Rorke Data The Galaxy 65, Руководство пользователя

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Galaxy 65 User Guide
64
7.4.3 Thermal Control
The Galaxy 65 Enclosure uses extensive thermal monitoring and takes a number of actions to ensure
component temperatures are kept low and also to minimize acoustic noise.Air flow is from front to rear of
the enclosure.
Symptom Cause Action
If the ambient air is cool
(below 25 °C) and the fans
are observed to increase in
speed then some restriction
on airflow may be causing
additional internal
temperature rise.
Note: This is not a fault
condition.
The first stage in the thermal
control process is for the fans
to automatically increase in
speed when a thermal
threshold is reached. This
may be caused by higher
ambient temperatures in the
local environment and may
be perfectly normal.
Note: This threshold
changes according to the
number of drives and power
supplies fitted.
1 Check the installation for any airflow
restrictions at either the front or rear
of the enclosure. A minimum gap of
25mm at the front and 50mm at the
rear is recommended.
2 Check for restrictions due to dust
build-up, clean as appropriate.
3 Check for excessive re-circulation of
heated air from rear to the front, use
in a fully enclosed rack installation is
not recommended.
4 Check that all Blank modules are in
place.
5 Reduce the ambient temperature.