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3.22.1.

Reference Circuit Design for Microphone Interfaces ..................................................... 67

3.22.2.

Reference Circuit Design for Earpiece Interface ........................................................... 68

3.22.3.

Reference Circuit Design for Headset Interface ............................................................ 68

3.22.4.

Reference Circuit Design for Loudspeaker Interface..................................................... 69

3.22.5.

Design Considerations for Audio Interfaces .................................................................. 69

3.23.

USB_BOOT Control Interface ................................................................................................. 69

Wi-Fi and Bluetooth ........................................................................................................................... 71

4.1.

Wi-Fi ......................................................................................................................................... 71

4.1.1.

Wi-Fi Performance ......................................................................................................... 71

4.2.

Bluetooth .................................................................................................................................. 73

4.2.1.

Bluetooth Performance .................................................................................................. 74

GNSS ................................................................................................................................................... 75

5.1.

GNSS Performance ................................................................................................................. 75

5.2.

Reference Design .................................................................................................................... 76

Antenna Interfaces ............................................................................................................................. 77

6.1.

Main/Rx-diversity Antenna Interfaces ...................................................................................... 77

6.1.1.

Operating Frequencies................................................................................................... 77

6.1.2.

Reference Design for Main and Rx-diversity Antenna Interfaces .................................. 79

6.2.

Wi-Fi and Bluetooth Antenna Interface ................................................................................... 80

6.3.

GNSS Antenna Interface & Frequency Bands ........................................................................ 81

6.3.1.

Passive Antenna Reference Design .............................................................................. 82

6.3.2.

Active Antenna Reference Design ................................................................................. 82

6.4.

RF Routing Guidelines ............................................................................................................ 83

6.5.

Antenna Installation ................................................................................................................. 85

6.5.1.

Antenna Design Requirements ...................................................................................... 85

6.5.2.

RF Connector Recommendation ................................................................................... 86

Electrical Characteristics and Reliability ........................................................................................ 88

7.1.

Absolute Maximum Ratings ..................................................................................................... 88

7.2.

Power Supply Ratings ............................................................................................................. 88

7.3.

Operating and Storage Temperatures ..................................................................................... 89

7.4.

Power Consumption ................................................................................................................ 89

7.5.

Tx Power .................................................................................................................................. 94

7.6.

Rx Sensitivity ........................................................................................................................... 96

7.7.

ESD Protection ........................................................................................................................ 98

Mechanical Information ..................................................................................................................... 99

8.1.

Mechanical Dimensions ........................................................................................................... 99

8.2.

Recommended Footprint ....................................................................................................... 101

8.3.

Top and Bottom Views .......................................................................................................... 102

Storage, Manufacturing and Packaging ........................................................................................ 103

9.1.

Storage Conditions ................................................................................................................ 103

9.2.

Manufacturing and Soldering ................................................................................................ 104

Содержание SC262R Series

Страница 1: ...SC262R_Series_Hardware_Design 0 115 SC262R Series Hardware Design Smart Module Series Version 1 0 0 Date 2022 07 11 Status Preliminary...

Страница 2: ...we employ commercially reasonable efforts to provide the best possible experience you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as availa...

Страница 3: ...To implement module functionality certain device data are uploaded to Quectel s or third party s servers including carriers chipset suppliers or customer designated servers Quectel strictly abiding by...

Страница 4: ...interference on sensitive medical equipment so please be aware of the restrictions on the use of wireless devices when in hospitals clinics or other healthcare facilities Cellular terminals or mobile...

Страница 5: ...es SC262R_Series_Hardware_Design 4 115 About the Document Revision History Version Date Author Description 2022 07 11 Today JIN Xiaomeng GUO Creation of the document 1 0 0 2022 07 11 Today JIN Xiaomen...

Страница 6: ...4 2 Voltage Stability Requirements 36 3 4 3 Reference Design for Power Supply 37 3 5 Turn On and Off 38 3 5 1 Turn On with PWRKEY 38 3 5 2 Turn Off the Module 39 3 6 VRTC Interface 40 3 7 Power Outpu...

