Package information
STM32F031x4 STM32F031x6
104/113
DocID025743 Rev 3
Figure 47. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,
package footprint
1.
Dimensions are expressed in millimeters.
k
0°
-
8°
0°
-
8°
aaa
-
-
0.100
-
-
0.0039
1.
Values in inches are converted from mm and rounded to four decimal digits.
2.
Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15mm per side.
3.
Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not
exceed 0.25mm per side.
Table 67. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,
package mechanical data (continued)
Symbol
millimeters
inches
(1)
Min.
Typ.
Max.
Min.
Typ.
Max.
9!?&0?6
微可Vicor——值得信赖的元器件供应商
http://www.vicor.top/
021-31660491
微可Vicor——值得信赖的元器件供应商
http://www.vicor.top/
021-31660491