manualshive.com logo in svg

Sony Ericsson Developer's Board, Руководство пользователя, Страница: 3 / 28

Поделиться
Скачать
Sony Ericsson Developer's Board Скачать руководство пользователя страница 3

Developer's Board Manual Rev A

Page 3 of 28

SEM/CX-02:0061/MAN

List of Tables

T

ABLE 

1: D

EVELOPER

'

S 

K

IT 

C

ONTENT 

L

IST

................................................................................................................................. 6

T

ABLE 

2: B

ASELINE 

J

UMPER 

S

ETTINGS FOR 

DM-15/25 ............................................................................................................. 12

T

ABLE 

3: B

ASELINE 

D

IP 

S

ETTINGS FOR 

DM-15/25 .................................................................................................................... 12

T

ABLE 

4: B

ASELINE 

J

UMPER 

S

ETTINGS FOR 

CM-4

X

.................................................................................................................. 12

T

ABLE 

5: B

ASELINE 

D

IP 

S

ETTINGS FOR 

CM-4

X

......................................................................................................................... 12

T

ABLE 

6: B

ASELINE 

J

UMPER 

S

ETTINGS FOR 

DM-10/20 ............................................................................................................. 12

T

ABLE 

7: B

ASELINE 

D

IP 

S

ETTINGS FOR 

DM-10/20 .................................................................................................................... 12

T

ABLE 

8: D

ESCRIPTION OF 

C

ONNECTORS

, S

WITCHES AND 

I

NDICATORS

..................................................................................... 19

T

ABLE 

9: VDIG H

EADER 

S

ETTINGS 

(X103) .............................................................................................................................. 19

T

ABLE 

10: VCC H

EADER 

S

ETTINGS 

(X104) .............................................................................................................................. 20

T

ABLE 

11: V

OLTAGE LEVELS FOR EACH MODULE FAMILY

......................................................................................................... 20

T

ABLE 

12: J

UMPER SETTINGS FOR EACH MODULE FAMILY

......................................................................................................... 20

T

ABLE 

13: VREF H

EADER 

S

ETTINGS 

(X101) ............................................................................................................................ 20

T

ABLE 

14: D

ESCRIPTION OF 

O

PERATION 

M

ODE 

S

WITCH 

S

ETTINGS

........................................................................................... 20

T

ABLE 

15: M

ODULE 

ON S

TATE

................................................................................................................................................. 21

T

ABLE 

16: RS-232 DB9 P

IN

-

OUT

.............................................................................................................................................. 21

T

ABLE 

17: RS-232 DB9 J22 R

OUTING

...................................................................................................................................... 21

T

ABLE 

18: H

EADER 

X102 S

ETTINGS 

(J22-DCD) ....................................................................................................................... 21

T

ABLE 

19: S3 S

ETTINGS TO ENABLE 

HW F

LOW 

C

ONTROL

........................................................................................................ 22

T

ABLE 

20: S3 S

ETTINGS TO DISABLE 

HW F

LOW 

C

ONTROL

....................................................................................................... 22

T

ABLE 

21: D

IRECTION OF 

S

ERIAL 

D

ATA 

S

IGNALS

...................................................................................................................... 22

T

ABLE 

22: P

IN

-

OUT OF 

S

YSTEM 

C

ONNECTOR 

H

EADER

.............................................................................................................. 23

List of Figures

F

IGURE 

1: E

XPLODED VIEW DRAWING OF DEVELOPER

'

S BOARD WITH 

DM-15/25 ........................................................................ 7

F

IGURE 

2: E

XPLODED VIEW DRAWING OF DEVELOPER

'

S BOARD WITH HEAT SINK

......................................................................... 8

F

IGURE 

3: E

XPLODED VIEW DRAWING OF DEVELOPER

'

S BOARD WITH 

CM-4

X

.............................................................................. 9

F

IGURE 

4: DM-

XX 

C

ONNECTION 

D

IAGRAM

............................................................................................................................... 10

