory certifications for the FCC, IC/ISED, ETSI/CE,
and MIC. Moreover, TI recommends customers follow the guidelines described in this section to achieve
similar performance to that obtained with the TI reference design.

7.3.1

General Layout Recommendations

Ensure that the following general layout recommendations are followed:

•

Have a solid ground plane and ground vias under the module for stable system and thermal
dissipation.

•

Do not run signal traces underneath the module on a layer where the module is mounted.

7.3.2

CC3235MODx RF Layout Recommendations

The RF section of this wireless module gets top priority in terms of layout. It is very important for the RF
section to be laid out correctly to ensure optimum performance from the module. A poor layout can cause
low-output power, EVM degradation, sensitivity degradation, and mask violations.

shows the RF placement and routing of the CC3235MODx module with external antenna.

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Содержание CC3235MODSF SimpleLink

Страница 1: ...l 12 Bit ADCs 4 General Purpose Timers GPT with 16 Bit PWM Mode Watchdog Timer Up to 27 GPIO Pins Debug Interfaces JTAG cJTAG SWD Wi Fi network processor subsystem Wi Fi core 802 11 a b g n 2 4 GHz and 5 GHz Modes Access Point AP Station STA Wi Fi Direct only supported on 2 4 GHz Security WEP WPA WPA2 PSK WPA2 Enterprise Internet and application protocols HTTPs server mDNS DNS SD DHCP IPv4 and IPv...

Страница 2: ...e variants CC3235MODS includes 256KB of RAM IoT networking security device identity keys as well as MCU level security features such as file system encryption user IP MCU image encryption secure boot and debug security CC3235MODSF builds on the CC3235MODS and integrates a user dedicated 1MB of executable flash in addition to the 256KB of RAM Created for IoT the SimpleLink Wi Fi CC3235MODx module f...

Страница 3: ...MODx device family is part of the SimpleLink MCU platform a common easy to use development environment based on a single core software development kit SDK with a rich tool set and reference designs The E2E community supports Wi Fi Bluetooth low energy Sub 1 GHz and host MCUs For more information visit www ti com simplelink or www ti com simplelinkwifi Device Information 1 PART NUMBER PACKAGE BODY ...

Страница 4: ...ver TCP IP Stack ARM Cortex Power Management Oscillators DC DC RTC Baseband MAC Processor Radio Synthesizer Dual Band Wi Fi COEX I Os Antenna Selection 4 CC3235MODS CC3235MODSF SWRS224A FEBRUARY 2019 REVISED AUGUST 2019 www ti com Submit Documentation Feedback Product Folder Links CC3235MODS CC3235MODSF Module Overview Copyright 2019 Texas Instruments Incorporated Figure 1 2 shows the an overview ...

Страница 5: ...AC and PHY Applications MCU Network Processor 5 CC3235MODS CC3235MODSF www ti com SWRS224A FEBRUARY 2019 REVISED AUGUST 2019 Submit Documentation Feedback Product Folder Links CC3235MODS CC3235MODSF Module Overview Copyright 2019 Texas Instruments Incorporated Figure 1 3 shows the an overview of the CC3235x embedded software Figure 1 3 CC3235x Embedded Software Overview ...

Страница 6: ...LAN Coexistence Requirements 50 5 16 Reset Requirement 50 5 17 Thermal Resistance Characteristics for MOB Packages 50 5 18 Timing and Switching Characteristics 51 6 Detailed Description 63 6 1 Overview 63 6 2 Functional Block Diagram 63 6 3 Arm Cortex M4 Processor Core Subsystem 64 6 4 Wi Fi Network Processor Subsystem 65 6 5 Security 67 6 6 FIPS 140 2 Level 1 Certification 70 6 7 Power Management...

Страница 7: ...d NWP LPDS row in Table 5 3 40 Changed NWP LPDS row in Table 5 4 41 Deleted footnote from Table 5 9 49 Changed MIC ID in Table 6 7 78 Updated Dual Antenna Coexistence Mode Block Diagram image 80 Updated Coexistence Solution with Wi Fi Antenna Selection and Dedicated BLE Antenna image 81 Changed Section 8 1 90 Changed shelf life in Section 8 3 1 90 Changed assembly operations in Section 8 4 2 90 Ch...

Страница 8: ...rocontroller Wireless Microcontroller Standard 802 11 a b g n 802 11 a b g n 802 11 a b g n Frequency 2 4 GHz 5 GHz 2 4 GHz 5 GHz 2 4 GHz 5 GHz TCP IP Stack IPv4 IPv6 IPv4 IPv6 IPv4 IPv6 Secured sockets 16 16 16 Integrated MCU Arm Cortex M4 at 80 MHz Arm Cortex M4 at 80 MHz ON CHIP APPLICATION MEMORY RAM 256KB 256KB Flash 1MB PERIPHERALS AND INTERFACES Universal Asynchronous Receiver Transmitter U...

Страница 9: ...Table 3 1 Device Features Comparison continued FEATURE DEVICE CC3135MOD CC3235MODS CC3235MODSF Secure boot Yes Yes Enhanced Application Level Security File system security Secure key storage Software tamper detection Cloning protection Initial secure programming File system security Secure key storage Software tamper detection Cloning protection Initial secure programming FIPS 140 2 Level 1 Certif...

Страница 10: ...d security enabled products Texas instruments offers a single chip wireless microcontroller and a wireless network processor which can be paired with any MCU to allow developers to design new wi fi products or upgrade existing products with wi fi capabilities BoosterPack Plug In Modules BoosterPack Plug In Modules extend the functionality of TI LaunchPad Kit Application specific BoosterPack Plug i...

Страница 11: ...O1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GND GND GND RF_ABG GND NC SOP0 nRESET VBAT_RESET VBAT1 GND NC VBAT2 NC GPIO30 GND 11 CC3235MODS CC3235MODSF www ti com SWRS224A FEBRUARY 2019 REVISED AUGUST 2019 Submit Documentation Feedback Product Folder Links CC3235MODS CC3235MODSF Terminal Configuration and Functions Copyright 2019 Texas Instruments Incorporated 4 Terminal Configuration and F...

