Telit Wireless Solutions LE915A P Series Скачать руководство пользователя страница 37 | Manualshive

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Telit Wireless Solutions LE915A P Series Скачать руководство пользователя страница 37

LE915Ax-P

Hardware Design Guide

1VV0301680 Rev. 2

Page 37 of 51

2021-10-04

Not Subject to NDA

Inspection

An inspection of the solder joint between the solder pads of the Telit module and the
application PCB should be performed. The best visual inspection tool for inspection of the
Telit module solder joints on the PCB is a transmission X-ray, which can identify defects
such as solder bridging, shorts, opens, and large voids (Note: small voids in large solder
joints are not detrimental to the reliability of the solder joint).

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Содержание LE915A P Series

Страница 1: ...LE915Ax P HW Design Guide 1VV0301680 Rev 2 2021 10 04 Telit Technical Documentation...

Страница 2: ...LE915Ax P Hardware Design Guide 1VV0301680 Rev 2 Page 2 of 51 2021 10 04 Not Subject to NDA APPLICABILITY TABLE PRODUCTS LE915A6 P LE915A4 P...

Страница 3: ...Cellular Frequency Bands and CA Combinations 8 2 2 1 Frequency Bands 8 2 2 2 Carrier Aggregation LE915A6 P only 8 Target Market 8 Main Features 9 TX Output Power 9 RX Sensitivity 9 Mechanical Specifi...

Страница 4: ...USB 2 0 Interface 22 5 2 2 UART Interfaces 23 5 2 2 1 RS232 Level Translation 25 General Purpose I O 26 LED Indication 27 External SIM Holder 27 Reserved Pins 28 6 RF SECTION 29 Antenna Requirements 2...

Страница 5: ...TY INFORMATION 45 Copyrights and Other Notices 45 11 1 1 Copyrights 45 11 1 2 Computer Software Copyrights 45 Usage and Disclosure Restrictions 46 11 2 1 License Agreements 46 11 2 2 Copyrighted Mater...

Страница 6: ...dules Information The Integration of LTE CBRS LE915Ax P cellular modules in single mode within a user application must be performed according to the design rules described in this manual The informati...

Страница 7: ...astrophic equipment failure or personal injury may occur Warning Alerts the user on important steps about the module integration Note Tip Provides advice and suggestions that may be useful when integr...

Страница 8: ...RA Band Freq MHz UL DL Frequency MHz Duplex Mode 42 3500 3400 3600 TDD 43 3700 3600 3800 TDD 48 3500 3550 3700 TDD Table 2 Frequency bands supported 2 2 2 Carrier Aggregation LE915A6 P only Following...

Страница 9: ...eed UARTs w o flow control Cellular technology LE915A6 P LTE CAT 6 TDD 200Mbps on DL 3GPP release 10 LE915A4 P LTE CAT 4 TDD 100Mbps on DL 3GPP release 9 Diversity 2nd RX 4G all operating on all suppo...

Страница 10: ...m Width 29 mm Thickness 2 4 mm 2 7 2 Weight The nominal weight of the LE915Ax P family is 5 1 grams Temperature Range Tempeurature Range Note Recommended Operating Temperature Range 3GPP compliant 30...

Страница 11: ...end to DTE 1 8V UART2 21 UART0_SIN I Serial data input from DTE 1 8V UART0 22 UART0_SOUT O Serial data output to DTE 1 8V UART0 119 UART1_SIN I Serial data input from DTE 1 8V UART1 131 UART1_SOUT O S...

Страница 12: ...or debugging 122 TDI I Reserved JTAG for debugging 133 TCK I Reserved JTAG for debugging 134 TDO O Reserved JTAG for debugging Power Supply 59 VBAT1 Main power supply Baseband 3 8V nominal Power 60 VB...

Страница 13: ...r 93 GND Ground Power 94 GND Ground Power 95 GND Ground Power 96 GND Ground Power 97 GND Ground Power 98 GND Ground Power 99 GND Ground Power 100 GND Ground Power 101 GND Ground Power 102 GND Ground P...

Страница 14: ...RESERVED 9 RESERVED RESERVED 14 RESERVED RESERVED 15 RESERVED RESERVED 16 RESERVED RESERVED 17 RESERVED RESERVED 19 RESERVED RESERVED 20 RESERVED RESERVED 27 RESERVED RESERVED 28 RESERVED RESERVED 30...

Страница 15: ...ERVED RESERVED 47 RESERVED RESERVED 48 RESERVED RESERVED 49 RESERVED RESERVED 50 RESERVED RESERVED 51 RESERVED RESERVED 52 RESERVED RESERVED 53 RESERVED RESERVED 54 RESERVED RESERVED 55 RESERVED RESER...

Страница 16: ...tage 3 8V Operating Voltage Range 3 3 V 4 4 V Maximum ripple on module input supply 30mV Table 9 Power Supply Requirements The minimum operating voltage acceptable for LE915Ax P is 3 3 V Special care...

Страница 17: ...ply Design Guidelines The desired output for the power supply is 3 8V so there s not a big difference between the input source and the desired output and a linear regulator can be used A switching pow...

Страница 18: ...cover with a thermal interface material and making an air flow mechanism for cooling down the heat is also highly recommended Applying a cooling down system in the customer application design is much...

Страница 19: ...MI due to switching it is important to keep the mesh involved very small therefore the input capacitor the output diode if not embodied in the IC and the regulator must form a very small loop This is...

Страница 20: ...LE915Ax P Hardware Design Guide 1VV0301680 Rev 2 Page 20 of 51 2021 10 04 Not Subject to NDA Figure 2 Recommended Circuit of EMI filter...

Страница 21: ...y VBAT1 and VBAT2 Step 2 Wait until the VBAT1 and VBAT2 power supply are stable enough as over than 3 3V minimum operating voltage Step 3 Set RESET_N port to HIGH Step 4 Wait until the URC SYSSTART is...

Страница 22: ...ly routed Trace lengths channel number and capacitive loading should be minimized The characteristic impedance value should be as close as possible to the 90 Ohms differential ESD protection can be ad...

Страница 23: ...ARTs up to 115200bps without flow control Table 14 UART interfaces Several configurations can be designed for the serial port on the OEM hardware but the most common are RS232 PC com port microcontrol...

Страница 24: ...re CMOS 1 8V Note When UART signals are used as the communication port between the host and the modem and flow control is not used UART2_CTS line must set to logical LOW If the UART port is not used a...

Страница 25: ...rface without HW flow control 5 2 2 1 RS232 Level Translation Depending on the serial port type on the application side a level translator circuit may be required The nominal voltage level of the UART...

Страница 26: ...transducer on the side of the module that is LE915Ax P inputs will damage the inputs of the module if the level translator is also powered with nominal power of 3 8V Therefore the IC of the level tran...

Страница 27: ...t below Table 16 LED indication Figure 8 LED Indicator Reference Schematic External SIM Holder LE915Ax P modules support single SIM interface On the application side a pull up resistor needs to be con...

Страница 28: ...void floating and to ensure that the SIM is always detected as present A typical interface circuit is shown below It is recommended to keep the traces between the module and the SIM holder as short as...

Страница 29: ...na and Transmission line requirement 6 1 1 PCB Design Guidelines When using the LE915Ax P family since there s no antenna connector on the module the antenna must be connected to the LE915Ax P antenna...

Страница 30: ...mission line footprint with other signal tracks on different layers the ground surrounding the antenna line on the PCB must be tightly connected to the main Ground Plane through holes at east once eve...

Страница 31: ...TanD 0 019 0 026 1 GHz A characteristic impedance of nearly 50 is achieved using a track width 1 1 mm clearance from a coplanar ground plane 0 3 mm each side The line uses the reference ground plane...

Страница 32: ...t of line under test is shown below Figure 11 Return Loss plot of line under test The input impedance of the line in Smith Chart format once the line has been terminated to 50 load is shown in the fol...

Страница 33: ...perturb the radiation pattern described in the documentation of the Antenna manufacturer It is preferable to get an omnidirectional radiation pattern The Antenna Gain must not exceed the values indica...

Страница 34: ...LE915Ax P Hardware Design Guide 1VV0301680 Rev 2 Page 34 of 51 2021 10 04 Not Subject to NDA 7 MECHANICAL DESIGN Drawing Figure 14 Mechanical Design Drawing...

Страница 35: ...ads the solder mask opening is larger than the metal pad and does not overlap the metal The metal edge defines the solderable area of the pad see Figure below Since the metal etching process in PCB ma...

Страница 36: ...p up Rate 3 0 2 C second Ramp down Rate 2 0 1 C second Table 21 Profile Feature Recommendations Note All temperatures refer to topside of the package measured on the package body surface Warning THE L...

Страница 37: ...s of the Telit module and the application PCB should be performed The best visual inspection tool for inspection of the Telit module solder joints on the PCB is a transmission X ray which can identify...

Страница 38: ...NDA 9 PACKAGING Reel The LE915Ax P is delivered in Tape and Reel One reel can hold up to 500 pieces Each reel is included in a box and a carton can contain five boxes hence up to 2500 pieces Figure 1...

Страница 39: ...tail Figure 19 Packaging Detail Moisture Sensitivity The LE915Ax P family is a Moisture Sensitive Device level 3 in accordance with the IPC JEDEC J STD 020 standard takes care all related requirements...

Страница 40: ...ondition during the production 30 C 60 RH according to IPC JEDEC J STD 033A paragraph 5 c The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b...

Страница 41: ...munications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be...

Страница 42: ...ile RF exposure use condition Any other condition of use such as co location with other transmitter s or use in portable conditions will require a separate re evalutatio through a class II permissive...

Страница 43: ...subsystem and its certification does not cover the FCC Part 15 Subpart B unintentional radiator rule requirement applicable to the final host The final host will still need to be reassessed for compli...

Страница 44: ...ce The final product must be reassessed against all FCC essential requirements such as FCC Part 15 Subpart B before it can be placed on the US market This includes reassessing the transmitter module f...

Страница 45: ...necessarily mean that Telit intends to announce such Telit products programming or services in your country 11 1 1 Copyrights This instruction manual and the Telit products described herein may includ...

Страница 46: ...is document is owned by Telit and its licensors It is furnished by express license agreement only and shall be used exclusively in accordance with the terms of such agreement 11 2 2 Copyrighted Materi...

Страница 47: ...FOR A PARTICULAR PURPOSE NO THIRD PARTY LICENSORS OF OTHER CODES MUST BE LIABLE FOR ANY DIRECT INDIRECT INCIDENTAL SPECIAL EXEMPLARY OR CONSEQUENTIAL DAMAGES INCLUDING WITHOUT LIMITATION LOST OF PROFI...

Страница 48: ...truction for its use Do not insert or remove the SIM when the product is in power saving mode The system integrator is responsible for the functioning of the final product Therefore the external compo...

Страница 49: ...k ESD Electrostatic Discharge ESR Equivalent Series Resistance E UTRA Evolved Universal Terrestrial Radio Access LCC Leadless Chip Carrier LTE Long Term Evolution M2M Machine to machine POS Point of S...

Страница 50: ...09 24 Temperature range updated UART diagram updated Added GPIOs related description Max data rate described in the USB and UART interfaces Description changes on LED indication Updated the decriptio...

Страница 51: ......

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