Renesas HS7124EDB01H, Руководство пользователя

Страница: 3 / 76

1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technolo g y Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property ri g hts, or any other ri g hts, belon g in g to Renesas Technolo g y Corp. or
a third party.
2. Renesas Technolo g y Corp. assumes no responsibility for any dama g e, or infrin g ement of any third-
party's ri g hts, ori g inatin g in the use of any product data, dia g rams, charts, pro g rams, al g orithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, includin g product data, dia g rams, charts, pro g rams and
al g orithms represents information on products at the time of publication of these materials, and are
subject to chan g e by Renesas Technolo g y Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technolo g y Corp. or
an authorized Renesas Technolo g y Corp. product distributor for the latest product information
before purchasin g a product listed herein.
The information described here may contain technical inaccuracies or typo g raphical errors.
Renesas Technolo g y Corp. assumes no responsibility for any dama g e, liability, or other loss risin g
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technolo
g y Corp. by various means,
includin g the Renesas Technolo g y Corp. Semiconductor home pa g e (http://www.renesas.com).
4. When usin g any or all of the information contained in these materials, includin g product data,
dia g rams, charts, pro g rams, and al g orithms, please be sure to evaluate all information as a total
system before makin g a final decision on the applicability of the information and products. Renesas
Technolo g y Corp. assumes no responsibility for any dama g e, liability or other loss resultin g from the
information contained herein.
5. Renesas Technolo g y Corp. semiconductors are not desi g ned or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technolo
g y Corp. or an authorized Renesas Technolo g y Corp. product distributor when
considerin g the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technolo g y Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technolo g ies are subject to the Japanese export control restrictions, they must
be exported under a license from the Japanese g overnment and cannot be imported into a country
other than the approved destination.
Any diversion or reexport contrary to the export control laws and re
g ulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technolo g y Corp. for further details on these materials or the products
contained therein.
1. Renesas Technolo g y Corp. puts the maximum effort into makin g semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property dama
g e.
Remember to g ive due consideration to safety when makin g your circuit desi g ns, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention a
g ainst any malfunction or mishap.
Keep safety first in your circuit desi g ns!
Notes re g ardin g these materials