Страница 7: ...encies 77 6 1 2 Reference Design for Main and Rx diversity Antenna Interfaces 79 6 2 Wi Fi and Bluetooth Antenna Interface 80 6 3 GNSS Antenna Interface Frequency Bands 81 6 3 1 Passive Antenna Refere...

Страница 8: ...Smart Module Series SC262R_Series_Hardware_Design 7 115 9 3 Packaging Specification 105 9 3 1 Carrier Tape 106 9 3 2 Plastic Reel 106 9 3 3 Packaging Process 107 10 Appendix References 108...

Страница 9: ...Vibration Motor Driver Interface 55 Table 20 Pin Definition of LCM Interface 56 Table 21 Pin Definition of Touch Panel Interface 59 Table 22 Pin Definition of Camera Interface 60 Table 23 MIPI Trace L...

Страница 10: ...RF Output Power 95 Table 46 SC262R EM RF Receiving Sensitivity 96 Table 47 SC262R NA RF Receiving Sensitivity 97 Table 48 ESD Characteristics Temperature 25 C Humidity 45 98 Table 49 Recommended Therm...

Страница 11: ...for LCM Interface 58 Figure 21 Reference Design for External Backlight Driving Circuit 59 Figure 22 Reference Circuit Design for TP Interface 60 Figure 23 Reference Circuit Design for 3 Camera Applica...

Страница 12: ...tom View 100 Figure 43 Recommended Footprint Top View 101 Figure 44 Top and Bottom Views of the Module 102 Figure 45 Recommended Reflow Soldering Thermal Profile 104 Figure 46 Carrier Tape Dimension D...

Страница 13: ...document you can quickly understand module interface specifications electrical and mechanical details as well as other related information of the module The document coupled with application notes and...

Страница 14: ...g systems Supports multiple audio and video codecs Built in high performance AdrenoTM 308 graphics processing unit Provides multiple audio and video input output interfaces as well as abundant GPIO in...

Страница 15: ...ons such as edge device edge computing CPE wireless POS smart metering router data card automotive smart phone digital signage alarm panel security and industry PDA etc Galileo 1575 42 1 023 MHz Mode...

Страница 16: ...Transmitting Power Class 4 33 dBm 2 dB for GSM850 Class 4 33 dBm 2 dB for EGSM900 Class 1 30 dBm 2 dB for DCS1800 Class 1 30 dBm 2 dB for PCS1900 Class E2 27 dBm 3 dB for GSM850 8 PSK Class E2 27 dBm...

Страница 17: ...Features 1 GPS GLONASS BDS or GPS Galileo BDS SMS Text and PDU mode Point to point MO and MT SMS cell broadcast LCM Interface Supports one 4 lane MIPI_DSI Supports HD 1440 720 60 fps Camera Interfaces...

Страница 18: ...rd Interface Supports SD 3 0 Supports SD card hot plug U SIM Interfaces Two U SIM interfaces Supports USIM SIM card 1 8 V or 2 95 V Supports Dual SIM Dual Standby supported by default I2C Interfaces F...

Страница 19: ...illustrates the major functional parts Power management Radio frequency Baseband LPDDR3 eMMC flash Peripheral interfaces USB interface UART interfaces U SIM interfaces SD card interface GPIO interfac...

Страница 20: ...PAM SAW LNA SAW SAW Switch SAW ANT_DRX ANT_ MAIN 19 2M XO PMU HK ADC MPPs PWM Headset VRTC PWRKEY VOL_UP VOL_DOWN SD_LDO11 USIM1_VDD USIM2_VDD LDO6_1V8 LDO5_1V8 SD_LDO12 LDO16_2V8 LDO10_2V85 VBAT_BB V...

Страница 21: ...ide the detailed description of pins interfaces listed below Power supply VRTC interface Power output Battery charging and management USB interface UART interfaces U SIM interfaces SD card interface G...

Страница 22: ...AUDIO Pins USB Pins U SIM Pins UART Pins GPIO Pins ANT Pins TP Pins LCM Pins CAMERA Pins OTHERS Pins RESERVED Pins 24 SDCARD Pins 254 VBAT_BB VBAT_BB GND MIC1_P MIC_GND MIC2_P GND EAR_P EAR_N SPK_P SP...

Страница 23: ...input output OD Open drain PI Power input PO Power output PIO Power input output Power Supply Pin Name Pin No I O Description DC Characteristics Comment VBAT_BB 1 2 PIO Power supply for the module s...

Страница 24: ...0 mA Power supply for sensors cameras and I2C pull up circuit If it is used connect an external 1 0 4 7 F capacitor to this pin in parallel If it is not used keep it open LDO10_2V85 156 PO 2 85 V outp...

Страница 25: ...D 5 AI Microphone reference ground If it is not used connect it to the ground MIC2_P 6 AI Microphone input for headset EAR_P 8 AO Earpiece output EAR_N 9 AO Earpiece output SPK_P 10 AO Speaker output...

Страница 26: ...detect High level by default U SIM Interfaces Pin Name Pin No I O Description DC Characteristics Comment USIM2_DET 17 DI U SIM2 card hot plug detect VILmax 0 63 V VIHmin 1 17 V Active low Externally p...

Страница 27: ...tion is disabled by default via software Cannot be multiplexed into a generic GPIO USIM1_RST 23 DO U SIM1 card reset VOLmax 0 4 V VOHmin 0 8 USIM1_VDD Cannot be multiplexed into generic GPIOs USIM1_CL...

Страница 28: ...1 35 V UART1_RXD 153 DI UART1 receive VILmax 0 63 V VIHmin 1 17 V UART1_TXD 154 DO UART1 transmit VOLmax 0 45 V VOHmin 1 35 V SD Card Interface Pin Name Pin No I O Description DC Characteristics Comm...

Страница 29: ...domain Active low TP_I2C_SCL 47 OD TP I2C clock Externally pull them up to 1 8 V Can be used for other I2C devices TP_I2C_SDA 48 OD TP I2C data LCM Interface Pin Name Pin No I O Description DC Charac...

Страница 30: ...CSI1 lane 0 data CSI1_LN0_P 66 AI MIPI CSI1 lane 0 data CSI1_LN1_N 67 AI MIPI CSI1 lane 1 data CSI1_LN1_P 68 AI MIPI CSI1 lane 1 data CSI1_LN3_N 70 AI MIPI CSI1 lane 3 data CSI1_LN3_P 71 AI MIPI CSI1...

Страница 31: ...CAM1_PWDN 82 DO Power down of camera1 CAM_I2C_SCL 83 OD I2C clock of front and rear cameras Externally pull them up to 1 8 V CAM_I2C_SDA 84 OD I2C data of front and rear cameras CAM2_MCLK 165 DO Mast...

Страница 32: ...Pin No I O Description DC Characteristics Comment SENSOR_I2C_ SCL 91 OD I2C clock for external sensor Dedicated for external sensors Cannot be used for touch panel NFC I2C keyboard etc Externally pul...

Страница 33: ...rpose ADC interface The maximum input voltage is 1 7 V Antenna Interfaces Pin Name Pin No I O Description DC Characteristics Comment ANT_MAIN 87 AIO Main antenna interface 50 impedance ANT_DRX 131 AI...

Страница 34: ...se input output GPIO_43 107 DIO General purpose input output GPIO_63 108 DIO General purpose input output GPIO_44 109 DIO General purpose input output GPIO_42 110 DIO General purpose input output GPIO...

Страница 35: ...uring power on 1 8 V power domain GPIO_85 265 DIO General purpose input output 1 8 V power domain GPIO_61 267 DIO General purpose input output GNSS LNA Enable Interface Pin Name Pin No I O Description...

Страница 36: ...the negative pole of the motor Indication Interface Pin Name Pin No I O Description DC Characteristics Comment CHG_LED 195 AO Indicates the module s charging status IOmax 5 mA Other Interfaces Pin Na...

Страница 37: ...make sure the input voltage never drops below 3 1 V Power Supply V Burst Transmission Ripple Drop Burst Transmission Load A Figure 3 Power Supply Limits during Burst Transmission To decrease voltage d...

Страница 38: ...voltage drop between the input and output is not too high it is suggested to use an LDO to supply power for the module If there is a big voltage difference between the input source and the desired ou...

Страница 39: ...driving the PWRKEY pin low for at least 1 6 s The PWRKEY pin is pulled up to 1 8 V internally It is recommended to use an open drain collector driver to control PWRKEY A simple reference circuit is il...

Страница 40: ...on may be different from that shown above 2 Make sure that VBAT is stable before pulling down PWRKEY It is recommended to wait until VBAT to be stable at 3 8 V for at least 30 ms before pulling down P...

Страница 41: ...according to application demands A reference circuit design is shown below Coin Cell Module RTC Core VRTC Figure 10 RTC Powered by Coin Cell If RTC is ineffective it can be synchronized through the n...

Страница 42: ...ode The maximum charging current is 1 44 A when an adapter is used for battery charging and the maximum charging current is 450 mA for USB charging Constant voltage mode CV mode When the battery volta...

Страница 43: ...ESD 1 2 3 USB_VBUS Adapter or USB Module Battery GND C1 C2 C3 R1 D1 D2 1 F C2 NM_1 nF C4 Figure 11 Reference Design for Battery Charging Circuit Mobile devices such as mobile phones or handheld POS s...

Страница 44: ...and full speed 12 Mbps modes The USB interface supports USB OTG and is used for AT command communication data transmission software debugging and firmware upgrade The following table shows the pin de...

Страница 45: ...nterface Reference Design OTG Supported In order to ensure USB performance comply with the following principles when designing the USB interface Route the USB signal traces as a differential pair with...

Страница 46: ...11 Pin Definition of UART Interfaces UART5 is a 4 wire UART interface with 1 8 V power domain You should use a voltage level translator if your application is equipped with a 3 3 V UART interface The...

Страница 47: ...add a level translator and an RS 232 level translator chip between the module and PC The following figure shows the reference design RTS_3 3V RXD_3 3V CTS_3 3V TXD_3 3V RTS_1 8V RXD_1 8V CTS_1 8V TXD_...

Страница 48: ...tiplexed into a generic GPIO USIM2_RST 18 DO U SIM2 card reset Cannot be multiplexed into generic GPIOs USIM2_CLK 19 DO U SIM2 card clock USIM2_DATA 20 DIO U SIM2 card data USIM2_VDD 21 PO U SIM2 card...

Страница 49: ...rcuit for U SIM interface with a 6 pin U SIM card connector Module USIM_VDD USIM_RST USIM_CLK USIM_DATA 22R 22R 22R 100 nF U SIM card connector 22 pF VCC RST CLK IO VPP GND 10K USIM_VDD 22 pF 22 pF R1...

Страница 50: ...ace with an 8 pin U SIM Card Connector and Figure 17 Reference Circuit for U SIM Interface with a 6 pin U SIM Card Connector close to the module 3 12 SD Card Interface SD Card interface of SC262R seri...

Страница 51: ...trace width should be at least 0 8 mm In order to ensure stability of output current add a 4 7 F and a 33 pF capacitor in parallel near the SD card connector SD_CMD SD_CLK SD_DATA0 SD_DATA1 SD_DATA2 a...

Страница 52: ...em 44 SD_DATA3 21 35 Pin Name Pin No GPIO No Default State Comment GPIO_6 167 GPIO_6 B PD nppukp 6 GPIO_7 168 GPIO_7 B PD nppukp GPIO_12 101 GPIO_12 B PD nppukp Wakeup 7 GPIO_13 102 GPIO_13 B PD nppuk...

Страница 53: ...66 B PD nppukp GPIO_85 265 GPIO_85 B PD nppukp GPIO_86 239 GPIO_86 B PD nppukp Wakeup GPIO_87 105 GPIO_87 B PD nppukp GPIO_88 264 GPIO_88 B PD nppukp GPIO_89 115 GPIO_89 B PD nppukp GPIO_90 177 GPIO_9...

Страница 54: ...eup CAM0_RST 79 GPIO_128 B PD nppukp Wakeup CAM0_PWDN 80 GPIO_126 B PD nppukp Wakeup CAM1_RST 81 GPIO_129 B PD nppukp CAM1_PWDN 82 GPIO_125 B PD nppukp CAM2_MCLK 165 GPIO_27 B PD nppukp CAM2_RST 164 G...

