SC20-A_Manual_R1.0 Confidential / Released 40 / 49
Figure 8: Recommended Stencil Design for LGA Pads
Figure 9: Reflow Soldering Thermal Profile
It is suggested that the peak reflow temperature is from 235 to 245ºC (for SnAg3.0Cu0.5 alloy). The
absolute maximum reflow temperature is 260ºC. To avoid damage to the module caused by repeated
heating, it is suggested that the module should be mounted after reflow soldering for the other side of
PCB has been completed. Recommended reflow soldering thermal profile is shown below: