Smart Module Series
SC262R_Series_Hardware_Design 111 / 115
HSUPA
High Speed Uplink Packet Access
HT
High Throughput
IC
Integrated Circuit
IEEE
Institute of Electrical and Electronics Engineers
I/O
Input/Output
I2C
Inter-Integrated Circuit
IMT-2000
International Mobile Telecommunications for the year 2000
I
O
max
Maximum Output Load Current
LCC
Leadless Chip Carrier
LCD
Liquid Crystal Display
LCM
LCD Module
LDO
Low Dropout Regulator
LE
Low Energy
LED
Light Emitting Diode
LGA
Land Grid Array
LNA
Low Noise Amplifier
LPDDR
Low-Power Double Data Rate
LTE
Long-Term Evolution
M2M
Machine to Machine
MAC
Media Access Control
MCS
Modulation and Coding Scheme
MEMS
Micro-Electro-Mechanical System
MIPI
Mobile Industry Processor Interface
MOQ
Minimum Order Quantity
MP
Megapixel