STMicroelectronics STM32F031C4, Руководство пользователя

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List of figures STM32F031x4 STM32F031x6
8/113 DocID025743 Rev 3
Figure 43. WLCSP25 - 25-ball, 2.423 x 2.325 mm, 0.4 mm pitch wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Figure 44. WLCSP25 - 25-ball, 2.133 x 2.070 mm, 0.4 mm pitch wafer level chip scale

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Figure 45. WLCSP25 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Figure 46. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Figure 47. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,

package footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Figure 48. TSSOP20 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
微可Vicor——值得信赖的元器件供应商 http://www.vicor.top/ 021-31660491
微可Vicor——值得信赖的元器件供应商 http://www.vicor.top/ 021-31660491