GE864-QUAD V2 Hardware User Guide
1vv0300841 Rev.5
–
2017-05-11
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights
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Page 70 of 77
Holes in pad are allowed only for blind holes and not for
through holes.
Recommendations for PCB pad surfaces:
Finish
Layer
thickness
[µm]
Properties
Electro-less
Ni /
Immersion Au
3
–
7 /
0.05
–
0.15
good solder ability
protection,
high shear force
values
The PCB must be able to resist the higher temperatures which
are occurring at the lead-free process. This issue should be
discussed with the PCB-supplier. Generally, the wettability of
tin-lead solder paste on the described surface plating is
better compared to lead-free solder paste.
13.4.
Solder paste
Lead free
Solder paste
Sn/Ag/Cu
It is recommended to
use only “no clean” solder paste in
order to avoid the cleaning of the modules after assembly.