Страница 12: ...d by SW All digital I Os are non fail safe NOTE If an external device drives a positive voltage to the signal pads and the CC3235MODx module is not powered DC is drawn from the other device If the drive strength of the external device is adequate an unintentional wakeup and boot of the CC3235MODx module can occur To prevent current draw TI recommends any one of the following conditions All devices...

Страница 13: ... 20 JTAG TMS input Leave unconnected if not used on product 2 23 SOP2 21 An internal 100 kΩ pull down resistor is tied to this SOP pin An external 10 kΩ resistor is required to pull this pin high See Section 6 11 1 for SOP 2 0 configuration modes 24 SOP1 34 An internal 100 kΩ pull down resistor is tied to this SOP pin An external 10 kΩ resistor is required to pull this pin high See Section 6 11 1 ...

Страница 14: ...Ground 40 VBAT2 Power 10 44 54 Power supply for the module must be connected to battery 2 3 V to 3 6 V 42 GPIO30 I O 53 GPIO 2 43 GND Ground 44 GPIO0 I O 50 GPIO 2 46 GPIO1 I O 55 GPIO 2 47 GPIO2 I O 57 GPIO 2 48 GPIO3 I O 58 GPIO 2 49 GPIO4 I O 59 GPIO 2 50 GPIO5 I O 60 GPIO 2 51 GPIO6 I O 61 GPIO 2 52 GPIO7 I O 62 GPIO 2 53 GPIO8 I O 63 GPIO 2 54 GPIO9 I O 64 GPIO 2 55 GND Thermal ground 56 GND ...

Страница 15: ...l Analog Mux Muxed With JTAG Dig Pin Mux Config Reg Dig Pin Mux Config Mode Value Signal Name Signal Description Signal Direction LPDS 1 Hib 2 nRESET 0 1 GND GND N A N A N A N A N A GND GND N A N A N A N A 2 GND GND N A N A N A N A N A GND GND N A N A N A N A 3 GPIO10 I O No No No GPIO_PAD_ CONFIG_10 0x4402 E0C8 0 GPIO10 GPIO I O Hi Z Pull Drive Hi Z Pull Drive Hi Z 1 I2C_SCL I2 C clock I O open d...

Страница 16: ...RESET 0 4 GPIO11 I O Yes No No GPIO_PAD_ CONFIG_11 0x4402 E0CC 0 GPIO11 GPIO I O Hi Z Pull Drive Hi Z Pull Drive Hi Z 1 I2C_SDA I2 C data I O open drain Hi Z Pull Drive 3 GT_PWM07 Pulse width modulated O P O Hi Z Pull Drive 4 pXCLK XVCLK Free clock to parallel camera O 0 6 SDCARD_CMD SD card command line I O open drain Hi Z Pull Drive 7 UART1_RX UART RX data I Hi Z Pull Drive 12 GT_CCP02 Timer cap...

Страница 17: ...ription Signal Direction LPDS 1 Hib 2 nRESET 0 6 GPIO15 I O No No No GPIO_PAD_ CONFIG_15 0x4402 E0DC 0 GPIO15 GPIO I O Hi Z Pull Drive Hi Z Pull Drive Hi Z 5 I2C_SDA I2 C data I O open drain 7 GSPI_MISO General SPI MISO I O 4 pDATA9 CAM_D5 Parallel camera data bit 5 I 13 GT_CCP06 Timer capture port I 8 SDCARD_ DATA0 SD card data I O 7 GPIO16 I O No No No GPIO_PAD_ CONFIG_16 0x4402 E0E0 0 GPIO16 GP...

Страница 18: ...O17 GPIO I O Hi Z Pull Drive Hi Z Pull Drive Hi Z 5 UART1_RX UART1 RX data I 7 GSPI_CS General SPI chip select I O 4 pDATA11 CAM_D7 Parallel camera data bit 7 I 8 SDCARD_ CMD SD card command line I O 9 GPIO12 I O No No No GPIO_PAD_ CONFIG_12 0x4402 E0D0 0 GPIO12 GPIO I O Hi Z Pull Drive Hi Z Pull Drive Hi Z 3 McACLK I2S audio port clock output O Hi Z Pull Drive 4 pVS VSYNC Parallel camera vertical...

Страница 19: ...ame sync O 5 GT_CCP04 Timer capture port I 12 JTAG_TDI I O No No Muxed with JTAG TDI GPIO_PAD_ CONFIG_23 0x4402 E0FC 1 TDI JTAG TDI Reset default pinout I Hi Z Pull Drive Hi Z Pull Drive Hi Z 0 GPIO23 GPIO I O 2 UART1_TX UART1 TX data O 1 9 I2C_SCL I2C clock I O open drain Hi Z Pull Drive 13 FLASH_ SPI_ MISO N A N A N A N A N A N A FLASH_SPI_MISO Data from SPI serial Flash fixed default N A Hi Z H...

Страница 20: ...TAG TDO Reset default pinout O Hi Z Pull Drive Driven high in SWD driven low in 4 wire JTAG Hi Z 0 GPIO24 GPIO I O 5 PWM0 Pulse width modulated O P O 2 UART1_RX UART1 RX data I 9 I2C_SDA I2 C data I O open drain 4 GT_CCP06 Timer capture port I 6 McAFSX I2S audio port frame sync O 19 GPIO28 I O No No No GPIO_PAD_ CONFIG_ 40 0x4402 E140 0 GPIO28 GPIO I O Hi Z Pull Drive Hi Z Pull Drive Hi Z 20 NC WL...

Страница 21: ...O_EN Enable to optional external 40 MHz TCXO O 0 See 6 SOP2 Sense on power 2 I Hi Z Pull Drive 24 SOP1 Config sense N A N A N A N A N A SOP1 Sense on power 1 N A N A N A N A 25 GND GND N A N A N A N A N A GND GND N A N A N A N A 26 GND GND N A N A N A N A N A GND GND N A N A N A N A 27 GND GND N A N A N A N A N A GND GND N A N A N A N A 28 GND GND N A N A N A N A N A GND GND N A N A N A N A 29 GND...

Страница 22: ...A N A N A VBAT1 Analog DC DC input connected to chip input supply VBAT N A N A N A N A 38 GND GND N A N A N A N A N A GND GND N A N A N A N A 39 NC WLAN analog N A N A N A N A N A NC Reserved N A N A N A N A 40 VBAT2 Supply input N A N A N A N A N A VBAT2 Analog input supply VBAT N A N A N A N A 41 NC WLAN analog N A N A N A N A N A NC Reserved N A N A N A N A 42 GPIO30 I O No User config not requ...

