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ME310G1 Hardware Design Guide

1VV0301588 Rev. 12

Page 70 of 96

2021-06-14

PCB pad design

Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.

Figure 19: PCB solder pad recommendations

The recommendation for the PCB pads dimensions are 1:1 with module pads.

It is not recommended to place via or micro-via not covered by solder resist in an area of
0.3 mm around the pads unless it carries the same signal of the pad itself

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Finish

Layer Thickness (um)

Properties

Electro-less Ni /
Immersion Au

3 –7 / 0.03 – 0.15

good solder ability protection, high shear
force values

Table 40 Recommendations for PCB pad surfaces

The PCB must be able to resist the higher temperatures that occur during the lead-free
process. This issue should be discussed with the PCB-supplier. In general, the wettability
of tin-lead solder paste on the described surface plating is better than the lead-free
solder paste.

It is not necessary to panel the application’s PCB, however in that case it is recommended
to use milled contours and pre-drilled board breakouts; scoring or v-cut solutions are
not recommended.

PCB

Copper

Solder Mask

SMD

(Soler Mask Defined)

NSMD

(Non Solder Mask Defined)

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Содержание ME310G1-W1

Страница 1: ...ME310G1 HW Design Guide 1VV0301588 Rev 12 2021 06 14 Telit Technical Documentation...

Страница 2: ...ME310G1 Hardware Design Guide 1VV0301588 Rev 12 Page 2 of 96 2021 06 14 APPLICABILITY TABLE PRODUCTS ME310G1 W1 ME310G1 WW ME310G1 WWV ME310G1 W2 ME310G1 W3...

Страница 3: ...Symbol Conventions 10 Related documents 10 GENERAL PRODUCT DESCRIPTION 11 Overview 11 Product Variants and Frequency Bands 11 Target Market 13 Main features 13 TX Output Power 14 ME310G1 W1 14 ME310G...

Страница 4: ...2 ME310G1 W3 Connected Mode 32 General Design Rules 33 Electrical Design Guidelines 33 4 3 1 1 5V Source Power Supply Design Guidelines 33 4 3 1 2 12V Source Power Supply Design Guidelines 34 4 3 1 3...

Страница 5: ...1 48 5 7 3 3 Auxiliary Serial Port 48 General purpose I O 49 Using a GPIO as INPUT 49 Using a GPIO as OUTPUT 49 External SIM Holder 50 ADC Converter 50 Using ADC Converter 51 DAC Converter 51 Enabling...

Страница 6: ...active antenna 59 GNSS Characteristics 61 MECHANICAL DESIGN 62 Drawing 62 ME310G1 W1 62 ME310G1 WW ME310G1 WWV ME310G1 W2 and ME310G1 W3 63 APPLICATION PCB DESIGN 64 Footprint 64 ME310G1 W1 64 ME310G1...

Страница 7: ...gulatory notices Avis r glementaires de FCC et ISDE 81 FCC ISED Antennas FCC ISDE Antennes 82 FCC label and compliance information 84 ISED label and compliance information tiquette et informations de...

Страница 8: ...Design Guide 1VV0301588 Rev 12 Page 8 of 96 2021 06 14 Copyrighted Materials 89 High Risk Materials 89 Trademarks 90 3rd Party Rights 90 Waiver of Liability 90 Safety Recommendations 91 GLOSSARY 92 DO...

Страница 9: ...t for the proper development of the product with the Telit module Audience This document is intended for Telit customers in particular system integrators who are going to implement their applications...

Страница 10: ...e user on important steps about the module integration Note Tip Provides advice and suggestions that may be useful when integrating the module Electro static Discharge Notifies the user to take proper...

Страница 11: ...Frequency Bands Product HW Rev 2G Band MHz LTE CATM1 NBIoT CS Voice VoLTE External Antenna Tuner Support Region ME310G1 W1 0 0 B1 B2 B3 B4 B5 B8 B12 B13 B18 B19 B20 B25 B26 B27 B28 B66 B85 B8_39d B1 B...

