Sony MDR NC60 - Headphones - Binaural, Руководство по обслуживанию

Страница: 2 / 26

2
MDR-NC60
TABLE OF CONTENTS
1. GENERAL
................................................................... 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 4
2-2. ML Board ........................................................................ 4
2-3. MR Board ........................................................................ 5
2-4. Head Band Assy .............................................................. 5
2-5. Hanger (L/R) ................................................................... 6
2-6. Housing Cap (L/R) .......................................................... 6
2-7. Position of Lead Wires .................................................... 7
3. ELECTRICAL ADJUSTMENT
............................ 8
4. DIAGRAMS
4-1. Block Diagram ................................................................ 13
4-2. Printed Wiring Boards – L-CH Section – ........................ 15
4-3. Schematic Diagram – L-CH Section – ............................ 16
4-4. Printed Wiring Boards – R-CH Section – ....................... 17
4-5. Schematic Diagram – R-CH Section – ............................ 18
5. EXPLODED VIEWS
5-1. Housing Section .............................................................. 19
5-2. Head Band Assy Section ................................................. 20
6. ELECTRICAL PARTS LIST
................................ 21
Note on chip component replacement
•
Never reuse a disconnected chip componet
•
Notice that the minus side of a teamtalum capacitor may be damaged by
heat
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.