UMTS/HSPA(+) Module Series
UC200T-EM Hardware Design
UC200T-EM_Hardware_Design 46 / 68
layout design:
⚫
Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to
50Ω.
⚫
The GND pins adjacent to RF pins should be designed as thermal relief pads, and should be fully
connected to ground.
⚫
The distance between the RF pins and the RF connector should be as short as possible, and all the
right
-
angle traces should be changed to curved ones.
⚫
There should be clearance under the signal pin of the antenna connector or solder joint.
⚫
The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground could help to improve RF performance. The distance between
the ground vias and RF traces should be no less than two times as wide as RF signal traces (2*W).
For more details about RF layout, please refer to
document [3]
.
4.2.
Antenna Installation
4.2.1.
Antenna Requirement
The following table shows the requirements on main antenna.
Table 26: Antenna Requirements
Type
Requirements
GSM/WCDMA
VSWR: ≤2
Efficiency: >30%
Max input power (W): 50
Input impedance (Ω): 50
Cable insertion loss: <1dB
(EGSM900, WCDMA B8)
Cable insertion loss <1.5dB
(DCS1800, WCDMA B1)