8
S
8.1. Stor
EC25 is sto
1. Shelf
life
2.
After thi
process
Mo
Sto
3. Devices
Hu
Mo
4. If
baking
As plastic c
container fo
IPC/JEDEC
8.2. Man
The squeeg
openings an
clean stenc
the hole of t
It is sugges
max reflow
NOTE
E
Storag
rage
red in avacu
e in sealed b
is bag is op
ses must be:
ounted withi
ored at <10%
s require bak
umidity indic
ounted for m
g is required
ontainer can
orhigh tem
CJ-STD-033
nufacturi
gee should
nd penetrate
il surface on
the module
sted that the
temperatur
EC25-A_Us
ge an
uum-sealed
bag is 12 mo
ened, devic
:
n 72 hours a
% RH.
ke before m
ator card is
more than 72
d, devices m
nnot be subj
perature (1
for bakingp
ng and W
push the pa
e to the PC
n a single pa
pads should
e peak reflow
re is 260ºC
ser_ManualC
nd Ma
bag. The re
onths at < 4
es that will
at factory co
ounting, if:
>10% when
2 hours at fa
may be baked
jected to hig
25ºC) baki
rocedure.
Welding
aste on the
B. The force
ass. To ensu
d be 0.18mm
w temperatu
. To avoid d
Confidentia
anufa
estrictions of
40ºC/90%RH
be subjecte
onditions of
≤
n ambient te
actory condit
d for 48 hou
gh temperatu
ng. If shor
surface of
e on the squ
ure the mod
m. For detail
ure is 235 ~
damage to
al / Release
acturi
f storage con
H.
d to reflow s
≤
30ºC/60%
emperature i
tions of
≤
30
urs at 125ºC
ure, the mod
rter baking
stencil,so a
ueegee sho
dule solderin
s, please re
245ºC (for
the module
d 60 / 6
ng
ndition ares
soldering or
RH.
s23ºC±5ºC.
0ºC/60% RH
±5ºC.
dule needs t
time is de
as to make
uld be adjus
ng quality, th
fer to
docum
SnAg3.0Cu
e when it is
L
EC25-AU
69
hown as be
r other high
.
to be taken
esired, plea
the paste fi
sted so as t
he thickness
ment [4]
.
0.5 alloy). T
repeatedly
LTE Module
ser Manua
low.
temperature
out from the
ase refer to
ll the stenci
to produce a
s of stencil a
The absolute
heated, it is
e
al
e
e
o
il
a
at
e
s
All manuals and user guides at all-guides.com
all-guides.com