LE915Ax-P
Hardware Design Guide
1VV0301680 Rev. 2
Page 18 of 51
2021-10-04
Not Subject to NDA
Figure 1: An Example of Linear Regulator with 5V Input
4.4.2.
Thermal Design Guidelines
Thermal dispersion needs to be carefully considered in entire customer device design.
The power supply heat sink must be dimensioned according to the following guidelines:
•
Opening a large ground plane as wider as Telit module size and to add a thermal
interface material tightly touched between the bottom side of Telit module and the
customer board is a mandatory.
•
Adding a heat sink on top of the shield cover with a thermal interface material and
making an air flow mechanism for cooling down the heat is also highly
recommended.
•
Applying a cooling down system in the customer application design is much better
as an option.
The body of the Telit module must be connected to the ground plane and/or metal chassis
of the host board for better radio performance and thermal dissipation.
4.4.3.
Power Supply PCB Layout Guidelines
As seen in the for electrical design guidelines, to protect the supply from spikes, the
power supply shall have a low ESR capacitor on the output to cut the current peaks on
the input. The placement of this component is essential for the correct functioning of the
circuitry. A misplaced component can be useless or even decrease the performance of
the power supply..
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