Страница 55: ...me Pin No I O Description Comment TP_I2C_SCL 47 OD TP I2C clock Used for touch panel TP_I2C_SDA 48 OD TP I2C data CAM_I2C_SCL 83 OD I2C clock of front and rear cameras Used for camera CAM_I2C_SDA 84 O...

Страница 56: ...rcuit is shown below GPIO_23 116 DO SPI6 clock Can be multiplexed into SPI6_CLK GPIO_20 119 DO SPI6 data output Can be multiplexed into SPI6_MOSI GPIO_21 118 DI SPI6 data input Can be multiplexed into...

Страница 57: ...des one LCM interface which is MIPI_DSI standard compliant The interface supports high speed differential data transmission and supports HD display 1440 720 60 fps The pin definition of the LCM interf...

Страница 58: ...re_Design 57 115 DSI_LN0_P 55 AO LCD MIPI data 0 DSI_LN1_N 56 AO LCD MIPI data 1 DSI_LN1_P 57 AO LCD MIPI data 1 DSI_LN2_N 58 AO LCD MIPI data 2 DSI_LN2_P 59 AO LCD MIPI data 2 DSI_LN3_N 60 AO LCD MIP...

Страница 59: ...4 DSI OUT GND IN EN 1 8 V VBAT 1 F 10K GND Figure 20 Reference Circuit Design for LCM Interface MIPI are high speed signal lines It is recommended to add common mode filters in series near the LCM con...

Страница 60: ...ins are illustrated below Table 21 Pin Definition of Touch Panel Interface A reference circuit for the TP interface is shown below Pin Name Pin No I O Description Comment LDO17_2V85 129 PO 2 85 V outp...

Страница 61: ...d the maximum pixel of the camera can be up to 13 MP The video and photo quality is determined by various factors such as the camera sensor camera lens quality etc Table 22 Pin Definition of Camera In...

Страница 62: ...AI MIPI CSI0 lane 2 data CSI0_LN2_P 199 AI MIPI CSI0 lane 2 data CSI0_LN3_N 161 AI MIPI CSI0 lane 3 data CSI0_LN3_P 200 AI MIPI CSI0 lane 3 data CAM0_MCLK 74 DO Master clock of camera0 1 8 V power dom...

Страница 63: ...Smart Module Series SC262R_Series_Hardware_Design 62 115 DCAM_I2C_SDA 205 OD I2C data of depth camera Externally pull them up to 1 8 V DCAM_I2C_SCL 166 OD I2C clock of depth camera...

Страница 64: ...CSI0_CLK_P CSI0_CLK_N CSI1_CLK_P CSI1_CLK_N LDO6_1V8 2 2K 2 2K camera0 connector 1 F 4 7 F 4 7 F 1 F 1 F 4 7 F CAM2_RST CAM1_PWDN CAM1_MCLK CAM_I2C_SDA _ CAM_I2C_SCL CAM1_RST camera1 connector AVDD D...

Страница 65: ...signal lines During impedance matching do not connect GND on different planes to ensure impedance consistency It is recommended to select a low capacitance TVS for ESD protection and the recommended...

Страница 66: ...N1_P 18 20 70 CSI1_LN3_N 18 10 0 10 71 CSI1_LN3_P 18 20 72 CSI1_LN2_N 18 05 0 05 73 CSI1_LN2_P 18 10 157 CSI0_CLK_N 22 60 0 05 196 CSI0_CLK_P 22 55 158 CSI0_LN0_N 22 55 0 05 197 CSI0_LN0_P 22 50 159 C...

Страница 67: ...ition of Audio Interfaces Pin Name Pin No I O Description Comment SENSOR_I2C_SCL 91 OD I2C clock of external sensor Dedicated for external sensors Cannot be used for touch panel NFC I2C keyboard etc E...

Страница 68: ...nd right channel output and supports headphone insertion detect 3 22 1 Reference Circuit Design for Microphone Interfaces MIC1_P ECM MIC R2 R1 Module D1 MIC_GND 33 pF C1 0R 0R R3 0R Figure 24 Referenc...

Страница 69: ...face 3 22 2 Reference Circuit Design for Earpiece Interface EAR_P EAR_N R2 33 pF 33 pF 33 pF C2 C3 C1 R1 Module D1 D2 0R 0R Figure 26 Reference Circuit Design for Earpiece Interface 3 22 3 Reference C...

Страница 70: ...herefore you should consult the capacitor vendors to choose the most suitable capacitor to filter out the high frequency noises The severity of RF interference in the voice channel during GSM transmit...

Страница 71: ...esign 70 115 such as abnormal start up or running occur For firmware upgrade and debugging in the future reserve the following reference design LDO5_1V8 S1 Module USB_BOOT R1 10K Figure 29 Reference C...

Страница 72: ...5 GHz dual band WLAN based on IEEE 802 11a b g n ac standard protocols The maximum data rate is up to 433 Mbps The features are as below Supports Wake on WLAN WoWLAN Supports ad hoc mode Supports WAP...

Страница 73: ...n HT20 MCS7 13 dBm 2 5 dB 802 11n HT40 MCS0 14 dBm 2 5 dB 802 11n HT40 MCS7 13 dBm 2 5 dB 802 11ac VHT20 MCS0 14 dBm 2 5 dB 802 11ac VHT20 MCS8 13 dBm 2 5 dB 802 11ac VHT40 MCS0 14 dBm 2 5 dB 802 11ac...

Страница 74: ...aximally supports up to 7 wireless connections Maximally supports up to 3 5 piconets at the same time Support one SCO or eSCO connection The BR EDR channel bandwidth is 1 MHz and can accommodate 79 ch...

Страница 75: ...etooth Performance The following table lists the Bluetooth transmitting and receiving performance of SC262R series module Table 29 Bluetooth Transmitting and Receiving Performance Version Data Rate Ma...

Страница 76: ...minimum GNSS signal power at which the module can maintain lock keep positioning for at least 3 minutes continuously 2 Reacquisition sensitivity the minimum GNSS signal power required for the module t...

Страница 77: ...terference In user systems place GNSS RF signal lines and RF components far away from high speed circuits switch mode power supplies power inductors the clock circuit of single chip microcomputers etc...

Страница 78: ...ucts The entire content of this chapter is provided for illustration only Analysis evaluation and determination are still necessary when designing target products 6 1 Main Rx diversity Antenna Interfa...

Страница 79: ...2110 2170 1920 1980 MHz LTE FDD B2 1930 1990 1850 1910 MHz LTE FDD B3 1805 1880 1710 1785 MHz LTE FDD B4 2110 2155 1710 1755 MHz LTE FDD B5 869 894 824 849 MHz LTE FDD B7 2620 2690 2500 2570 MHz LTE...

Страница 80: ...C3 C4 as close to the antennas as possible The capacitors are not mounted by default and the resistors are 0 LTE FDD B2 1930 1990 1850 1910 MHz LTE FDD B4 2110 2155 1710 1755 MHz LTE FDD B5 869 894 82...

Страница 81: ...oth Antenna Interface The following tables show the pin definition and frequency specification of the Wi Fi Bluetooth antenna interface Table 34 Pin Definition of Wi Fi Bluetooth Antenna Interface Tab...

Страница 82: ...gn for Wi Fi Bluetooth Antenna 6 3 GNSS Antenna Interface Frequency Bands The following tables show the pin definition and frequency specification of GNSS antenna interface Table 36 Pin Definition of...

Страница 83: ...rcuit for better GNSS receiving performance and place the LNA close to the antenna 6 3 2 Active Antenna Reference Design In any case it is recommended to use a passive antenna If active antenna is ind...

Страница 84: ...haracteristic impedance of all RF traces should be controlled to 50 The impedance of the RF traces is usually determined by the trace width W the materials dielectric constant the height from the refe...

Страница 85: ...guide Design on a 2 layer PCB Figure 36 Coplanar Waveguide Design on a 4 layer PCB Layer 3 as Reference Ground Figure 37 Coplanar Waveguide Design on a 4 layer PCB Layer 4 as Reference Ground To ensur...

