LTE Standard Module Series
EC25 Mini PCIe Hardware Design
EC25_Mini_PCIe_Hardware_Design 17 / 79
1.
1)
Within operation temperature range, the module is 3GPP compliant.
2.
2)
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call*, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters
like P
out
might reduce in their value and exceed the specified tolerances. When the temperature
returns to normal operation temperature levels, the module will meet 3GPP specifications again.
3.
“*” means under development.
2.4. Functional Diagram
The following figure shows the block diagram of EC25 Mini PCIe.
EC25
Module
PCM&I2C
M
in
i P
C
I E
x
p
re
s
s
In
te
rf
a
c
e
USB
W_DISABLE#
PERST#
LED_WWAN#
Main
Antenna
Connector
VCC
Main
Antenna
VBAT
GNSS
Antenna
Connector
GNSS
Antenna
Boost
Circuit
Diversity
Antenna
Connector
Diversity
Antenna
WAKE#
UART
DTR
RI
(U)SIM
Figure 1: Functional Diagram
Physical Characteristics
Size: (51.0±0.15)mm × (30.0±0.15)mm × (4.9±0.2)mm
Weight: approx. 9.8g
Temperature Range
Operation temperature range: -35°C to +75°C
1)
Extended temperature range: -40°C to +80°C
2)
Storage temperature range: -40°C to +90°C
Firmware Upgrade
Upgrade via USB interface or DFOTA
RoHS
All hardware components are fully compliant with EU RoHS directive
NOTES