Re ICENI/AI-04, Инструкция по эксплуатации

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ICENI/AI-04
INDEX
1 FOREWORD............................................................................................................ 5
2 GENERAL USE ....................................................................................................... 6
2.1 General. ....................................................................................................... 6
2.2 Product Condition ...................................................................................... 6
2.3 Signal Connection ...................................................................................... 6
2.4 Module Damage / Repair............................................................................ 6
3 PRODUCT OVERVIEW ........................................................................................... 7
3.1 Iceni Node ................................................................................................... 7
3.2 ICENIbus Interface ..................................................................................... 8
3.3 Field Wiring Interface ................................................................................. 9
4 ICENI/AI-04 KEY FEATURES ............................................................................... 10
5 PRODUCT SPECIFICATION ................................................................................ 11
5.1 Electrical Properties................................................................................. 11
5.1.1 Power Supply Input ...................................................................... 11
5.1.2 Signal Channels ........................................................................... 11
5.1.3 Fault Status Indication .................................................................. 11
5.1.4 Signal Isolation ............................................................................. 11
5.1.5 Field Wiring Termination............................................................... 12
5.2 Mechanical Properties ............................................................................. 13
5.2.1 Temperature Range ..................................................................... 13
5.2.2 Material......................................................................................... 13
5.2.3 Weight .......................................................................................... 13
5.2.4 Ingress Protection......................................................................... 13
5.2.5 Dimensions................................................................................... 13
6 UNPACKING & INITIAL PREPARATION FOR USE ............................................ 14
6.1 Unpacking ................................................................................................. 14
6.2 Node Assembly ........................................................................................ 14
6.3 Node Disassembly ................................................................................... 14
6.4 Module Positioning Within a Node ......................................................... 15
7 FIELD WIRING TERMINATION ............................................................................ 16
7.1 Terminal & Connector Layout ................................................................. 16
7.2 Wiring Schematic ..................................................................................... 16
7.3 Earthing / Grounding ............................................................................... 17
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