© SAMSUNG Electronics Co., Ltd.
VIII
CHAPTER 3.
Troubleshooting 1
3.1
Power Failures ............................................................................................................................. 2
3.2
Base board Failures .................................................................................................................... 4
3.3
SLI Failures................................................................................................................................... 5
3.4
DLI Failures .................................................................................................................................. 9
3.5
MISC Failures ..............................................................................................................................11
3.6
Caller ID Failures ....................................................................................................................... 14
3.7
LAN Failures............................................................................................................................... 15
3.8
3/4TRUNK Failures .................................................................................................................... 16
3.9
2BRI Failures .............................................................................................................................. 19
3.10
MGI Failures ............................................................................................................................... 21
CHAPTER 4.
H/W Block Diagrams and Schematic Description
1
4.1
H/W Block Diagram...................................................................................................................... 1
4.2
Schematic Description ................................................................................................................ 2
4.2.1
Power Supply Unit ........................................................................................................................ 2
4.2.2
Base board.................................................................................................................................... 4
4.2.3
3/4TRK, 2BRI Board...................................................................................................................19
4.2.4
MGI Board...................................................................................................................................22
4.2.5
Ring Generator ...........................................................................................................................23
CHAPTER 5.
Exploded View and Parts List
1
5.1
Exploded View.............................................................................................................................. 1
5.2
Parts List....................................................................................................................................... 2
5.2.1
Base Board ................................................................................................................................... 2
5.2.2
3TRK Board (MPD Type, With CID)..........................................................................................12
5.2.3
3TRK Board (PRS Type, With CID)...........................................................................................16
5.2.4
4TRK Board (MPD Type, Without CID).....................................................................................19
5.2.5
4TRK Board (PRS Type, Without CID) .....................................................................................24
5.2.6
2BRI Board .................................................................................................................................28
5.2.7
MGI Board...................................................................................................................................31
ANNEX A.
PCB Component Layout
1
A.1
Base board ................................................................................................................................... 1
A.1.1
Component Side........................................................................................................................... 1
A.1.2
Solder Side.................................................................................................................................... 2
Содержание OfficeServ 12
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