Страница 12: ...mand contains the string B86 i e AT BNDOPTIONS BNDOPTIONS 1 2 3 4 5 8 12 13 18 19 20 25 26 27 28 66 71 85 86 Note B8_39d is not a 3GPP band it means the following U S FCC 900MHz that employs 39MHz dup...

Страница 13: ...icing Pay as you drive insurance Stolen vehicles tracking Internet connectivity Main features Function Features Modem CATM and NBIoT technologies SMS support text and PDU Alarm management Real Time Cl...

Страница 14: ...B19 B20 B25 B26 B28 B66 B71 B85 B8_39d LTE CAT NB1 5 21 Table 4 Transmission Output Power ME310G1 WW Band Mode Class RF power dBm Nominal 850 900MHz GPRS 4 32 5 EGPRS E2 27 1800 1900MHz GPRS 1 29 5 E...

Страница 15: ...e 6 Transmission Output Power ME310G1WW and ME310G1 WWW ME310G1 W2 Band Mode Class RF power dBm Nominal B1 B3 B8 B20 B28 LTE CAT M1 5 21 B1 B3 B8 B20 B28 LTE CAT NB2 5 21 B31 B72 LTE CAT M1 2 26 B31 B...

Страница 16: ...AT M1 Band12 103 2 99 3 CAT M1 Band13 104 3 99 3 CAT M1 Band18 107 2 102 3 CAT M1 Band19 106 5 102 3 CAT M1 Band20 105 4 99 8 CAT M1 Band25 107 5 CAT M1 Band26 107 1 100 3 CAT M1 Band27 107 1 100 8 CA...

Страница 17: ...nsitivity ME310G1 W1 3GPP TS 36 521 1 Release 15 Minimum performance requirement ME310G1 WW Band REFsens dBm Typical REFsens dBm 3GPP Limit CATM1 Band1 105 6 102 7 CAT M1 Band2 106 7 100 3 CAT M1 Band...

Страница 18: ...5 108 2 CAT NB2 Band18 115 8 108 2 CAT NB2 Band19 115 6 108 2 CAT NB2 Band20 114 7 108 2 CAT NB2 Band25 115 9 CAT NB2 Band26 115 7 108 2 CAT NB2 Band28 115 5 108 2 CAT NB2 Band66 115 2 108 2 CAT NB2...

Страница 19: ...105 4 96 6 Table 11 RX Sensitivity ME310G1 W2 3GPP TS 36 521 1 Release 15 Minimum performance requirement ME310G1 W3 Band REFsens dBm Typical REFsens dBm 3GPP Limit CAT M1 Band3 104 2 99 3 CAT M1 Band...

Страница 20: ...nominal weight of the ME310G1 W1 is 1gr The nominal weight of the ME310G1 WW ME310G1 WWV and ME310G1 W2 is 1 5 gr Temperature Range Temperature range Note Operating Temperature Range 40 C to 85 C The...

Страница 21: ...8V Y18 RTS0 I Input for Request to send signal RTS from DTE CMOS 1 8V Internal PU 100K AA17 CTS0 O Output for Clear to send signal CTS to DTE CMOS 1 8V Asynchronous Serial Port USIF1 Y12 TXD1 I Seria...

Страница 22: ...MOSI CMOS 1 8V Y8 SPI_MISO I O SPI MISO CMOS 1 8V AA7 SPI_CLK I O SPI Clock CMOS 1 8V Y6 SPI_CS I O SPI Chip Select CMOS 1 8V DIGITAL IO V11 IO1 I O Configurable GPIO01 CMOS 1 8V Internal PU DTR is al...

Страница 23: ...N16 ON_OFF WAKE I Input Command for Power ON OFF and to wake from deep sleep mode CMOS 1 8V Active Low R1 PWRMON O Power ON Monitor CMOS 1 8V T2 FORCED_USB_BOOT I Optional pin connect to test CMOS 1...

Страница 24: ...D RF Ground Power B4 GND RF Ground Power B6 GND RF Ground Power B10 GND RF Ground Power B12 GND RF Ground Power B14 GND RF Ground Power B16 GND RF Ground Power C19 GND RF Ground Power D18 GND RF Groun...

Страница 25: ...H2 RESERVED RESERVED Only in HW 0 0 J1 RESERVED RESERVED Only in HW 0 0 K2 RESERVED RESERVED J4 RESERVED RESERVED G4 RESERVED RESERVED L19 RESERVED RESERVED A11 RESERVED RESERVED R4 RESERVED RESERVED...

Страница 26: ...ME310G1 Hardware Design Guide 1VV0301588 Rev 12 Page 26 of 96 2021 06 14 Warning C104 RXD1 cannot have any PU or HIGH state during BOOTING UP phase...

Страница 27: ...ATV RES RES GND J K RES GND K L SIM_C LK RES RES RES L M SIM_R ST GND M N SIM_D AT CTANK ON_OF F WA KE GND N P SIM_V CC GND GND RES P R PWRM ON RES DAC RES R T FORCE D_USB_ BOOT GND GND USB_V BUS T U...

Страница 28: ...BATT VBATT_PA signals and must fulfil the following requirements Power Supply Value Nominal Supply Voltage 3 8V Operating Voltage Range 3 2 V 4 2 V Extended Voltange Range 2 6 V 4 5 V VBATTmin 2 7V Ta...

Страница 29: ...Voltage Range Power Consumption Idle mode Table 16 Idle and PSM mode 1 PSM in between eDRX Mode Measure Typical Mode Description IDLE mode CATM mA NBIoT mA 2G mA AT CFUN 1 8 1 8 0 8 0 Normal mode full...

Страница 30: ...d Mode Table 18 ME310G1 W1 connected mode Mode Measure Typical Mode Description GPS mA Active State GNSS ON CFUN 4 Acquisition 69 3 GPS GLO DPO off Navigation 22 GPS GLO DPO on DWELL 280ms 55 9 GPS GL...

Страница 31: ...0dBm Band 71 600 1000 3 75KHz subcarrier spacing 1 SC RU 32ms TBS 0 BPSK 23dBm Band 85 28 12 500 850 3 75KHz subcarrier spacing 1 SC RU 32ms TBS 0 BPSK 23dBm Band 13 26 5 18 19 20 8 430 750 3 75KHz su...

Страница 32: ...dBm B31 B72 NBIoT 245 340 3 75KHz subcarrier spacing 1 SC RU 32ms TBS 0 BPSK 21dBm B1 B3 B8 B20 B28 430 750 3 75KHz subcarrier spacing 1 SC RU 32ms TBS 0 BPSK 23dBm B31 B72 65 290 15KHz subcarrier spa...

Страница 33: ...pically automotive Battery 4 3 1 1 5V Source Power Supply Design Guidelines The desired output for the power supply is 3 8V so there s not a big difference between the input source and the desired out...

Страница 34: ...ator is preferable due to its smaller inductor size and its faster transient response This allows the regulator to respond quickly to the current peaks absorption In any case the frequency and Switchi...

Страница 35: ...power to the Telit ME310G1 module A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks a 100 F tantalum capacitor is usually suited Make sure t...

Страница 36: ...an even decrease the power supply performance The Bypass low ESR capacitor must be placed close to the Telit ME310G1 power input pads or if the power supply is a switching type it can be placed close...

Страница 37: ...cables The insertion of the EMI filter on the VBATT pins is suggested in those designs where the antenna is placed close to battery or power supply lines A ferrite bead like Murata BLM18EG101TN1 or Ta...

Страница 38: ...put Current MUST never be exceeded care must be taken when designing the application section to avoid an excessive current consumption If the Current exceeds the limits it may cause a module shutdown...

Страница 39: ...tched ON and AT commands can be processed with some latency ME310G1 is idle with low current consumption Deep sleep mode state PSM defined in 3GPP Release 12 Baseband is switched OFF most of the time...

Страница 40: ...14 Power On The following flow chart shows the proper Modem Turn ON procedure Figure 5 Modem On Proc flow chart Modem ON Proc START VBATT VBATTmin ON_OFF LOW PWRMON ON Delay 5 sec ON_OFF HIGH PWRMON...

Страница 41: ...To perform an unconditional shutdown it is necessary to send AT SYSHALT command and then cut Vbatt Power Off The proper procedure to power off the module is to use the AT SHDN command An alternative...

