© SAMSUNG Electronics Co., Ltd.
31
5.2.7 MGI Board
Part No.
Location
Quantity
Part Name
Specification
0801-002325 U4
1
IC-CMOS LOGIC
74LCX04, INVERTER, TSSOP, 14,
173 MIL
1106-001469 U2
1
IC-SRAM
GA71116ATP-8,
64KX16BIT,
TSOP,
44P, 400 MIL
1203-002267 U3
1
IC-POSI.FIXED
REG.
3.3 V, TO-263-5, 400MIL, PLASTIC
1204-002202 U1
1
IC-AUDIO
CONTROLLER
AC48204E6-C, TQFP, 144P,
20 × 20 MM, PLASTIC
2007-000043 R48, R49
2
R-CHIP
1 Kohm, 1 %, 1/10 W, TP, 1608
2007-000052 R36-R45, R47, R50
12
R-CHIP
10 Kohm, 1 %, 1/10 W, TP, 1608
2007-000060 R46
1
R-CHIP
100 Kohm, 1 %, 1/10 W, TP, 1608
2007-000070 R1, R3, R6-R14, R52,
R61-R67
19
R-CHIP
0 ohm, 5 %, 1/10 W, TP, 1608
2007-007226 R21-R26, R28, R30
8
R-CHIP
49.9 ohm, 1 %, 1/10 W, TP, 1608
2007-008122 R51
1
R-CHIP
22.1 OHM, 1 %, 1/10 W, TP, 1608
2203-000998 C11, C12
2
C-CER, CHIP
0.047 NF, 5 %, 50 V, C0G, TP, 1608
2203-005249 BC1-BC16
16
C-CER, CHIP
100 NF, 10 %, 50 V, X7R, TP, 1608
2404-000227 C1, C2
2
C-TA, CHIP
4.7 uF, 10 %, 10 V, TP, 3216
2804-001499 Y1
1
OSCILLATOR-
CLOCK
20 MHz, 50 ppm, 10TTL, 15pF, TP,
3.3 V, 40 mA
3301-001120 L2,
L3
2
BEAD-SMD
30 OHM, 2012, 3000, TP, 0.015
3711-004744 P1,
P2
2
CONNECTOR-
HEADER
BOX, 40P, 2R, 0.8 MM, SMD-S,
AU30U, NTR
Содержание OfficeServ 12
Страница 1: ...GANA 000029 Ed 001 OfficeServ 12 Service Manual ...
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Страница 106: ... SAMSUNG Electronics Co Ltd 2 A 1 2 Solder Side ...
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Страница 109: ... SAMSUNG Electronics Co Ltd 5 A 3 2BRI Board A 3 1 Component Side ...
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