ME310G1 Hardware Design Guide
1VV0301588 Rev. 12
Page 92 of 96
2021-06-14
GLOSSARY
ADC
Analog – Digital Converter
BPSK
Modulation used for in OFDM symbols
CLK
Clock
CMOS
Complementary Metal – Oxide Semiconductor
CS
Chip Select
DAC
Digital – Analog Converter
DTE
Data Terminal Equipment
DVI
Digital Voice Interface
EM
Electromagnetic
EMC
Electromagnetic Compatibility
EMI
Electromagnetic Interference
ESR
Equivalent Series Resistance
FDD
Frequency Division Duplexing
GPIO
General Purpose Input Output
HS
High Speed
HSDPA
High Speed Downlink Packet Access
HSIC
High Speed Inter Chip
HSUPA
High Speed Uplink Packet Access
I/O
Input Output
LTE
Long Term Evolution
MISO
Master Input – Slave Output
MOSI
Master Output – Slave Input
MRDY
Master Ready
NAS
Non-Access Stratum
PCB
Printed Circuit Board
PSM
Power Saving Mode according to 3GPP Rel.12
QPSK
Modulation used for in OFDM symbols
Содержание ME310G1-W1
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