Страница 23: ...ue Signal Name Signal Description Signal Direction LPDS 1 Hib 2 nRESET 0 44 GPIO0 I O No User config not required 7 No GPIO_PAD_ CONFIG_0 0x4402 E0A0 0 GPIO0 GPIO I O Hi Z Pull Drive Hi Z Pull Drive Hi Z 12 UART0_CTS UART0 Clear to Send input active low I Hi Z Pull Drive Hi Z Pull Drive Hi Z 6 McAXR1 I2S audio port data 1 RX TX I O Hi Z Pull Drive 7 GT_CCP00 Timer capture port I Hi Z Pull Drive 9 ...

Страница 24: ...Z Pull Drive Hi Z 3 UART0_TX UART0 TX data O 1 4 pCLK PIXCLK Pixel clock from parallel camera sensor I Hi Z Pull Drive 6 UART1_TX UART1 TX data O 1 7 GT_CCP01 Timer capture port I Hi Z Pull Drive 47 9 GPIO2 Analog input up to 1 8 V digital I O Yes See 8 No GPIO_PAD_ CONFIG_2 0x4402 E0A8 See 5 ADC_CH0 ADC channel 0 input 1 5 V max I Hi Z Pull Drive Hi Z Pull Drive Hi Z 0 GPIO2 GPIO I O Hi Z Pull Dr...

Страница 25: ...gnal Direction LPDS 1 Hib 2 nRESET 0 49 9 GPIO4 Analog input up to 1 8 V digital I O Yes See 8 Yes GPIO_PAD_ CONFIG_4 0x4402 E0B0 See 5 ADC_CH2 ADC channel 2 input 1 5 V max I Hi Z Pull Drive Hi Z Pull Drive Hi Z 0 GPIO4 GPIO I O Hi Z Pull Drive 6 UART1_RX UART1 RX data I Hi Z Pull Drive 4 pDATA6 CAM_D2 Parallel camera data bit 2 I Hi Z Pull Drive 50 9 GPIO5 Analog input up to 1 5 V No See 8 No GP...

Страница 26: ...l Drive Hi Z Pull Drive Hi Z 5 UART0_RTS UART0 Request to Send active low O 1 4 pDATA4 CAM_D0 Parallel camera data bit 0 I Hi Z Pull Drive 3 UART1_CTS UART1 Clear to send active low I Hi Z Pull Drive 6 UART0_CTS UART0 Clear to send active low I Hi Z Pull Drive 7 GT_CCP06 Timer capture port I Hi Z Pull Drive 52 GPIO7 I O No No No GPIO_PAD_ CONFIG_7 0x4402 E0BC 0 GPIO7 GPIO I O Hi Z Pull Drive Hi Z ...

Страница 27: ...S state The state of unused I Os is Hi Z Software may program the I Os to be input with pull or drive regardless of active pin configuration according to the need 2 Hibernate mode The state of the I Os is Hi Z Software may program the I Os to be input with pull or drive regardless of active pin configuration according to the need 3 To minimize leakage in some serial Flash vendors during LPDS TI re...

Страница 28: ...18 5 6 for further details on the useable range of the ADC The digital pads can tolerate up to 3 6 V Hence take care to prevent accidental damage to the ADC inputs TI recommends first disabling the output buffers of the digital I Os corresponding to the desired ADC channel that is converted to Hi Z state and thereafter disabling the respective pass switches S7 Pin 47 S8 Pin 48 S9 Pin 49 and S10 Pi...

Страница 29: ... input maximum of 1 5 V ADC_CH3 50 I I ADC channel 3 input maximum of 1 5 V Antenna selection GPIO10 3 I O O Antenna selection control GPIO11 4 I O O GPIO14 5 I O O GPIO15 6 I O O GPIO16 7 I O O GPIO17 8 I O O GPIO12 9 I O O GPIO13 10 I O O GPIO22 11 I O O GPIO28 19 1 I O O GPIO25 23 O O GPIO0 44 I O O GPIO3 48 I O O GPIO4 49 I O O GPIO5 50 I O O GPIO6 51 I O O GPIO8 53 I O O GPIO9 54 I O O BLE 2 ...

Страница 30: ...ION Hostless mode HM_IO 3 I O I O Hostless mode inputs and outputs 4 I O O 5 I O I O 6 I O I O 7 I O I O 8 I O I O 9 I O I O 10 I O O 11 I O I O 19 1 I O I O 23 O O 42 1 I O I O 44 I O I O 48 O O 49 O O 50 I O I O 51 I O I O 53 I O I O 54 I O I O JTAG SWD TDI 12 I O I JTAG TDI Reset default pinout TDO 18 I O O JTAG TDO Reset default pinout TCK 21 I O I JTAG SWD TCK Reset default pinout TMS 22 I O ...

Страница 31: ... GT_PWM06 3 I O O Pulse width modulated O P GT_CCP01 46 I O I Timer capture port GT_PWM07 4 I O O Pulse width modulated O P GT_CCP02 47 I O I Timer capture ports GT_CCP03 9 I O I GT_CCP04 10 I O I 11 I O I GT_CCP05 5 I O I GT_CCP06 6 I O I 18 I O I 51 I O I 53 I O I GT_CCP07 7 I O I PWM0 18 I O O Pulse width modulated outputs GT_PWM03 21 I O O GT_PWM02 23 O O GT_CCP00 44 I O I Timer capture ports ...

Страница 32: ... I O GPIO29 22 I O I O GPIO25 23 O O GPIO0 44 I O I O GPIO30 42 I O I O GPIO1 46 I O I O GPIO2 47 I O I O GPIO3 48 I O I O GPIO4 49 I O I O GPIO5 50 I O I O GPIO6 51 I O I O GPIO7 52 I O I O GPIO8 53 I O I O GPIO9 54 I O I O McASP I2 S or PCM MCAFSX 4 I O O I2 S audio port frame sync 11 18 23 42 53 McACLK 9 I O O I2 S audio port clock outputs 42 I O O McAXR1 44 I O I O I2 S audio port data 1 RX TX...

