3
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
TABLE OF CONTENTS
MODEL IDENTIFICATION
— BACK PANEL —
MODEL
US model
CND model
AEP model
MX model
E51 model
PARTS No.
4-231-829-0
s
4-231-829-1
s
4-231-829-2
s
4-231-829-5
s
4-231-829-6
s
• Abbreviation
CND : Canadian model
MX
: Mexican model
E51
: Chiri and Peru model
PARTS No.
1. GENERAL
·········································································· 4
2. DISASSEMBY
·································································· 6
3. TEST MODE
···································································· 13
4. MECHANICAL ADJUSTMENTS
····························· 17
5. ELECTRICAL ADJUSTMENTS
······························· 17
6. DIAGRAMS
6-1. Circuit Board Location ················································· 23
6-2. Block Diagrams ···························································· 24
6-3. Printed Wiring Board BD Section ···························· 26
6-4. Schematic Diagram BD Section ······························· 27
6-5. Printed Wiring Board Main Section ························· 28
6-6. Schematic Diagram Main Section (1/3) ··················· 29
6-7. Schematic Diagram Main Section (2/3) ··················· 30
6-8. Schematic Diagram Main Section (3/3) ··················· 31
6-9. Printed Wiring Board DSP Section ·························· 32
6-10. Schematic Diagram DSP Section (1/2) ··················· 33
6-11. Schematic Diagram DSP Section (2/2) ··················· 34
6-12. Printed Wiring Board OPT Section ························ 35
6-13. Schematic Diagram OPT Section ··························· 35
6-14. Printed Wiring Board Front Amp Section (AEP/US/
CND model) ································································· 36
6-15. Schematic Diagram Front Amp Section (AEP/US/
CND model) ································································· 37
6-16. Printed Wiring Board Front Amp Section (E51/MX
model) ··········································································· 38
6-17. Schematic Diagram Front Amp Section (E51/MX
model) ··········································································· 39
6-18. Schematic Diagram Surround Amp Section ··········· 40
6-19. Printed Wiring Board Surround Amp Section ········ 40
6-20. Printed Wiring Board Panel Section ······················· 41
6-21. Schematic Diagram Panel Section (1/2) ················· 42
6-22. Schematic Diagram Panel Section (2/2) ················· 43
6-23. Printed Wiring Board Leaf SW Section ·················· 44
6-24. Schematic Diagram Leaf SW Section ···················· 45
6-25. Printed Wiring Board Driver Section ······················ 46
6-26. Schematic Diagram Driver Section ························ 47
6-27. Printed Wiring Board Trans Section ······················· 48
6-28. Schematic Diagram Trans Section ·························· 49
6-29. IC Pin Function Description ······································· 50
6-30. IC Block Diagrams ····················································· 56
7. EXPLODED VIEWS
7-1. Main Section ································································· 60
7-2. Front Panel Section ······················································· 61
7-3. Chassis Section ····························································· 62
7-4. Tape Mechanism Deck Section-1 (TCM-230MWR41) 63
7-5. Tape Mechanism Deck Section-2 (TCM-230AWR41) 64
7-6. CD Mechanism Deck Section (CDM58E-30BD60) ···· 65
7-7. Base Unit Section (BU-30BD60) ································· 66
8. ELECTRICAL PARTS LIST
······································· 67
Содержание HCD-DP700
Страница 37: ...37 37 HCD DP700 6 15 SCHEMATIC DIAGRAM FRONT AMP SECTION AEP US CND model Page 50 Page 30 Page 30 ...
Страница 39: ...39 39 HCD DP700 6 17 SCHEMATIC DIAGRAM FRONT AMP SECTION E51 MX model Page 50 Page 30 Page 30 Page 40 ...
Страница 40: ...HCD DP700 40 40 6 18 SCHEMATIC DIAGRAM SURROUND AMP SECTION Page 30 Page 39 Page 50 ...
Страница 44: ...HCD DP700 44 44 6 22 SCHEMATIC DIAGRAM PANEL 2 2 SECTION Page 43 Page 43 ...
Страница 46: ...HCD DP700 46 46 6 24 SCHEMATIC DIAGRAM LEAF SW SECTION Page 29 ...
Страница 48: ...HCD DP700 48 48 6 26 SCHEMATIC DIAGRAM DRIVER SECTION See page 61 for IC Block Diagrams Page 29 ...