20030120
3-3-1
T7401EL
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
#
have special characteristics important to safety.
Before replacing any of these components, read care-
fully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTES:
1.
Parts that are not assigned part numbers (---------)
are not available.
2.
Tolerance of Capacitors and Resistors are noted
with the following symbols.
MMA CBA
MAIN CBA
C.....±0.25%
D.....±0.5%
F.....±1%
G.....±2%
J......±5%
K.....±10%
M.....±20%
N.....±30%
Z.....+80/-20%
Ref. No.
Description
Part No.
MMA CBA
0ESA05151
Consists of the following
MAIN CBA
CRT CBA
SENSOR CBA
------------
------------
0ESA04524
Ref. No.
Description
Part No.
MAIN
CBA
Consists of the following
------------
CAPACITORS
C005
ELECTROLYTIC CAP. 220
µ
F/16V M or
CE1CMASDL221
ELECTROLYTIC CAP. 220
µ
F/16V M
CE1CMASTL221
C007
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JKB0B103
C008
ELECTROLYTIC CAP. 10
µ
F/50V M or
CE1JMASDL100
ELECTROLYTIC CAP. 10
µ
F/50V M
CE1JMASTL100
C032
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZB0F103
C033
CERAMIC CAP.(AX) F Z 0.01
µ
F/25V
CCA1EZTFZ103
C035
CERAMIC CAP.(AX) CH J 15pF/50V
CCA1JJTCH150
C036
CHIP CERAMIC CAP. B K 220pF/50V
CHD1JKB0B221
C037
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
C039
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C040
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JKB0B103
C042
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
C043
CHIP CERAMIC CAP. F Z 0.022
µ
F/50V
CHD1JZB0F223
C044
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZB0F103
C046
CERAMIC CAP.(AX) F Z 0.01
µ
F/25V
CCA1EZTFZ103
C047
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JKB0B103
C048
ELECTROLYTIC CAP. 47
µ
F/50V M or
CE1JMASDL470
ELECTROLYTIC CAP. 47
µ
F/50V M
CE1JMASTL470
C049
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
C052
CHIP CERAMIC CAP. B K 0.047
µ
F/50V
CHD1JKB0B473
C053
CHIP CERAMIC CAP. B K 0.047
µ
F/50V
CHD1JKB0B473
C054
CERAMIC CAP.(AX) Y M 0.01
µ
F/16V
CCA1CMT0Y103
C203
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
C207
ELECTROLYTIC CAP. 47
µ
F/25V M H7
CE1EMAVSL470
C208
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMAVSL470
C210
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
C211
CERAMIC CAP.(AX) F Z 0.01
µ
F/25V
CCA1EZTFZ103
C212
CHIP CERAMIC CAP.(MELF) SL J 22pF/50V
CZM1JJBSL220
C213
CHIP CERAMIC CAP.(MELF) SL J 22pF/50V
CZM1JJBSL220
C214
ELECTROLYTIC CAP. 220
µ
F/10V M H7
CE1AMAVSL221
C216
CERAMIC CAP.(AX) Y M 0.01
µ
F/16V
CCA1CMT0Y103
C217
CHIP CERAMIC CAP.(MELF) SL D 10pF/50V
CZM1JDBSL100
C218
CHIP CERAMIC CAP.(MELF) SL J 15pF/50V
CZM1JJBSL150
C219
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JKB0B103
C220
ELECTROLYTIC CAP. 220
µ
F/10V M H7
CE1AMAVSL221
C221
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZB0F103
C222
CHIP CERAMIC CAP.(MELF) Y K 2200pF/35V
CZM1GKB0Y222
C223
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