Страница 42: ...the procedure is completed the ME310G1 is reset and it stops any operation After the release of the line the ME310G1 is unconditionally shut down without performing any detach operation from the netwo...

Страница 43: ...e Asynchronous event controlled by host can wake up from deep sleep modeby asserting ON_OFF WAKE pinLOW for at least 5 seconds Host can detect deep sleep mode by polling PWRMON pin if PSM has been pre...

Страница 44: ...by configuration of any GPIO HI level to LOW level transition of GPIO triggers fast power down procedure Example circuit Fast shut down by software The Fast Shut Down can be triggered by AT command N...

Страница 45: ...S input voltage range and input current are Table 24 Voltage range Table 25 Input current SPI The ME310G1 Module is provided by a standard 3 wire SPI master or slave interface with chip select control...

Страница 46: ...al Asynchronous Receive Transmit microcontroller UART 5V or other voltages different from 1 8V Depending on the type of serial port on the OEM hardware a level translator circuit may be needed to make...

Страница 47: ...incoming call condition Table 27 Available signs Alternate function with GPIO refer to par General Purpose I O Note According to V 24 some signal names are referred to the application side therefore...

Страница 48: ...up default during ON state 5 GND A3 A7 A9 A13 A17 B4 B6 B10 B12 B14 B16 C19 D18 F8 F12 F18 G19 H6 H14 J19 K18 M18 N19 P6 P14 T8 T12 U1 V2 W19 Y2 Y4 Ground Ground 8 C106 CTS1 Y14 Clear to Send Output...

Страница 49: ...V13 GPIO_02 I O 1 mA INPUT PD 100K Alternate function RING D7 GPIO_03 I O 1 mA INPUT PD 100K D9 GPIO_04 I O 1 mA INPUT PD 100K D11 GPIO_05 I O 1 mA INPUT PD 100K D13 GPIO_06 I O 1 mA INPUT PD 100K Tab...

Страница 50: ...the sim holder SIM detection can be configured by a specific AT Command Refer to the SW User Guide or the AT Commands Reference Guide for the full description of this function Figure 8 SIM Holder sch...

Страница 51: ...cases described in the ME310G1 documentation The internal supply domain named CTANK is available on pin N4 of the ME310G1 The user s application circuit should add a place holder capacitor of 100uF 4V...

Страница 52: ...to AT command AT ATUNERSEL AT Commands Reference Guide Telit code 80617ST10991A to select GPIO or MIPI interfaces on ATC1 ATC2 pins GPIO ATC1 Pin ATC2 Pin Band Uplink Freq Range MHz 0 0 B1 B2 B3 B4 B2...

Страница 53: ...a for that those band s Bandwidth 250 MHz in LTE Band 1 140 MHz in LTE Band 2 PCS1900 170 MHz in LTE Band 3 DCS1800 445 MHz in LTE Band 4 70 MHz in LTE Band 5 GSM850 80 MHz in LTE Band 8 GSM900 47 MHz...

Страница 54: ...eanders and abrupt curves any kind of suitable geometry structure Microstrip Stripline Coplanar Grounded Coplanar Waveguide can be used to implement the printed transmission line afferent the antenna...

Страница 55: ...are of the shielding of the antenna line by burying it in an inner layer of PCB and surrounding it with the Ground planes or shield it with a metal frame cover if the noisy EM devices are not present...

Страница 56: ...liant codecs in case an analog audio is needed The audio port is available only in ME310G1 WWV that has CS Voice VoLTE support Electrical Characteristics The product is providing the DVI on the follow...

Страница 57: ...n low noise amplifier must be used and must be supplied with an proper bias tee circuit Guidelines of PCB line for GNSS Antenna Ensure that the antenna line impedance is 50ohm Keep the antenna line on...

Страница 58: ...ule use a strip line on the superficial copper layer for the antenna line The line attenuation will be lower than a buried one Hardware based solution for GNSS and LTE coexistence When a stand alone G...

Страница 59: ...structions to obtain the maximum performance of the GNSS receiver The antenna location must be carefully evaluated if operating in conjunction with any other antenna or transmitter The antenna must no...