Страница 86: ...rence ground could help to improve RF performance The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces 2 W Keep RF traces away from interferen...

Страница 87: ...FL R SMT connector provided by HIROSE Figure 38 Dimensions of the Receptacle Unit mm GNSS Frequency range 1559 1609 MHz Polarization RHCP or linear VSWR 2 Typ For passive antenna usage Passive Antenna...

Страница 88: ...d plugs listed in the following figure can be used to match the U FL R SMT Figure 39 Specifications of Mated Plugs The following figure describes the space factor of mated connectors Figure 40 Space F...

Страница 89: ...ing table Table 39 Absolute Maximum Ratings 7 2 Power Supply Ratings Table 40 Power Supply Ratings Parameter Min Max Unit VBAT 0 5 6 V USB_VBUS 0 5 16 V Peak Current of VBAT 3 A Voltage on Digital Pin...

Страница 90: ...eak supply current during transmission slot Maximum power control level at EGSM900 1 8 3 0 A USB_VBUS USB power supply 4 35 5 0 6 2 V VRTC Power supply voltage of the backup battery 2 0 3 0 3 25 V Par...

Страница 91: ...connected DRX 6 4 7 mA Sleep USB disconnected DRX 8 3 6 mA Sleep USB disconnected DRX 9 3 0 mA GSM voice call GSM850 PCL 5 282 9 mA GSM850 PCL 12 116 4 mA GSM850 PCL 19 96 7 mA EGSM900 PCL 5 268 6 mA...

Страница 92: ...4DL PCL 0 195 5 mA DCS1800 2UL 3DL PCL 0 289 mA DCS1800 3UL 2DL PCL0 366 5 mA DCS1800 4UL 1DL PCL 0 456 7 mA PCS1900 1UL 4DL PCL 0 186 8 mA PCS1900 2UL 3DL PCL 0 279 2 mA PCS1900 3UL 2DL PCL0 361 2 m...

Страница 93: ...1 3 mA B2 HSDPA max power 511 1 mA B4 HSDPA max power 550 2 mA B5 HSDPA max power 458 4 mA B8 HSDPA max power 484 5 mA B1 HSUPA max power 524 9 mA B2 HSUPA max power 566 8 mA B4 HSUPA max power 566 2...

Страница 94: ...2 711 mA Sleep USB disconnected DRX 9 2 566 mA LTE FDD supply current Sleep USB disconnected DRX 6 6 698 mA Sleep USB disconnected DRX 8 3 509 mA Sleep USB disconnected DRX 9 3 011 mA LTE TDD supply c...

Страница 95: ...E FDD B7 max power 850 7 mA LTE FDD B12 max power 734 9 mA LTE FDD B13 max power 721 7 mA LTE FDD B14 max power 700 mA LTE FDD B17 max power 763 5 mA LTE FDD B25 max power 771 9 mA LTE FDD B26 max pow...

Страница 96: ...FDD B4 23 dBm 2 dB 39 dBm LTE FDD B5 23 dBm 2 dB 39 dBm LTE FDD B7 23 dBm 2 dB 39 dBm LTE FDD B8 23 dBm 2 dB 39 dBm LTE FDD B20 23 dBm 2 dB 39 dBm LTE FDD B28 23 dBm 2 dB 39 dBm LTE TDD B38 23 dBm 2 d...

Страница 97: ...e 46 SC262R EM RF Receiving Sensitivity LTE FDD B7 23 dBm 2 dB 39 dBm LTE FDD B12 23 dBm 2 dB 39 dBm LTE FDD B13 23 dBm 2 dB 39 dBm LTE FDD B14 23 dBm 2 dB 39 dBm LTE FDD B17 23 dBm 2 dB 39 dBm LTE FD...

Страница 98: ...LTE FDD B4 10 MHz 98 2 99 5 101 5 96 3 dBm LTE FDD B5 10 MHz 100 100 5 101 5 94 3 dBm LTE FDD B7 10 MHz 97 3 97 5 100 94 3 dBm LTE FDD B8 10 MHz 99 5 100 102 5 93 3 dBm LTE FDD B20 10 MHz 99 5 100 2 1...

