UMTS/HSPA(+) Module Series
UC200T-EM Hardware Design
UC200T-EM_Hardware_Design 56 / 68
7
Storage, Manufacturing and
Packaging
7.1.
Storage
UC200T-EM is stored in a vacuum-sealed bag. The storage restrictions are shown as below.
1.
Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH.
2.
After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
⚫
Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.
⚫
Stored at <10% RH.
3.
Devices require bake before mounting, if any circumstances below occurs:
⚫
When the ambient temperature is 23ºC±5ºC and the humidity indicator card shows the humidity
is >10% before opening the vacuum-sealed bag.
⚫
Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%RH.
⚫
Stored at >10% RH after the vacuum-sealed bag is opened.
4.
If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (120ºC) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033
for baking procedure.
NOTE
