Technical Explanation
SKiiP
®
3 Parallel Board
© by SEMIKRON
2017-08-30
– Rev02
15 / 20
12 Shielding Concept
Figure 10:
Shielding concept of the SKiiP
®
3 Parallel board
X3
X4
X6
X5
X1
Controller
X7
Optional
analog signals
& shield
Power
Supply 24V
X2
2
3
1
SKiiP
®
3
‚A‘
SKiiP
®
3
‚D‘
SKiiP
®
3
‚B‘
SKiiP
®
3
‚C‘
Option 2:
Direct Chassis
Connection with
Screws (4x)
Option 1:
Chassis Connection
through Cable
S
h
ie
ld
P
la
n
e
(B
o
tt
o
m
L
a
y
e
r)
Power-GND Plane
(2nd Layer)
The shield from all DIN41651 connectors (X1/X3/X4/X5/X6/X7) and the power connector (X2) is centrally
merged with the shield plane within the board.
The shield plane is directly connected with the power ground plane by vias. These vias are placed alongside
each egde of the PCB.
It is recommended for good EMC robustness to connect the shield plane respectively the Power-GND to
chasses. That can be done on the parallel board or on controller. If grounding is done on both sides controller
and on parallel board then the impedance between the both grounding points has to be low to prevent
interferences.
Grounding should be done with a HF-compliant connection. There are two ways to connect the shield layer to
the Chassis/PE:
Chassis-shield connection Option 1:
Attaching a cable or earth strap to the rear panel metal frame and
connecting it at the other end to pin 1 of connector X2. This option
should be considered if the board is not attached to the rear panel
metal frame with screws.
Chassis-shield connection Option 2:
Connecting the SKiiP
®
3 parallel board to the rear panel metal frame
with 4 metal screws. Electrical connection is done through metal
screws. This is the prefered option for good ground connection.
Please note:
The shield connection should be performed with metal screws with head diameter less
than 8 mm.