Страница 99: ...dule Table 48 ESD Characteristics Temperature 25 C Humidity 45 LTE FDD B4 10 MHz 98 4 98 9 101 4 96 3 dBm LTE FDD B5 10 MHz 99 8 100 9 103 8 94 3 dBm LTE FDD B7 10 MHz 97 6 98 9 101 3 93 3 dBm LTE FDD...

Страница 100: ...formation This chapter describes the mechanical dimensions of the module All dimensions are measured in millimeter mm and the dimensional tolerances are 0 2 mm unless otherwise specified 8 1 Mechanica...

Страница 101: ...Smart Module Series SC262R_Series_Hardware_Design 100 115 Figure 42 Bottom Dimension Bottom View The package warpage level of the module conforms to JEITA ED 7306 standard NOTE...

Страница 102: ...ed Footprint Figure 43 Recommended Footprint Top View 1 Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience 2 All RES...

Страница 103: ...02 115 8 3 Top and Bottom Views Figure 44 Top and Bottom Views of the Module Images above are for illustration purpose only and may differ from the actual module For authentic appearance and label ple...

Страница 104: ...a dry cabinet 4 The module should be pre baked to avoid blistering cracks and inner layer separation in PCB under the following circumstances The module is not stored in Recommended Storage Condition...

Страница 105: ...the PCB Apply proper force on the squeegee to produce a clean stencil surface on a single pass To guarantee module soldering quality the thickness of stencil for the module is recommended to be 0 18 0...

Страница 106: ...any process e g selective soldering ultrasonic soldering that is not mentioned in document 4 9 3 Packaging Specification This chapter describes only the key parameters and process of packaging All fig...

Страница 107: ...9 3 1 Carrier Tape Dimension details are as follow Figure 46 Carrier Tape Dimension Drawing Table 50 Carrier Tape Dimension Table Unit mm 9 3 2 Plastic Reel Figure 47 Plastic Reel Dimension Drawing W...

Страница 108: ...the cover tape to cover it then wind the heat sealed carrier tape to the plastic reel and use the protective tape for protection 1 plastic reel can load 200 modules Place the packaged plastic reel 1...

Страница 109: ..._Description_and_GPIO_Configuration 3 Quectel_RF_Layout_Application_Note 4 Quectel_Module_Secondary_SMT_Application_Note 5 Quectel_SC262R_Series_Reference_Design Abbreviation Description ADC Analog to...

Страница 110: ...r DCS Digital Cellular System DL Downlink DPSK Differential Phase Shift Keying DQPSK Differential Quadrature Reference Phase Shift Keying DRX Discontinuous Reception DSI Display Serial Interface DSP D...

Страница 111: ...ency Shift Keying GLONASS Global Navigation Satellite System Russia GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPIO General Purpose Input Output GPRS General Packet Rad...

Страница 112: ...for the year 2000 IOmax Maximum Output Load Current LCC Leadless Chip Carrier LCD Liquid Crystal Display LCM LCD Module LDO Low Dropout Regulator LE Low Energy LED Light Emitting Diode LGA Land Grid...

Страница 113: ...e Time Programable PA Power Amplifier PC Personal Computer PCB Printed Circuit Board PCL Power Control Level PCS Personal Communication Service PDA Personal Digital Assistant PDU Protocol Data Unit PH...

Страница 114: ...ng Device SMS Short Message Service SMT Surface Mount Technology SPI Serial Peripheral Interface STA Station TDD Time Division Duplex TP Touch Panel TTFF Time to First Fix TVS Transient Voltage Suppre...

Страница 115: ...with any other antenna or transmitter 5 The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with curr...

Страница 116: ...uired by this section may be included in the manual in that alternative form provided the user can reasonably be expected to have the capability to access information in that form This device complies...

Страница 117: ...SC262RNA is the module s certification number Le produit h te doit tre correctement tiquet pour identifier les modules dans le produit h te L tiquette de certification d Innovation Sciences et D velop...

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Содержание SC262R Series

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Quectel SC262R Series, Проектирование аппаратного обеспечения

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Содержание SC262R Series

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