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Appendix B: System Specifications
Appendix B
System Specifications
Processors
Dual 3rd Gen Intel Xeon Scalable processors in a P+ (LGA4189) socket with up to 40 cores and the thermal design power
(TDP) of up to 270W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel PCH C621A (LBG-R)
BIOS
AMI 64Mb SPI Flash ROM
Memory
Thirty-two slots DDR4 RDIMM/LRDIMM or Intel Optane PMem 200 Series, Up to 3200 MHz
(8TB for DDR4, or 8TB of PMem and 4TB DDR4)
Note: PMem 200 Series are supported on 3rd gen Intel Xeon Scalable Platinum, Gold and selected Silver processors.
Storage Drives
Four hot-swap 3.5" bays for SAS/SATA/NVMe, SAS with kit
Two SuperDOM (Disk on Module) headers
PCI Expansion Slots
Two full size, PCIe 4.0 x16 slots
One low profile x8 PCIe 4.0 x8slot,
One internal low profile PCIe 4.0 x8 slot (Ultra riser)
Input/Output
Network: Two to four LAN ports, varies by choice of Ultra Riser card
BMC: Dedicated LAN port
USB: Two USB 3.0 ports
Video : One VGA port
COM port: One serial header
Motherboard
X12DPU-6; 16.8" (W) x 17.00" (L) (426.72 mm x 431.80 mm)
Chassis
819U3TS-R1K22P-T; 1U Rackmount, 17.2” x 1.7” x 29.7” (depth) (437 x 43 x 754 mm)
System Cooling
Eight 4-cm counter-rotating fans w/ Optimal Fan Speed Control, two CPU heatsinks, two air shrouds to direct air flow
Power Supply
Model: PWS-1K22A-1R, 1200/800W redundant modules, 80Plus Titanium level; 1600W or 2000W optional
AC Input
100-127 Vac, 50-60 Hz
200-240 Vac, 50-60 Hz
+12V
Max: 66.7 A, Min: 0 A (100 Vac–127 Vac)
Max: 100 A, Min: 0 A (200 Vac–240 Vac)
+12 V standby: Max: 2.1 A, Min: 0 A