Страница 33: ...AM_D7 8 I O I Parallel camera data bit 7 pCLK PIXCLK 46 I O I Pixel clock from parallel camera sensor pDATA7 CAM_D3 48 I O I Parallel camera data bit 3 pDATA6 CAM_D2 49 I O I Parallel camera data bit 2 pDATA5 CAM_D1 50 I I Parallel camera data bit 1 pDATA4 CAM_D0 51 I O I Parallel camera data bit 0 Power VBAT1 37 Power supply for the module VBAT2 40 Power supply for the module RF RF_ABG 31 I O I W...

Страница 34: ... UART0 TX data 42 I O O 46 I O O 52 I O O UART0_RX 10 I O I UART0 RX data 47 I O I UART0 RX data UART0_CTS 44 I O I UART0 clear to send input active low 51 UART0_RTS 44 I O O UART0 request to send active low 51 I O O 52 I O O Sense On Power SOP2 23 4 O I Sense on power 2 SOP1 24 I I Configuration sense on power 1 SOP0 34 I I Configuration sense on power 0 1 LPDS retention unavailable 2 The CC3235M...

Страница 35: ...etermined by the I O state as are other digital I Os 4 48 Analog signal 1 8 V absolute 1 46 V full scale ADC is isolated The digital I O cell is also isolated Determined by the I O state as are other digital I Os 4 49 Analog signal 1 8 V absolute 1 46 V full scale ADC is isolated The digital I O cell is also isolated Determined by the I O state as are other digital I Os 4 50 Analog signal 1 8 V ab...

Страница 36: ...or output Wake up I O source should not be floating during hibernate All the I O pins will float while in Hibernate and Reset states Ensure pullup and pulldown resistors are available on board to maintain the state of the I O Leave unused GPIOs as NC No Connect NC 20 33 41 45 Unused pin leave as NC SOP Configuration sense on power 23 24 34 Leave as NC Modules contain internal 100 kΩ pull down resi...

Страница 37: ... temperature TA 40 85 C Storage temperature Tstg 40 85 C Junction temperature Tj 3 120 C 1 JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process 2 JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process 5 2 ESD Ratings VALUE UNIT VESD Electrostatic discharge Human body model HBM per ANSI ESDA JEDE...

Страница 38: ... by more than 20 C There are two additional calibration modes that may be used to reduced or completely eliminate the calibration event For further details see CC31xx CC32xx SimpleLink Wi Fi and IoT Network Processor Programmer s Guide Table 5 1 Current Consumption Summary CC3235MODS 2 4 GHz RF Band TA 25 C VBAT 3 6 V PARAMETER TEST CONDITIONS 1 2 MIN TYP 3 MAX UNIT MCU ACTIVE NWP ACTIVE TX 1 DSSS...

Страница 39: ...ode calibration is performed sparingly and typically occurs when re enabling the NWP and when the temperature has changed by more than 20 C There are two additional calibration modes that may be used to reduced or completely eliminate the calibration event For further details see CC31xx CC32xx SimpleLink Wi Fi and IoT Network Processor Programmer s Guide Table 5 2 Current Consumption Summary CC323...

Страница 40: ... out of HIBERNATE and only if temperature has changed by more than 20 C The calibration event can be controlled by a configuration file in the serial flash Table 5 3 Current Consumption Summary CC3235MODSF 2 4 GHz RF Band TA 25 C VBAT 3 6 V PARAMETER TEST CONDITIONS 1 2 MIN TYP 3 MAX UNIT MCU ACTIVE NWP ACTIVE TX 1 DSSS TX power level 0 286 mA TX power level 4 202 6 OFDM TX power level 0 255 TX po...

Страница 41: ... take up to 17 mJ of energy from the battery over a period of 24 ms Calibration is performed sparingly typically when coming out of HIBERNATE and only if temperature has changed by more than 20 C The calibration event can be controlled by a configuration file in the serial flash Table 5 4 Current Consumption Summary CC3235MODS 5 GHz RF Band TA 25 C VBAT 3 6 V PARAMETER TEST CONDITIONS 1 2 MIN TYP ...

Страница 42: ... has several options for modifying the output power of the device when required For the 2 4 GHz band it is possible to lower the overall output power at a global level using the global TX power level setting In addition the 2 4 GHz band allows the user to enter additional back offs 1 per channel region 2 and modulation rates 3 4 via Image creator see the Uniflash with Image Creator User Guide for ...

Страница 43: ...0 7 00 5 00 3 00 1 00 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 IBAT VBAT 3 6 V mAmp 280 00 264 40 249 00 233 30 218 00 202 00 186 70 171 00 155 60 140 00 6 OFDM Color by TX Power dBm IBAT VBAT 3 6 V 43 CC3235MODS CC3235MODSF www ti com SWRS224A FEBRUARY 2019 REVISED AUGUST 2019 Submit Documentation Feedback Product Folder Links CC3235MODS CC3235MODSF Specifications Copyright 2019 Texas Instruments In...

Страница 44: ... addition it is possible to enter an additional back off 4 factor per channel and modulation rate for further margin to regulatory requirements Finally it is also possible to set the TX and RX trace losses to the antenna per band 5 The peak antenna gain 6 can also be provided thus allowing further control For a full description of options and capabilities see Uniflash with Image Creator User Guide...

Страница 45: ...ownout condition all sections of the device shut down within the module except for the Hibernate block including the 32 kHz RTC clock which remains on The current in this state can reach approximately 400 µA The blackout condition is equivalent to a hardware reset event in which all states within the module are lost Vbrownout 2 1 V and Vblackout 1 67 V Table 5 5 lists the brownout and blackout vol...

Страница 46: ...el input voltage 0 65 VDD VDD 0 5 V V VIL Low level input voltage 0 5 0 35 VDD V IIH High level input current 5 nA IIL Low level input current 5 nA VOH High level output voltage IL 2 mA configured I O drive strength 2 mA 2 4 V VDD 3 6 V VDD 0 8 V IL 4 mA configured I O drive strength 4 mA 2 4 V VDD 3 6 V VDD 0 7 IL 6 mA configured I O drive strength 6 mA 2 4 V VDD 3 6 V VDD 0 7 IL 2 mA configured ...

