Measures for small system installations
For smaller installations with only slight potential differences, insulated mounting of the
device and peripheral devices may be an adequate solution.
U
System
Controller
Power Supply
SICK
Device
8
6
5
2
1
3
4
7
=
9
=
ß
Figure 7: Example: Prevention of equipotential bonding currents in the system configuration by
the insulated mounting of the device
1
System controller
2
Device
3
Voltage supply
4
Grounding point 3
5
Insulated mounting
6
Grounding point 2
7
Ground potential difference
8
Grounding point 1
9
Metal housing
ß
Shielded electrical cable
Even in the event of large differences in the ground potential, ground loops are effec‐
tively prevented. As a result, equalizing currents can no longer flow via the cable shields
and metal housing.
NOTICE
The voltage supply for the device and the connected peripheral devices must also guar‐
antee the required level of insulation.
Under certain circumstances, a tangible potential can develop between the insulated
metal housings and the local ground potential.
6.4
Electrical connection of the sensor
NOTICE
All electrical circuits must be connected to the device with safety extra-low voltage
(SELV or PELV).
Protect the device with an external 0.8 A slow-blow fuse at the beginning of the supply
cable.
6
ELECTRICAL INSTALLATION
20
O P E R A T I N G I N S T R U C T I O N S | TiM2xx
8025019/190A/2020-08 | SICK
Subject to change without notice