Страница 60: ...able 38 GPS_LNA_EN signal characteristics Example of external antenna bias circuitry Figure 10 Antenna bias circuitry example Pay attention to the maximum bias current in case of unwanted short circui...

Страница 61: ...istics and expected performance Table 39 GNSS Characteristics Parameters Typical Measurement Notes Sensitivity Tracking Sensitivity 159 dBm Navigation 155 dBm Cold Start 144 dBm TTFF Hot N A It will b...

Страница 62: ...Guide 1VV0301588 Rev 12 Page 62 of 96 2021 06 14 MECHANICAL DESIGN Drawing ME310G1 W1 Figure 11 Mechanical Drawing ME310G1 W1 Note Dimensions in mm General Tolerance 0 1 Angular Tolerance 1 The toler...

Страница 63: ...ME310G1 Hardware Design Guide 1VV0301588 Rev 12 Page 63 of 96 2021 06 14 ME310G1 WW ME310G1 WWV ME310G1 W2 and ME310G1 W3 Figure 12 Mechanical Drawing ME310G1 WW ME310G1 WWV ME310G1 W2 and ME310G1 W3...

Страница 64: ...88 Rev 12 Page 64 of 96 2021 06 14 APPLICATION PCB DESIGN The ME310G1 modules have been designed in order to be compliant with a standard lead free SMT process Footprint ME310G1 W1 COPPER PATTERN top...

Страница 65: ...ME310G1 Hardware Design Guide 1VV0301588 Rev 12 Page 65 of 96 2021 06 14 SOLDER RESIST PATTERN top view Figure 14 Solder resist pattern top view...

Страница 66: ...ME310G1 Hardware Design Guide 1VV0301588 Rev 12 Page 66 of 96 2021 06 14 ME310G1 WW ME310G1 WWV ME310G1 W2 and ME310G1 W3 COPPER PATTERN top view Figure 15 Example Figure...

Страница 67: ...ME310G1 Hardware Design Guide 1VV0301588 Rev 12 Page 67 of 96 2021 06 14 SOLDER RESIST PATTERN top view Figure 16 Example Figure...

Страница 68: ...n the application a 2 mm placement inhibit area around the module It is also suggested as a common rule for an SMT component to avoid having a mechanical part of the application in direct contact with...

Страница 69: ...nsider the application placement inhibit area around the module as specified in the below figure It is also suggested as common rule for an SMT component to avoid having a mechanical part of the appli...

Страница 70: ...PCB pad surfaces Finish Layer Thickness um Properties Electro less Ni Immersion Au 3 7 0 03 0 15 good solder ability protection high shear force values Table 40 Recommendations for PCB pad surfaces Th...

Страница 71: ...clean solder paste to avoid the cleaning of the modules after assembly Solder Reflow Recommended solder reflow profile Figure 20 Recommended Solder reflow profile Warning The aforementioned solder re...

Страница 72: ...0 30 seconds Ramp down Rate 6 C second max Time 25 C to Peak Temperature 8 minutes max Table 42 Profile feature recommendations Note All temperatures refer to topside of the package measured on the pa...

Страница 73: ...ME310G1 Hardware Design Guide 1VV0301588 Rev 12 Page 73 of 96 2021 06 14 PACKAGING Tray ME310G1 W1 Figure 21 ME310G1 W1 tray packaging...

Страница 74: ...ME310G1 Hardware Design Guide 1VV0301588 Rev 12 Page 74 of 96 2021 06 14 Figure 22 ME310G1 W1 tray...

Страница 75: ...ME310G1 Hardware Design Guide 1VV0301588 Rev 12 Page 75 of 96 2021 06 14 ME310G1 WW ME310G1 W2 and ME310G1 W3 Figure 23 ME310G1 WW tray packaging...

Страница 76: ...ME310G1 Hardware Design Guide 1VV0301588 Rev 12 Page 76 of 96 2021 06 14 Figure 24 ME310G1 WW tray...

Страница 77: ...ME310G1 Hardware Design Guide 1VV0301588 Rev 12 Page 77 of 96 2021 06 14 Reel ME310G1 W1...

