3.3
Testing Fuse-Blowing Circuit
4
Circuit Module Physical Layouts and Bill of Materials
4.1
Board Layout
Circuit Module Physical Layouts and Bill of Materials
www.ti.com
Table 2. Components and Flash-Memory Settings for Different Precharge
Modes
MODE
RESISTORS
PRECHG FET
ZVCHG1
ZVCHG0
1. 0-V Chg (default)
R21, R28
Q3
0
0
2. Common FET
R24
Q2
0
1
3. Precharge
R23, R28
Q3
1
0
For more details about precharge operation and mode choices, see the bq20z95 data sheet at
(
SLUS757
).
To prevent the loss of board functionality during the fuse-blowing test, the actual chemical fuse is not
provided in the circuit. FET Q4 drives TP3 low if a fuse-blow condition occurs; so, monitoring TP3 can be
used to test this condition. Fuse placement on the application board is shown in the bq20z95 data sheet
reference-board schematic.
This section contains the board layout, bill of materials, and assembly drawings for the bq20z95/bq29412
circuit module.
This section shows the dimensions, PCB layers (
Figure 1
through
Figure 5
), and assembly drawing for the
bq20z95 module.
Figure 1. bq20z95EVM-001 Layout (Silk Screen)
4
bq20z95EVM-001 SBS 1.1 Impedance Track™ Technology
SLUU275 – October 2006
Enabled Battery Management Solution Evaluation Module
Submit Documentation Feedback