F

IGURE 

5: CM-4

X 

C

ONNECTION 

D

IAGRAM

................................................................................................................................ 11

F

IGURE 

6: A

SSEMBLE 

D

RAWING OF 

D

EVELOPER

'

S 

B

OARD 

(R

EVISION 

P1F)............................................................................... 15

F

IGURE 

7: A

SSEMBLE 

D

RAWING OF 

D

EVELOPER

'

S 

B

OARD 

(R

EVISION 

P1E) .............................................................................. 16

F

IGURE 

8: A

SSEMBLE 

D

RAWING OF 

D

EVELOPER

'

S 

B

OARD 

(R

EVISION 

P1D) .............................................................................. 17

Revision History

Release

Date

Summary of Changes

A

5/17/02

Initial Release - JPL

Содержание Developer's Board

Страница 1: ...Developer s Board Manual Rev A Page 1 of 28 SEM CX 02 0061 MAN Developer s Board Manual ...

Страница 2: ...G THE HARDWARE 11 2 5 1 DM 15 25 Family Setup 12 2 5 2 CM 4x Family Setup 12 2 5 3 DM 10 20 Family Setup 12 2 6 TESTING THE INSTALLATION 13 2 6 1 Testing Voice Call Capability 13 3 FUNCTIONAL DESCRIPTION 14 3 1 GENERAL 14 3 2 MECHANICAL DESCRIPTION 19 3 3 POWER INTERFACE 19 3 4 OPERATION MODE 20 3 5 MODULE_PWR_EN_B WAKE SELECTION 21 3 6 SERIAL INTERFACE 21 3 7 SYSTEM CONNECTOR HEADER 22 3 8 RF INT...

Страница 3: ...E SWITCH SETTINGS 20 TABLE 15 MODULE ON STATE 21 TABLE 16 RS 232 DB9 PIN OUT 21 TABLE 17 RS 232 DB9 J22 ROUTING 21 TABLE 18 HEADER X102 SETTINGS J22 DCD 21 TABLE 19 S3 SETTINGS TO ENABLE HW FLOW CONTROL 22 TABLE 20 S3 SETTINGS TO DISABLE HW FLOW CONTROL 22 TABLE 21 DIRECTION OF SERIAL DATA SIGNALS 22 TABLE 22 PIN OUT OF SYSTEM CONNECTOR HEADER 23 List of Figures FIGURE 1 EXPLODED VIEW DRAWING OF D...

Страница 4: ... to show how the user can use the developer s board to troubleshoot their application 1 2 Service and Support 1 2 1 Web Page For more information about where you can buy our modules or for recommendations of accessories and components please visit our web site http www sonyericsson com m2m To register for product news and announcements or for product questions contact the Sony Ericsson M2M Technic...

Страница 5: ...nic Serial Number GND Chassis GrouND HW Hardware ISO International Standards Organization LED Light Emitting Diode LSB Least Significant Bit ME Mobile Equipment MO Mobile Originated MS Mobile Station MT Mobile Terminated NAM Number Assignment Module OEM Original Equipment Manufacturer PCB Printed Circuit Board PCM Pulse Code Modulation PIN Personal Identification Number RD Receive Data also known ...

Страница 6: ...1 Developer s Board TVK 117 2403 P1F 1 4 40 3 16 O D 5 8 Length Standoffs Keystone 1839 4 4 40 3 16 O D 3 4 Length Standoffs Keystone 3481 2 4 Lock Washer Inside Tooth Stainless Steel Various 10 4 40 x 5 16 Phillips Panhead Stainless Steel Machine Screw Various 8 4 40 x 3 8 Phillips Panhead Stainless Steel Machine Screw Various 10 Aluminum Heat Sink Sony Ericsson 1 Thermal Pad Chomerics 1 Document...

