SC20-A_Manual_R1.0 Confidential / Released 39 / 49
9
Storage, Manufacturing and
Packaging
9.1. Storage
SC20 is stored in a vacuum-sealed bag. The restrictions of storage condition are shown as below.
1. Shelf life in sealed bag is 12 months at < 40ºC/90%RH.
2. After this bag is opened, devices that will be subjected to reflow soldering or other high temperature
process must be:
Mounted within 72 hours at factory conditions of ≤ 30ºC/60%RH.
Stored at < 10% RH.
3. Devices require baking before mounting, if:
Humidity indicator card is > 10% when ambient temperature is 23ºC±5ºC.
Mounting cannot be finished within 72 hours at factory conditions of ≤ 30ºC/60% RH.
4. If baking is required, devices may be baked for 48 hours at 125ºC±5ºC.
9.2. Manufacturing and Welding
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil at the hole of the module pads should be 0.18mm. For details, please
refer to
document [3]
.
As plastic package cannot be subjected to high temperatures, the package must be removed from
devices before high temperature (125ºC) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033 for baking procedure.
NOTE
