Technical Explanation
SKiiP
®
3 Parallel Board
© by SEMIKRON
2017-08-30
– Rev02
5 / 20
3
General description
3.1
Overview
SKiiP
®
3 subsystems are connected in parallel to achieve higher output current. The SKiiP
®
3 Parallel board is
designed for connecting up to four SKiiP
®
3 subsystems to one controller. The example of SKiiP
®
3 Parallel
board application is shown in the Figure 1. The switching signals from controller are routed to all paralleled
devices. Analogue signal measurements and error siganls from the paralleled devices are converted and
transferred to the controller.
Figure 1: An example of SKiiP
®
3 Parallel board application
For an EMI-safe transmission of the switching- and error-signals, there is the possibility to mount an optional
fiber-adapter F-Option board SKiiP
®
3 on top of the SKiiP
®
3 Parallel board. No mechanical housing is required
since the board is directly mounted on a metal frame inside the cabinet.
All different SKiiP
®
3 Parallel board product variants are based on one common board-layout but do have
different number of connected SKiiP
®
3 subsystems:
Type 1:
Board setup for paralleling of
two
SKiiP
®
3 GB systems 1200V/1700V with and without F-Option
(using connector X3/X4 &
vertical
connector X1)
Type 2:
Board setup for paralleling of
three
SKiiP
®
3 GB. systems 1200V/1700V with and without F-
Option (using connector X3/X4/X5 &
vertical
connector X1)
Type 3:
Board setup for paralleling of
four
SKiiP
®
3 GB systems 1200V/1700V with and without F-
Option (using connector X3/X4/X5/X6 &
vertical
connector X1)
The pollution degree class 2 and IP00 shall be considered for the SKiiP
®
3 Parallel board.
