HCD-X1
56
56
HCD-X1
6-34. PRINTED WIRING BOARD – POWER-AMP Board (Component Side) –
•
See page 27 for Circuit Boards Location.
: Uses unleaded solder.
A27
C463
R
2
23
R224
R
225
R226
R229
FL
20
1
R111
R253
R259
R256
R242
R239
R236
R233
R262
IC233
R152
D106
C135
R
119
CN301
C295
C
28
6
R118
D
11
5
Q162
Q161
R
345
C465
D
114
R
344
C327
C360
C351
C
336
C
28
3
C315
C318
IC303
C
299
R106
D
10
7
R
2
52
R258
R
2
47
R
24
4
R241
R238
R235
R232
R
265
R261
R255
R
2
21
IC232
C368
C294
C
285
C302
C326
C359
C350
C
335
C282
C314
C317
IC302
C298
R222
R219
R218
R217
R216
R215
R214
R213
R212
R220
C204
R251
R257
C206
IC201
C272
R
266
R201
R272
R240
R237
R234
R231
R264
R
2
60
R
254
R
2
49
R263
IC231
IC271
X
2
71
C202
C367
C
293
C
28
4
C325
C358
C
349
C
334
C281
C313
C316
IC301
C464
C468
C471
C472
C470
C469
C462
C461
C466
C467
Q313
C
296
R151
R
267
R138
Q143
Q147
D
1
32
C212
C211
C213
C214
C220
R
343
R
34
0
R
3
37
R307
R304
C301
R
358
R
30
1
R
341
R
3
38
R308
R305
R
359
R302
R
34
2
R
3
39
R309
R306
C303
C369
R
303
R
360
R270
R268
C
26
4
R269
R248
R245
R250
C107
R211
D109
D110
D108
1
12
36
37
48
25
13
24
1
12
36
37
48
48
25
13
24
8
5
1
12
36
37
25
13
24
1
4
3
5
1
4
3
5
E
POWER-AMP BOARD
(COMPONENT SIDE)
1-866-251-
11
(13),(14)
MAIN
BOARD
CN506
M
E
E
E
E
A
2
1
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
B
C
D
E
F
G
H
I
J
K
L
M
N
D106
N-16
D107
N-17
D108
N-16
D109
H-15
D110
N-16
D114
M-17
D115
M-17
D132
I-13
IC201
B-10
IC231
F-10
IC232
I-10
IC233
L-10
IC271
E-10
IC301
F-8
IC302
I-8
IC303
L-8
Q143
I-14
Q147
I-13
Q161
H-14
Q162
H-13
Q313
N-2
•
Semiconductor
Location
Ref. No. Location
(Page 46)
Ver. 1.1
Содержание HD-X1
Страница 117: ...117 HCD X1 MEMO ...