Страница 78: ...ME310G1 Hardware Design Guide 1VV0301588 Rev 12 Page 78 of 96 2021 06 14 ME310G1 WW ME310G1 W2 and ME310G1 W3...

Страница 79: ...ME310G1 WWV and ME310G1 W2 Modules are in compliance with Directive 2014 53 EU The full text of the EU declaration of conformity is available at the following internet address http www telit com red...

Страница 80: ...3 14 33 11 33 11 33 13 8 FDD 8 11 45 8 45 8 45 10 7 FDD 20 11 20 8 20 8 20 11 2 FDD 28 10 47 7 47 7 47 10 7 FDD 31 2 5 FDD 72 2 5 Table 45 Max Gain for RED FCC and ISED approval FCC et ISDE approbatio...

Страница 81: ...complies with Part 15 of the FCC Rules and Industry Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device...

Страница 82: ...cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radi...

Страница 83: ...11 4 FDD 85 11 6 8 6 8 6 FDD 86 12 1 FDD 8_39d 11 9 8 9 Table 48 Max Gain for FCC dBi ISED ISDE This radio transmitter has been approved by ISED to operate with the antenna types listed below with th...

Страница 84: ...1 FDD 12 8 6 5 6 5 6 FDD 13 8 9 5 9 5 9 FDD 25 11 0 8 0 8 0 FDD 26 9 0 6 0 6 0 FDD 66 8 0 5 0 5 0 FDD 71 8 4 8 4 8 4 FDD 85 8 6 5 6 5 6 Table 50 Gain maximum for ISED dBi FCC label and compliance info...

Страница 85: ...llows Contains IC XXXXXX YYYYYYYYYYY In this case XXXXXX YYYYYYYYYYY is the module s certification number Le produit h te devra tre correctement tiquet de fa on permettre l identification des modules...

Страница 86: ...e des tests suppl mentaires peuvent tre n cessaires colocalisation retesting Si ce module est destin tre utilis dans un appareil portable vous tes responsable de l approbation s par e pour satisfaire...

Страница 87: ...t harmful interference and must not cause interference in duly authorized systems ME910G1 WW ME310G1 WW ML865G1 WW Homologation 08566 20 02618 NCC Regulatory Notices According to NCC Taiwan requiremen...

Страница 88: ...that Telit intends to announce such Telit products programming or services in your country Copyrights This instruction manual and the Telit products described herein may include or describe Telit s c...

Страница 89: ...ed by Telit and its licensors It is furnished by express license agreement only and shall be used exclusively in accordance with the terms of such agreement Copyrighted Materials The Software and the...

Страница 90: ...RPOSE NO 3RD PARTY LICENSORS OF OTHER CODES MUST BE LIABLE FOR ANY DIRECT INDIRECT INCIDENTAL SPECIAL EXEMPLARY OR CONSEQUENTIAL DAMAGES INCLUDING WITHOUT LIMITATION LOST OF PROFITS HOWEVER CAUSED AND...

Страница 91: ...or its use Do not insert or remove the SIM when the product is in power saving mode The system integrator is responsible for the functioning of the final product Therefore the external components of t...

Страница 92: ...romagnetic Compatibility EMI Electromagnetic Interference ESR Equivalent Series Resistance FDD Frequency Division Duplexing GPIO General Purpose Input Output HS High Speed HSDPA High Speed Downlink Pa...

Страница 93: ...l Time Clock RU Resource Unit NB IoT Only the time reported is the length for the specific configuration SC SC Spacing SC Sub Carriers indicates the number of Sub Carriers used SIM Subscriber Identifi...

Страница 94: ...te 8 2020 09 14 Added ME310G1 W2 variant Section 2 5 TX Power update Section 2 8 Temperature ranges update Section 5 2 Power on timing change back to 5sec 7 2020 07 22 Conformity assessment update wit...

Страница 95: ...W inhibit area reccomandation Extended Voltange Range lower limit change 2 2019 08 13 Added ME310G1 WW Update of Temperature range table N16 pin update ON_OFF WAKE ON OFF procedure updated 1 2019 06 1...

Страница 96: ......

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