Страница 47: ...t current 50 nA VOH High level output voltage IL 2 mA configured I O drive strength 2 mA 2 4 V VDD 3 6 V VDD 0 8 V IL 4 mA configured I O drive strength 4 mA 2 4 V VDD 3 6 V VDD 0 7 IL 6 mA configured I O drive strength 6 mA 2 4 V VDD 3 6 V VDD 0 7 IL 2 mA configured I O drive strength 2 mA 2 3 V VDD 2 4 V VDD 0 75 VOL Low level output voltage IL 2 mA configured I O drive strength 2 mA 2 4 V VDD 3...

Страница 48: ...s are measured at the SoC pin on channel 6 2437 MHz PARAMETER TEST CONDITIONS Mbps MIN TYP MAX UNIT Sensitivity 8 PER for 11b rates 10 PER for 11g 11n rates 1 1 DSSS 94 5 dBm 2 DSSS 92 5 11 CCK 86 5 6 OFDM 89 9 OFDM 88 5 18 OFDM 85 36 OFDM 79 54 OFDM 73 MCS7 GF 2 70 Maximum input level 10 PER 802 11b 2 5 dBm 802 11g 8 5 1 Sensitivity for mixed mode is 1 dB worse Table 5 7 WLAN Receiver Characteris...

Страница 49: ...ured at 1 dB from IEEE spectral mask or EVM 1 DSSS 16 dBm 2 DSSS 16 11 CCK 16 3 6 OFDM 15 3 9 OFDM 15 3 18 OFDM 15 36 OFDM 14 54 OFDM 12 5 MCS7 11 Transmit center frequency accuracy 25 25 ppm 1 Transmit power will be reduced by 1 5dB for VBAT 2 8V 2 FCC channels 36 60 64 100 and 140 where harmonics sub harmonics of fall in the FCC restricted band have reduced output power to meet the FCC RSE requi...

Страница 50: ...odule 5 ms Tr and Tf Rise and fall times 20 µs 1 C W degrees Celsius per watt 2 These values are based on a JEDEC defined 2S2P system with the exception of the Theta JC RΘJC value which is based on a JEDEC defined 1S0P system and will change based on environment as well as application For more information see these EIA JEDEC standards JESD51 2 Integrated Circuits Thermal Test Method Environmental ...

Страница 51: ...ng Diagram Table 5 11 lists the timing requirements for the first time power up and reset removal Table 5 11 First Time Power Up and Reset Removal Timing Requirements ITEM NAME DESCRIPTION MIN TYP MAX UNIT T1 nReset time nReset timing after VBAT supplies are stable 1 ms T2 Hardware wake up time 25 ms T3 Time taken by ROM firmware to initialize hardware Includes internal 32 kHz XOSC settling time 1...

Страница 52: ...e than 24 hours have elapsed since a prior calibration 2 Wake up time can extend to 75 ms if a patch is downloaded from the serial Flash 5 18 4 Wake Up From Hibernate Timing Table 5 12 lists the software hibernate timing requirements NOTE The internal 32 768 kHz crystal is kept enabled by default when the module goes to hibernate Table 5 12 Software Hibernate Timing Requirements ITEM NAME DESCRIPT...

Страница 53: ...ule which can be configured as a master or slave device The SPI includes a serial clock with programmable frequency polarity and phase a programmable timing control between chip select and external clock generation and a programmable delay before the first SPI word is transmitted Slave mode does not include a dead cycle between two successive words Figure 5 8 shows the timing diagram for the SPI m...

Страница 54: ...3 3 V 5 18 5 1 2 SPI Slave Figure 5 9 shows the timing diagram for the SPI slave Figure 5 9 SPI Slave Timing Diagram Table 5 14 lists the timing parameters for the SPI slave Table 5 14 SPI Slave Timing Parameters ITEM NAME DESCRIPTION MIN MAX UNIT F 1 Clock frequency VBAT 3 3 V 20 MHz Clock frequency VBAT 2 3 V 12 T2 Tclk 1 Clock period 50 ns D 1 Duty cycle 45 55 T6 tIS 1 RX data setup time 4 ns T...

Страница 55: ...5 2 1 I2S Transmit Mode Figure 5 10 shows the timing diagram for the I2S transmit mode Figure 5 10 I2S Transmit Mode Timing Diagram Table 5 15 lists the timing parameters for the I2S transmit mode Table 5 15 I2S Transmit Mode Timing Parameters ITEM NAME DESCRIPTION MIN MAX UNIT T1 fclk 1 Clock frequency 9 216 MHz T2 tLP 1 Clock low period 1 2 fclk ns T3 tHT 1 Clock high period 1 2 fclk ns T4 tOH 1...

Страница 56: ...h 2 4 and 6 mA and open drain enable Figure 5 12 shows the GPIO timing diagram Figure 5 12 GPIO Timing Diagram Table 5 17 lists the GPIO output transition times for VBAT 2 3 V Table 5 17 GPIO Output Transition Times VBAT 2 3 V 1 2 DRIVE STRENGTH mA DRIVE STRENGTH CONTROL BITS Tr Tf UNIT MIN NOM MAX MIN NOM MAX 2 2MA_EN 1 11 7 13 9 16 3 11 5 13 9 16 7 ns 4MA_EN 0 4 2MA_EN 0 13 7 15 6 18 0 9 9 11 6 ...

Страница 57: ...rammed in this register 3 Because I2 C is an open drain interface the controller can drive logic 0 only Logic is the result of external pullup Rise time depends on the value of the external signal capacitance and external pullup register 5 18 5 4 I2 C The CC3235MODx MCU includes one I2C module operating with standard 100 kbps or fast 400 kbps transmission speeds Figure 5 13 shows the I2 C timing d...

Страница 58: ...l integrated circuits and provides a standardized serial interface to control the associated test logic For detailed information on the operation of the JTAG port and TAP controller see the IEEE Standard 1149 1 Test Access Port and Boundary Scan Architecture Figure 5 14 shows the JTAG timing diagram Figure 5 14 JTAG Timing Diagram Table 5 21 lists the JTAG timing parameters Table 5 21 JTAG Timing ...