Страница 7: ...hine Screw Various 4 4 40 x 3 8 Phillips Panhead Stainless Steel Machine Screw Various 4 4 Lock Washer Inside Tooth Stainless Steel Various 4 Figure 1 Exploded view drawing of developer s board with DM 15 25 Assembly instructions Use 3 8 screw with lock washer through the bottom of board to attach each 5 8 long standoff Attach module to standoff using 5 16 screw one for each standoff Attach 40 con...

Страница 8: ...Panhead Stainless Steel Machine Screw Various 8 4 40 x 3 8 Phillips Panhead Stainless Steel Machine Screw Various 10 Aluminum Heat Sink Sony Ericsson 1 Thermal Pad Chomerics 1 Figure 2 Exploded view drawing of developer s board with heat sink Assembly instructions Use 3 8 screw with lock washer through the bottom of board to attach each 5 8 long standoff for heat sink Use 3 8 screw with lock washe...

Страница 9: ...aining two are under the hexagon shield can Attach 40 conductor to 40 conductor ribbon cable to JP2 and the module Note Components under shield cans are sensitive to ESD and should be handled with appropriate measures 2 3 System Requirements The system requirements are Personal Computer PC or unit compatible for RS232 communications An unused serial port COM1 COM4 for communication between the dev...

Страница 10: ...erial cable from Suzy board port 1 to an available serial port on the PC The DC power supply provides the necessary 12VDC Connect the power cable to the power supply and the AC outlet The included cable is for North America Elsewhere you may simply substitute the appropriate line cord Connect the output of the power supply to the power jack on the Suzy board Attach the provided antenna cable to th...

Страница 11: ...ntenna cable to the SMA antenna jack on the Suzy board or directly to the primary RF output port of the module For voice calls plug in the provided Hands free Speaker Microphone 2 5 Configuring the Hardware This section details the specific developer s board settings for each module family It is important that you verify these settings before powering up the developer s board and module The follow...

Страница 12: ...r DM 15 25 2 5 2 CM 4x Family Setup Voltage Settings Jumper Setting X101 VREF X103 VDIG X104 VCC CM 4x 1 2 3 4 3 4 Table 4 Baseline Jumper Settings for CM 4x Operation Mode Settings Switch Position S3 Function ON OFF Position 1 DTMS ON Position 2 CTS OFF Position 3 DTR ON Position 4 DFMS ON Position 5 RTS OFF Position 6 Module_Pwr_En_B ON Table 5 Baseline Dip Settings for CM 4x 2 5 3 DM 10 20 Fami...

Страница 13: ... control None When HW Flow control is enabled Bits per second 9600 Data bits 8 Parity None Stop bits 1 Flow control Hardware 2 6 1 Testing Voice Call Capability 2 6 1 1 Outgoing Voice Call 1 Start a standard program for serial communication with a PC and open the port 2 Disable HW Flow as it is explained above 3 Enter the phone number you want to dial via the ATD command see the AT Command section...

Страница 14: ... audio interface IO control and a mechanical mounting platform The current revision of the developer s board is P1F The discussion in this manual is written around this revision of the board Assembly drawings of several revisions are included for completeness The reference designators are consistent across the revision to facilitate using this manual for common features The revision of the develop...

Страница 15: ...Developer s Board Manual Rev A Page 15 of 28 SEM CX 02 0061 MAN Figure 6 Assemble Drawing of Developer s Board Revision P1F ...

Страница 16: ...Developer s Board Manual Rev A Page 16 of 28 SEM CX 02 0061 MAN Figure 7 Assemble Drawing of Developer s Board Revision P1E ...

Страница 17: ...Developer s Board Manual Rev A Page 17 of 28 SEM CX 02 0061 MAN Figure 8 Assemble Drawing of Developer s Board Revision P1D ...

Страница 18: ...Developer s Board Manual Rev A Page 18 of 28 SEM CX 02 0061 MAN This Page Left Intentionally Blank ...

