SAMSUNG Confidential
MODEL
LSC460HJ03
Doc. No
Page
37 / 42
2.2 The COF and the Drive IC
(a) The pattern of COF is easily damaged by the sharp edge of the press and the burr of
mold under the condition which the products are shaking while delivering. Therefore, it
is recommended to avoid designing not to locate the gate of mold or the parting line in
the position of COF when designing the product.
(b) It is recommended to secure the sufficient gap between the COF and the other parts when
designing the product since the lack of gap between the COF and the other parts can cause the
damage in the COF such as the lead crack under the condition which the product is twisted.
(※ The space over 3.0mm for moving is recommended, but the quality of products is not
guaranteed.)
(c) The temperature of the surface of Drive-
IC should be less than 100℃