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SIM5360_Hardware Design_V1.06
2016-11-17
66
6.4
Baking Requirements
Because of its sensitivity to moisture absorption, SIM5360 should be baked sufficiently before re-flow
soldering. Otherwise SIM5360 will be at the risk of permanent damage during re-flow soldering. SIM5360
should be baked 192 hours at temperature 40°C +5°C /-0°C and <5% RH for low-temperature device
containers, or 72 hours at temperature 80°C±5°C for high-temperature device containers. Care should be
taken that the plastic tray is not heat resistant, SIM5360 modules should be taken out for baking, and
otherwise the tray may be damaged by high-temperature during baking.
Table 48: Baking requirements
Baking temperature
Moisture
Time
40
℃
+5
℃
/-0
℃
<5%
192 hours
85
℃
±5
℃
<5%
72 hours
6.5
Stencil Foil Design Recommendation
The recommended thickness of stencil foil is 0.15mm.
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