1-2
PCI I/O Board Installation and Component Replacement • February 1998
1.2
Precautions
Caution –
The chassis AC power cord must remain connected to ensure a proper
ground.
Caution –
The I/O+ boards, their modules, and cards have surface-mount
components that can be broken by flexing the boards.
To minimize board damage, observe the following precautions:
■
Hold the board only by the edges near the middle of the board, where the board
stiffener is located. Do not hold the board only at the ends.
■
When removing the board from an antistatic bag, keep the board vertical until
you lay it on the Sun™ ESD mat.
■
Do not place the board on a hard surface. Use a cushioned antistatic mat.
■
Do not use an oscilloscope probe on the components. The soldered pins are easily
damaged or shorted by the probe point.
■
Transport the board in an antistatic bag.
■
Be careful of small parts located on the component side of the board.
Caution –
The heatsinks on the board can be damaged by incorrect handling. Do
not touch the heatsinks while installing or removing the board. Hold the board only
by the edges. If a heatsink is loose or broken, obtain a replacement board.
Caution –
The heatsinks on the board can be damaged by improper packaging.
When storing or shipping the board, ensure that the heatsinks have sufficient
protection.
Caution –
Remove a board from a powered-on system only after the ASR software
has disabled the board. If a board has not been disabled by the ASR software, then
the operating system should be halted and the system powered-off prior to board
removal. See your server system reference manual for instructions on powering-off
your system.
Caution –
Use a grounding wrist strap to prevent static damage.
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