HCD-DJ2i
3
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(
Caution:
Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution:
The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
NOTES ON CHIP COMPONENT REPLACEMENT
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
Keep the temperature of soldering iron around 270 °C during
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
bottom of the unit.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SAFETY CHECK-OUT (US MODEL)
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μ
F
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
