70
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TS7, BCT-1710, BCT-1720, BCT-1730
1. OMEGA(Programble Transport IC)_STi5512AWE/STi5512AWE/E
7.4 MOUNTING CONDITION FOR BGA
Max. Temperature
(225deg.C)
125deg.C
+/- 25deg.C
183deg.C
120sec.Max
120sec.MAX
Temperature (deg.C)
Time (Seconds)
Ramp-Up Rate
3deg.C/sec.Max.
Ramp-Down Rate
6deg.C/sec.Max.
220deg.C
30sec.MAX
1.1 Resistance classification of solder reflow
The heat-resistance property of solder depends on package design and chip size. The JEDEC (Joint Electron Device
Engineering Council) standards classify and define the term of viability after opening antihumidity packaging until
accomplishment of solder reflow as MSL (Moisture Sensitivity Level).
Vapor-phase soldering must be accomplished at an ambient temperature of 215
±
3 degrees C or less within 30 seconds. To
improve soldering performance, preheating (at 100 to 150 degrees C for 100 to 120 seconds) is recommended, as shown in the
temperature profile for IR reflow.
The number of times of reflow should be three or less.
Note
The MSL classification we employ conforms to JEDEC-STD-020 and JESD22-A112. (The latest revision JEDEC-STD-020A
uses more detailed classifications, to which our products do not correspond.)
1.2 Recommended reflow conditions
1.2.1 Recommended temperature profile (IR reflow and hot-air reflow
)
The recommended temperature profile for IR (infrared) reflow and hot-air reflow is shown in Figure 2.
The number of times of reflow should be three or less.
For IR reflow it is recommended to use a reflow device which uses middle or far infrared radiation.
When compared with middle and far infrared radiation, higher infrared-heat absorption rate on the mold resins and larger heat
stress would be measured with near infrared radiation.
MSL
3
168 hours
30deg.C/60%RH
Storage environment
Term of viability
MSL classification
(Temperature on the package surface)
Figure 1: Recommended temperature profile (conforming to JEDEC-STD-020)
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