Phytec phyBOARD Regor AM335x, Инструкция по применению

Страница: 7 / 48

Conventions, Abbreviations and Acronyms

PHYTEC Messtechnik GmbH 2018 L-823e_2
v
Abbreviations and Acronyms
Many acronyms and abbreviations are used throughout this manual. Use
Table 1
to
navigate unfamiliar terms used in this document.
Abbreviation Definition
A/V Audio/Video
BSP Board Support Package (Software delivered with the Development Kit
including an operating system (Windows, or Linux) pre-installed on
the module and Development Tools)
CB Carrier Board; used in reference to the phyBOARD-Regor Development
Kit Carrier Board
DFF D flip-flop
DSC Direct Solder Connect
EMB External memory bus
EMI Electromagnetic Interference
GPI General purpose input
GPIO General purpose input and output
GPO General purpose output
IRAM Internal RAM; the internal static RAM on the Texas Instruments
AM335x microcontroller
J Solder jumper; these types of jumpers require solder equipment to
remove and place
JP Solderless jumper; these types of jumpers can be removed and placed
by hand with no special tools
NC Not Connected
NM Not Mounted
NS Not Specified
PCB Printed circuit board
PDI PHYTEC Display Interface; defined to connect PHYTEC display adapter
boards or custom adapters
PEB PHYTEC Expansion Board
PMIC Power management IC
PoE Power over Ethernet
PoP Package on Package
POR Power-on reset
RTC Real-time clock
SBC Single Board Computer; used in reference to the PBA-CD-02
/phyBOARD-Regor AM335x
SMT Surface mount technology
SOM System on Module; used in reference to the PCL-051
/phyCORE-AM335x module
Table 1: Abbreviations and Acronyms used in this Manual