Страница 59: ...EST CONDITIONS ASSUMPTIONS MIN TYP MAX UNIT Nbits Number of bits 12 Bits INL Integral nonlinearity Worst case deviation from histogram method over full scale not including first and last three LSB levels 2 5 2 5 LSB DNL Differential nonlinearity Worst case deviation of any step from ideal 1 4 LSB Input range 0 1 4 V Driving source impedance 100 Ω FCLK Clock rate Successive approximation input cloc...

Страница 60: ... data hold time 2 ns 5 18 5 8 UART The CC3235MODx MCU includes two UARTs with the following features Programmable baud rate generator allowing speeds up to 3 Mbps Separate 16 bit 8 bit TX and RX FIFOs to reduce CPU interrupt service loading Programmable FIFO length including a 1 byte deep operation providing conventional double buffered interface FIFO trigger levels of 1 8 1 4 1 2 3 4 and 7 8 Stan...

Страница 61: ...e in case of exceptions or to warn of end of operation The controller can be configured to generate DMA requests and work with minimum CPU intervention Given the nature of integration of this peripheral on the CC3235x platform TI recommends that developers use peripheral library APIs to control and operate the block This section emphasizes understanding the SD host APIs provided in the peripheral ...

Страница 62: ...o trigger µDMA transfers The GPTM contains four 16 or 32 bit GPTM blocks with the following functional options Operating modes 16 or 32 bit programmable one shot timer 16 or 32 bit programmable periodic timer 16 bit general purpose timer with an 8 bit prescaler 16 bit input edge count or time capture modes with an 8 bit prescaler 16 bit PWM mode with an 8 bit prescaler and software programmable ou...

Страница 63: ... CC3235MODS CC3235MODSF Detailed Description Copyright 2019 Texas Instruments Incorporated 6 Detailed Description 6 1 Overview The CC3235MODx MCU is a Dual Band Wi Fi internet on a chip modules that consists of an Arm Cortex M4 processor with a rich set of peripherals for diverse application requirements a Wi Fi network processor and power management subsystems 6 2 Functional Block Diagram Figure ...

Страница 64: ...ncludes the following features Bits of priority configurable from 3 to 8 Dynamic reprioritization of interrupts Priority grouping that enables selection of preempting interrupt levels and nonpreempting interrupt levels Support for tail chaining and late arrival of interrupts which enables back to back interrupt processing without the overhead of state saving and restoration between interrupts Proc...

Страница 65: ...lows automatic fast connection to an access point without user or host intervention Supports all common Wi Fi security modes for personal and enterprise networks with on chip security accelerators including WEP WPA WPA2 PSK WPA2 Enterprise 802 1x Smart provisioning options deeply integrated within the module providing a comprehensive end to end solution With elaborate events notification to the ho...

Страница 66: ...annels 2 4 GHz ISM and 5 GHz U NII Channels Channel Bandwidth 20 MHz Wi Fi security WEP WPA WPA2 PSK WPA2 enterprise 802 1x Wi Fi provisioning SmartConfig technology Wi Fi protected setup WPS2 AP mode with internal HTTP web server IP protocols IPv4 IPv6 IP addressing Static IP LLA DHCPv4 DHCPv6 with DAD Cross layer ARP ICMPv4 IGMP ICMPv6 MLD NDP Transport UDP TCP SSLv3 0 TLSv1 0 TLSv1 1 TLSv1 2 RA...

Страница 67: ...cking the surrounding RF environment 6 5 Security The SimpleLink Wi Fi CC3235MODx internet on a chip module enhances the security capabilities available for development of IoT devices while completely offloading these activities from the MCU to the networking subsystem The security capabilities include the following key features Wi Fi and Internet Security Personal and enterprise Wi Fi security Pe...

Страница 68: ..._MASK_TLS_ECDHE_ECDSA_WITH_AES_256_CBC_SHA SL_SEC_MASK_TLS_RSA_WITH_AES_128_GCM_SHA256 SL_SEC_MASK_TLS_RSA_WITH_AES_256_GCM_SHA384 SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_128_GCM_SHA256 SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_GCM_SHA384 SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256 SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384 SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_GCM_SHA256 SL_SEC_MASK_TLS_ECDHE...

Страница 69: ...n mechanism takes effect Encrypted and authenticated file system Secured boot Authentication of the application image on every boot Code and data encryption User application and data files are encrypted in sFlash Code and data authentication User Application and data files are authenticated with a public key certificate Offloaded crypto library for asymmetric keys including the ability to create k...

Страница 70: ...ate the differing voltage or current requirements of the system The CC3235MODx MCU is a fully integrated module based WLAN radio solution used on an embedded system with a wide voltage supply range The internal power management including DC DC converters and LDOs generates all of the voltages required for the module to operate from a wide variety of input sources For maximum flexibility the module...

Страница 71: ...ng the RTC The wake up time in this mode is longer than hibernate at about 1 1 s To enter or exit the shutdown mode the state of the nRESET line is changed low to shut down high to turn on The NWP can be active or in LPDS mode and takes care of its own mode transitions When there is no network activity the NWP sleeps most of the time and wakes up only for beacon reception see Table 6 3 Table 6 3 N...

Страница 72: ...ait state ROM of the CC3235MODx module is at address 0x0000 0000 of the device memory and is programmed with the following components Bootloader Peripheral driver library DriverLib release for product specific peripherals and interfaces The bootloader is used as an initial program loader when the serial Flash memory is empty The DriverLib software library of the CC3235MODx MCU controls on chip per...

Страница 73: ...General purpose timer A3 0x400F7000 0x400F 7FFF Configuration registers 0x400F E000 0x400F EFFF System control 0x400F F000 0x400F FFFF µDMA 0x4200 0000 0x43FF FFFF Bit band alias of 0x4000 0000 to 0x400F FFFF 0x4401 0000 0x4401 0FFF SDIO master 0x4401 8000 0x4401 8FFF Camera Interface 0x4401 C000 0x4401 DFFF McASP 0x4402 0000 0x4402 0FFF SSPI Used for external Serial Flash 0x4402 1000 0x4402 1FFF ...

Страница 74: ...ering up These values determine the boot flow as well as the default mapping for some of the pins JTAG SWD UART0 Table 6 5 lists the pull configurations All CC3235MODx MCUs contain internal pull down resistors on the SOP 2 0 lines The application can use SOP2 for other functions after chip has powered up However to avoid spurious SOP values from being sensed at power up TI strongly recommends usin...

