Wi-Fi&Bluetooth Module Series
FCM561D-P_Hardware_Design
54 / 65
Table 36: Recommended Thermal Profile Parameters
1. The above profile parameter requirements are for the measured temperature of solder joints. Both
the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours
’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still
clearly identifiable and the QR code is still readable, although white rust may be found.
4. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the
module.
6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance
for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in
document [3]
Factor
Recommended Value
Soak Zone
Ramp-to-soak slope
0
–3 °C/s
Soak time (between A and B: 150 °C and 200 °C)
70
–120 s
Reflow Zone
Ramp-up slope
0
–3 °C/s
Reflow time (D: over 217 °C)
40
–70 s
Max. temperature
235
–246 °C
Cool-down slope
-3
–0 °C/s
Reflow Cycle
Max. reflow cycle
1
NOTE
