INSTRUCTION MANUAL
CCG
TDKLambda
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82. Recommended Soldering Condition
Recommended soldering conditions are as follows.
(1) Soldering Dip
Dip condition
:
260ºC within 10 seconds
Preheat condition : 110ºC for 30
–
40 seconds
(2) Soldering Iron
350ºC within 3 seconds
Note) Soldering time changes according to heat capacity of soldering iron, pattern on printed circuit board
etc. Please confirm actual performance.
83. Recommended Cleaning Condition
Recommended cleaning condition after soldering is as follows.
(1) Cleaning Solvent
IPA (isopropyl alcohol)
(2) Cleaning Procedure
Use brush and dry the solvent completely before use.