Страница 19: ...de switch Switch the module ON OFF S2 Slide switch Select Normal or Flashing operation S201 Slide switch Audio amplifier bypass S3 Dip switch Operation mode switch S5 Push button Initiates a HW shutdown in the module X101 Header Chooses between VREF and VDIG to power RS 232 transceivers X102 Header Drives DCD HIGH LOW on J22 X103 Header Sets VDIG voltage level to the module X104 Header Sets VCC vo...

Страница 20: ...asily enabled disabled via dip switches S3 This allows testing of flow control HW or None This feature also allows the connection of your application s serial interface to the module while providing other connections such as power through the developer s board Switch Signal ON OFF Position 1 DTMS Normal Operation If External application is directly connected to System Connector Header Position 2 C...

Страница 21: ...C DB 9 or DB 25 Female Pin RS 232 Description 1 DCD Data Carrier Detect 2 TXD Transmission Data 3 RXD Receiver Data 4 DTR Data Terminal Ready 5 GND Ground 6 DSR Data Set Ready 7 RTS Request to Send 8 CTS Clear to Send 9 RI Ring Indicator Table 16 RS 232 DB9 Pin out The primary connector J2 routes all the signals to the module interface while level shifting the appropriate ones The secondary connec...

Страница 22: ...d to use the serial interface using the header connector provided on the developer s board notice that appropriate CMOS voltage levels as defined by VDIG in 3 3 Power Interface shall be connected to the appropriate pins as follows Pin Signal Description Direction 23 DCD Data Carrier Detect O 25 CTS Clear To Send O 26 DTR Data Terminal Ready I 27 TD Serial Data To Module DTMS I 28 RTS Request To Se...

Страница 23: ...Purpose binary output 1 14 OUTPUT 2 General Purpose binary output 2 15 HW_SD Reserved Hardware Shutdown CM 4x 16 INPUT 2 General Purpose binary input 2 17 PCMCLK PCM Clock output from Module to Application 18 PCMSYNC PCM Frame sync from Module to Application 19 PCMDLD PCM Voice output from Module to Application 20 PCMULD PCM Voice input to Module from Application 21 GND Chassis Ground 22 GND Chass...

Страница 24: ...gnals according to the Digital Audio section of the appropriate Integrator s Manual The PCM signals available in the system connector header are presented below Pin Signal Description 17 PCMCLK PCM Clock Output from module 18 PCMSYNC PCM Frame Sync Output from module 19 PCMDLD PCM Voice Output from module 20 PCMULD PCM Voice Input to module 3 10 Flashing Firmware The developer s board has the hard...

Страница 25: ...le_Pwr_En_B signal is used to put the module to sleep The proper shutdown procedures for the various module families are below CM 4x Enter AT CFUN 0 at the terminal The module will respond with SHUTDOWN COMPLETE at the terminal when it is safe to remove power from the module An alternative way to shutdown the module is by pressing the HW Shutdown button S5 and wait for the SHUTDOWN COMPLETE messag...

Страница 26: ...ULE_PWR_EN_B Open collector input to the module that held active low enables the main supply voltage for the module The device holding this signal active low will control the operation Switch S3 6 WAKE must be set to OFF position if the application wants to control the power of the module 15 HW_SD Open collector output and CMOS input in both directions module application This signal is pulled up i...

Страница 27: ...elopment system pins 5 6 8 21 22 to the application ground 4 2 Serial Control Communication with the module is done through the main DB 9 RS 232 interface connector J2 The J2 interface can be used as a line listener if the application connects to the 40 pin header pins 27 DTMS and pin 30 DFMS It is also possible to interject new commands to the module through J2 while the application is connected ...

Страница 28: ...MP position and that ATMS from the application is disconnected from the header connector 2 The earpiece volume is low Increase the volume inside the module by sending AT CLVL 8 8 Highest volume 0 Mute Change the developer s board volume by rotating the R230 potentiometer 3 Neither the microphone nor the earpiece works Make sure the headset is properly inserted J201 ...

Отзывы:

Нет отзывов