Repair tips
1 .
1.1
a .
b .
C.
1.2
a .
b .
C.
Servicing of
(Surface Mounted
Devices)
General cautions on handling and storage
Oxidation on the terminals of
results in poor
soldering. Do not handle
with bare hands.
Avoid using storage places that are sensitive to
oxidation such as places with sulphur or chlorine
gas, direct sunlight, high temperatures or a high
degree of humidity.
The capacitance or resistance value of the
may be affected by this.
Rough handling of circuit boards containing
may cause damage to the components as well as
the circuit boards. Circuit boards containing
should never be bent or flexed. Different circuit
board materials expand and contract at different
rates when heated or cooled and the components
and/or solder connections may be damaged due to
the stress. Never rub or scrape chip components as
this may cause the value of the component to
change. Similarly, do not slide the circuit board
across any surface.
Removal of
Heat the solder (for 2-3 seconds) at each terminal
of the chip. By means of
wire and a slight
horizontal force, small components can be removed
with the soldering iron. They can also be removed
with a solder sucker (see Fig.
or:
While holding the SMD with a pair of tweezers,
take it off gently using the soldering iron’s heat
applied to each terminal (see Fig.
Remove the excess solder on the solder lands by
means of litz wire or a solder sucker
(see Fig.
Fig. 8.1
a .
b .
C.
d .
1.3
a .
b .
a .
b .
C.
d.
e .
f.
Fig. 8.2
Caution on removal:
When handling the soldering iron, use suitable
pressure and be careful.
When removing the chip, do not use undue force
with the pair of tweezers.
The soldering iron to be used (approx. 30
should preferably be equipped with a thermal
control (soldering temperature: 225 to
The chip, once removed, must
never
be reused.
Attachment of
Locate the SMD on the solder lands by means of
tweezers and solder the component on one side.
Ensure that the component is positioned correctly
on the solder lands
Fig.
Next complete the soldering of the terminals of the
component (see Fig.
Caution when attaching
When soldering the SMD terminals, do not touch
them directly with the soldering iron. The soldering
should be done as quickly as possible; care must
be taken to avoid damage to the terminals of the
themselves.
Keep the
body in contact with the printed
board when soldering.
The soldering iron to be used (approx. 30 W
should preferably be equipped with a thermal
control (soldering temperature: 225 to
Soldering should not be done outside the solder
land.
Soldering flux (of rosin) may be used, but should
not be acidic.
After soldering, let the SMD cool down gradually at
room temperature.
The quantity of solder must be proportional to the
size of the solder land. If the quantity is too great,
the SMD might crack or the solder lands might be
torn loose from the printed board (see Fig. 8.31.
Fig. 8.3
2.
If the
the
numb
peak
adjus
All
instal
3.
Error
OSD: ERR
OSD: ERR
OSD: ERR
OSD: ERR
OSD: ERR
OSD: ERR
OSD: ERR
OSD: ERR
Flashing L
OSD: ERR
59 760
