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Appendix B: System Specifications
Appendix B
System Specifications
Processors
Dual 3rd Gen Intel Xeon Scalable processors in P+ (LGA-4189) sockets with up to 40 cores and a thermal design power (TDP)
of up to 270W
Chipset
Intel PCH C621A
BIOS
AMI BIOS, ACPI 3.0 or later, PCI firmware 4.0 support, BIOS rescue hot-key, SPI dual/quad speed support, RTC (Real Time
Clock) wakeup, and SMBIOS 3.0 or later
Memory
Sixteen slots for up to 6TB of LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 or Intel Optane PMem 200 Series; up to
3200MHz; DIMM size up to 256 GB at 1.2 V.
Storage Drives
Twelve 3.5" front drive bays for NVMe/SAS/SATA;
Two optional 2.5" rear drive bays; two NVMe M.2; two SATADOM
PCI Expansion Slots
Four PCIe 4.0 x16 (FHHL) slots
Two PCIe 4.0 x8 (FHHL) slots (optional)
Input/Output
Network: One or two AIOM modules (OCP 3.0 NIC)
BMC: Dedicated LAN port
USB: Two rear USB 3.0 ports
Video : One VGA port
COM: One serial header
Motherboard
X12DDW-A6; 12.2" (W) x 13.4" (L) ATX (312 mm x 340 mm)
Chassis
LA26AC12-R1K23AW; 2U Rackmount, (WxHxD) 17.2 x 3.5 x 27.8 in. (43.7 x 8.6 x 70.6 cm)
System Cooling
Three 80x80x38 mm, 13.5K RPM, hot-swap middle cooling fans, two CPU heatsinks, one air shrouds to direct air flow
Power Supply
Model: PWS-1K23A-1R, 1200W redundant modules, 80Plus Titanium level
AC Input
100-127 Vac, 50-60 Hz
200-240 Vac, 50-60 Hz
+12V
Max: 66.7 A, Min: 0 A (100 Vac–127 Vac)
Max: 83 A, Min: 0 A (200 Vac–240 Vac)
+12V standby: Max: 4 A, Min: 0 A
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