Страница 75: ...ed for a single condition In total 16 condition and action pairs can be defined The conditions can be simple or complex using sub conditions using a combinatorial AND condition between them The actions are divided into two types those that can occur during runtime and those that can occur only during the initialization phase The following actions can only be performed when triggered by the pre ini...

Страница 76: ...60950 1 2006 A11 2009 A1 2010 A12 2011 A2 2013 MIC Japan Article 49 20 of ORRE 201 190033 In Process SRRC China EN300328 v1 7 1 CC3235MODASM2MON XXXXXXXXXX M In Process CC3235MODASF12MON XXXXXXXXXX M In Process 6 13 1 FCC Certification and Statement CAUTION FCC RF Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment End u...

Страница 77: ...e interference This device must accept any interference including interference that may cause undesired operation of the device Le présent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autorisée aux deux conditions suivantes L appareil ne doit pas produire de brouillage L utilisateur de l appareil doit accepter tout brouillag...

Страница 78: ...k CC3235MODx module Figure 6 3 CC3235MODS Module Marking Figure 6 4 CC3235MODSF Module Marking Table 6 7 lists the CC3235MODx module markings Table 6 7 Module Descriptions MARKING DESCRIPTION CC3235MODSM2MOB Model CC3235MODSF12MOB YMWLLLC LTC Lot Trace Code Y Year M Month WLLLC Reserved for internal use Z64 CC3235MOD FCC ID single modular FCC grant ID 451I CC3235MOD IC single modular IC grant ID X...

Страница 79: ...latory information and warnings as shown in this manual 7 Applications Implementation and Layout NOTE Information in the following applications sections is not part of the TI component specification and TI does not warrant its accuracy or completeness TI s customers are responsible for determining suitability of components for their purposes Customers should validate and test their design implemen...

Страница 80: ...work with the WLAN operating on either a 2 4 or a 5 GHz band Note in this implementation no Coex switch is required and only a single GPIO from the BLE device to the CC3235x device is required Figure 7 1 Dual Antenna Coexistence Mode Block Diagram 7 1 2 Antenna Selection The CC3235MODx device is designed to also support antenna selection and is controlled from Image Creator When enabled there are ...

Страница 81: ...out Copyright 2019 Texas Instruments Incorporated 3 The recommended Antenna switch is the Richwave RTC6608OSP Figure 7 2 shows the antenna selection implementation for Wi Fi with BLE operating on it s own antenna Note in this implementation only a single GPIO from the BLE device to the CC3235MODx device is required The Antenna switch 3 is controlled by 2 GPIO lines from the CC3235MODx device Table...

Страница 82: ...bug Pin 48 RS232_TX Pin 49 RS232_RX Pin 50 WLAN_LOG Pin 52 NWP_LOG SOP 2 0 USED TO CONFIGURE BOOT MODES TABLE 5 5 GND 1 2 E1 Matching circuit shown below is for the antenna The module is matched internally to 50 Final solution may require antenna matching optimization with a pi network 100uF C4 100uF C5 GND GND VBAT_CC Optional Consider adding extra decoupling capaci tors if the battery cannot sou...

Страница 83: ... Multilayer Air Core 4 7nH 0 7 A 0 16 Ω SMD 1 R1 10k Vishay Dale CRCW040210K0JNED RES 10 k 5 0 063 W AEC Q200 Grade 0 0402 1 CC1 CC3235MODSF Texas Instruments CC3235MODSF12MOBR SimpleLink Wi Fi and Internet of Things Module Solution a Single Chip Wireless Dual Band MCU MOB0063A 7 2 Device Connection and Layout Fundamentals 7 2 1 Power Supply Decoupling and Bulk Capacitors Depending upon routing re...

Страница 84: ...s described in this section to achieve similar performance to that obtained with the TI reference design 7 3 1 General Layout Recommendations Ensure that the following general layout recommendations are followed Have a solid ground plane and ground vias under the module for stable system and thermal dissipation Do not run signal traces underneath the module on a layer where the module is mounted 7...

Страница 85: ...ns for the CC3235MODx device RF traces must have 50 Ω impedance RF trace bends must be made with gradual curves and 90 bends must be avoided RF traces must not have sharp corners There must be no traces or ground under the antenna section RF traces must have via stitching on the ground plane beside the RF trace on both sides RF traces must be as short as possible The antenna RF traces and the modu...

Страница 86: ...ubmit Documentation Feedback Product Folder Links CC3235MODS CC3235MODSF Applications Implementation and Layout Copyright 2019 Texas Instruments Incorporated For optimal RF performance ensure the copper cut out on the top layer under the RF BG pin pin 31 is as shown in Figure 7 5 Figure 7 5 Top Layer Copper Pullback on RF Pads ...

Страница 87: ... PCB Ensure that the ground is cleared on inner layers as well 4 Ensure that there is provision to place matching components for the antenna These must be tuned for best return loss when the complete board is assembled Any plastics or casing must also be mounted while tuning the antenna because this can impact the impedance 5 Ensure that the antenna impedance is 50 Ω because the module is rated to...

Страница 88: ...nna using a Coplanar Waveguide with ground CPW G structure CPW G structure offers the maximum amount of isolation and the best possible shielding to the RF lines In addition to the ground on the L1 layer placing GND vias along the line also provides additional shielding Figure 7 6 shows a cross section of the coplanar waveguide with the critical dimensions Figure 7 7 shows the top view of the copl...

Страница 89: ...nts Incorporated The recommended values for the PCB are provided for 2 layer boards in Table 7 4 and 4 layer boards in Table 7 5 Table 7 4 Recommended PCB Values for 2 Layer Board L1 to L2 42 1 mils PARAMETER VALUE UNIT W 26 mils S 5 5 mils H 42 1 mils Er FR 4 substrate 4 2 F m Table 7 5 Recommended PCB Values for 4 Layer Board L1 to L2 16 mils PARAMETER VALUE UNITS W 21 mils S 10 mils H 16 mils E...

Страница 90: ...cards must be blue 30 8 4 PCB Assembly Guide The wireless MCU modules are packaged in a substrate base Leadless Quad Flatpack QFM package Components were mounted onto the substrate with standard SMT process with the additional of a metal lid covering the top of the module The module are designed with pull back leads for easy PCB layout and board mounting 8 4 1 PCB Land Pattern Thermal Vias We reco...