C224
CHIP CERAMIC CAP.(MELF) Y K 1000pF/35V
CZM1GKB0Y102
C225
CHIP CERAMIC CAP.(MELF) W K 560pF/50V
CZM1JKB0B561
C231
CHIP CERAMIC CAP. CH J 100pF/50V
CHD1JJBCH101
C232
CHIP CERAMIC CAP. CH J 100pF/50V
CHD1JJBCH101
C233
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JKB0B103
C235
CERAMIC CAP.(AX) X K 4700pF/16V
CCA1CKT0X472
C236
CERAMIC CAP.(AX) F Z 0.047
µ
F/16V
CCA1CZTFZ473
C238
CHIP CERAMIC CAP.(MELF) Y K 1000pF/35V
CZM1GKB0Y102
C239
ELECTROLYTIC CAP. 22
µ
F/50V M or
CE1JMASDL220
ELECTROLYTIC CAP. 22
µ
F/50V M
CE1JMASTL220
C240
CERAMIC CAP.(AX) B J 560pF/50V
CCA1JJT0B561
C241
CHIP CERAMIC CAP. B K 4700pF/50V
CHD1JKB0B472
C243
ELECTROLYTIC CAP. 22
µ
F/16V M LL or
CE1CMASLL220
ELECTROLYTIC CAP. 22
µ
F/16V M LL
CE1CMASLH220
C245
ELECTROLYTIC CAP. 220
µ
F/16V M or
CE1CMASDL221
ELECTROLYTIC CAP. 220
µ
F/16V M
CE1CMASTL221
C247
ELECTROLYTIC CAP. 220
µ
F/16V M or
CE1CMASDL221
ELECTROLYTIC CAP. 220
µ
F/16V M
CE1CMASTL221
C252
ELECTROLYTIC CAP. 100
µ
F/16V M H7
CE1CMAVSL101
C253
ELECTROLYTIC CAP. 100
µ
F/6.3V M or
CE0KMASDL101
ELECTROLYTIC CAP. 100
µ
F/6.3V M
CE0KMASTL101
C254
ELECTROLYTIC CAP. 47
µ
F/35V M or
CE1GMASDL470
ELECTROLYTIC CAP. 47
µ
F/35V M
CE1GMASTL470
C257
CHIP CERAMIC CAP.(MELF) Y K 1000pF/35V
CZM1GKB0Y102
C301
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZB0F103
C302
CHIP CERAMIC CAP. CH J 33pF/50V
CHD1JJBCH330
C303
CHIP CERAMIC CAP. CH J 33pF/50V
CHD1JJBCH330
C304
CHIP CERAMIC CAP. CH J 33pF/50V
CHD1JJBCH330
C309
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
C310
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
C314
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JKB0B103
C315
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
C316
CHIP CERAMIC CAP. F Z 2.2
µ
F/6.3V
CHD1KZB0F225
C317
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZB0F103
C319
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
C320
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
C321
ELECTROLYTIC CAP. 220
µ
F/10V M H7
CE1AMAVSL221
C322
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZB0F103
C323
CHIP CERAMIC CAP. F Z 2.2
µ
F/6.3V
CHD1KZB0F225
C324
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
C325
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
C326
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZB0F105
Ref. No.
Description
Part No.
Содержание 6319CD/EWC1903
Страница 20: ...1 6 2 T7400DC Fig 1 S 1 S 1 S 1 S 2 1 REAR CABINET ANT 1 REAR CABINET S 1 S 1 S 2 S 1 S 1 Fig 2 ...
Страница 21: ...1 6 3 T7400DC S 5 S 4 S 4 S 5 S 5 S 5 S 5 S 3 S 3 2 TRAY CHASSIS 3 DECK UNIT 4 MAIN CBA S 3 Fig 3 ...
Страница 22: ...1 6 4 T7400DC Fig 4 S 6 S 6 S 6 S 6 5 CRT CRT CBA ANODE CAP ...
Страница 72: ...2 4 8 Z12NDA Fig DM16 41 42 43 L 13 44 45 P 9 Slide Fig DM17 ...
Страница 76: ...Packing 3 1 3 T7400PEX X1 S1 S4 S15 EWC1903 only S3 S3 S2 TAPE TAPE X4 X3 X2 X7 S6 S14 FRONT ...
Страница 93: ...Printed in Japan 2003 02 17 HO 6319CD EWC1903 T7401UB 7403UD ...