GE864-QUAD V2 Hardware User Guide
1vv0300841 Rev.5
–
2017-05-11
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights
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Page 69 of 77
13.2.
Stencil
Stencil apertures layout can be the same of the recommended
footprint (1:1), we suggest a thickness of stencil foil >120µm.
13.3.
PCB pad design
Non solder mask defined” (NSMD) type is recommended for the
solder pads on the PCB.
Recommendations for PCB pad dimensions
Ball pitch [mm]
2,4
Solder
resist
opening
diameter A [mm]
1,150
Metal pad diameter B [mm]
1 ± 0.05
It is recommended no microvia without solder resist cover
under the module and no microvia around the pads (see
following figure).