Страница 91: ...a package silhouette A vision system that locates individual pads on the interconnect pattern The second type renders more accurate placements but tends to be more expensive and time consuming Both methods are acceptable since the parts align due to a self centering features fo the solder joint during solder reflow It is recommended to release the package to 1 to 2 mils into the solder paste or wi...

Страница 92: ...re profile Reflow soldering will be done according to the temperature profile see Figure 8 1 Peak temperature 260 C Figure 8 1 Temperature Profile for Evaluation of Solder Heat Resistance of a Component at Solder Joint Table 8 1 Temperature Profile Profile Elements Convection or IR 1 Peak temperature range 235 to 240 C typical 260 C maximum Pre heat soaking 150 to 200 C 60 to 120 seconds Time abov...

Страница 93: ... that satisfies the entered requirements SimpleLink Wi Fi Starter Pro The supported devices are CC3100 CC3200 CC3120R CC3220x CC3135 and CC3235x The SimpleLink Wi Fi Starter Pro mobile App is a new mobile application for SimpleLink provisioning The app goes along with the embedded provisioning library and example that runs on the device side see SimpleLink Wi Fi SDK plugin and TI SimpleLink CC32XX...

Страница 94: ...ally setting the radio into transmit or receive modes Using the tool requires familiarity and knowledge of radio circuit theory and radio test methods Created for the internet of things IoT the SimpleLink Wi Fi CC31xx and CC32xx family of devices include on chip Wi Fi Internet and robust security protocols with no prior Wi Fi experience needed for faster development For more information on these d...

Страница 95: ...tools see Figure 9 1 To designate the stages in the product development cycle TI assigns prefixes to the part numbers of all microprocessors MPUs and support tools Each device has one of three prefixes X P or null no prefix for example CC3235MODx Texas Instruments recommends two of three possible prefix designators for its support tools TMDX and TMDS These prefixes represent evolutionary stages of...

Страница 96: ... without any processing burden on the main microcontroller MCU This document describes these security related features and provides recommendations for leveraging each in the context of practical system implementation SimpleLink CC3135 CC3235 Wi Fi and Internet of Things Over the Air Update This document describes the OTA library for the SimpleLink Wi Fi CC3x35 family of devices from Texas Instrum...

Страница 97: ...on presents the module or peripheral in a general sense Not all features and functions of all modules or peripherals may be present on all devices Pin functions internal signal connections and operational parameters differ from device to device The user should consult the device specific data sheet for these details SimpleLink Wi Fi and Internet on a chip CC3135 and CC3235 Solution Radio Tool The ...

Страница 98: ...Zigbee is a registered trademark of Zigbee Alliance Inc All other trademarks are the property of their respective owners 9 8 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD Texas Instruments recommends that all integrated circuits be handled with appropriate precautions Failure to observe proper handling and installation procedures can cause damage ESD damage can rang...

Страница 99: ...erable information This information is the most current data available for the designated devices This data is subject to change without notice and revision of this document 10 1 Mechanical Land and Solder Paste Drawings NOTE The total height of the module is 2 4 mm The weight of the CC3235MODx module is 1 8 g typical NOTE 1 All dimensions are in mm 2 Solder mask should be the same or 5 larger tha...

Страница 100: ...timony Sb based flame retardants Br or Sb do not exceed 0 1 by weight in homogeneous material space 3 MSL Peak Temp The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications and peak solder temperature space 4 There may be additional marking which relates to the logo the lot trace code information or the environmental category on the device space 5 Multiple Dev...

Страница 101: ...ODSF www ti com SWRS224A FEBRUARY 2019 REVISED AUGUST 2019 Submit Documentation Feedback Product Folder Links CC3235MODS CC3235MODSF Mechanical Packaging and Orderable Information Copyright 2019 Texas Instruments Incorporated 10 2 2 Tape and Reel Information ...

Страница 102: ...YYZZZZ M XXXXXXXXXX VVSS 102 CC3235MODS CC3235MODSF SWRS224A FEBRUARY 2019 REVISED AUGUST 2019 www ti com Submit Documentation Feedback Product Folder Links CC3235MODS CC3235MODSF Mechanical Packaging and Orderable Information Copyright 2019 Texas Instruments Incorporated 10 2 2 1 CC3235MODx Tape Specifications ...

Страница 103: ...16 28 43 QFM 2 4 mm max height MOB0063A QUAD FLAT MODULE 4221462 D 06 2019 NOTES 1 All linear dimensions are in millimeters Any dimensions in parenthesis are for reference only Dimensioning and tolerancing per ASME Y14 5M 2 This drawing is subject to change without notice AREA PIN 1 INDEX 0 1 X1 45 PIN 1 ID 1 2 15 16 17 27 28 29 42 43 44 54 55 57 58 60 63 61 0 15 C A B 0 05 C 56 59 62 SCALE 0 650 ...

Страница 104: ... 2019 NOTES continued 3 This package is designed to be soldered to a thermal pad on the board For more information see Texas Instruments literature number SLUA271 www ti com lit slua271 LAND PATTERN EXAMPLE SOLDER MASK DEFINED SCALE 6X PKG PKG SEE DETAIL 1 2 15 16 17 27 28 29 42 43 44 54 55 57 58 60 63 61 METAL UNDER SOLDER MASK SOLDER MASK OPENING 9X 45 X 1 56 59 62 SOLDER MASK OPENING METAL UNDE...

Страница 105: ...ued 4 Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release IPC 7525 may have alternate design recommendations PKG PKG 1 2 15 16 17 27 28 29 42 43 44 54 55 57 58 60 63 61 SOLDER PASTE EXAMPLE BASED ON 0 125 mm THICK STENCIL EXPOSED PADS PRINTED SOLDER COVERAGE BY AREA PAD 55 77 5 PADS 56 63 79 SCALE 6X SEE DETAILS 56 59 62 SOLDER MASK EDGE SOLDER MASK ED...

Страница 106: ...se resources are subject to change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and display of these resources is prohibited No license is granted to any other TI intellectual property right or to any third party intellectual property right TI disclaims responsibility for...

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