IC Data Sheets
8.
8.7
Diagram
B06A, TPA3123D (IC 7L10)
Figure 8-7 Internal block diagram and pin configuration
Block Dia
g
ram
Pin Confi
g
uration
1
8
440_
3
02_090
3
0
3
.ep
s
090
3
0
3
1 F
SD
PVCCL
PVCCR
VCLAMP
GAIN1
BYPASS
1 F
1 F
0.22 F
AGND
}
Control
Shutdown
Control
LIN
RIN
BSR
BSL
PGNDR
PGNDL
0.22 F
22 H
22 H
0.68 F
470 F
0.68 F
1 F
470 F
GAIN0
AVCC
MUTE
ROUT
LOUT
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
PVCCL
SD
PVCCL
MUTE
LIN
RIN
BYPASS
AGND
AGND
PVCCR
VCLAMP
PVCCR
PGNDL
PGNDL
LOUT
BSL
AVCC
AVCC
GAIN0
GAIN1
BSR
ROUT
PGNDR
PGNDR
TERMINAL
I/O/P
DESCRIPTION
24-PIN
NAME
(PWP)
Shutdown signal for IC (low = disabled, high = operational). TTL logic levels with compliance to
SD
2
I
AVCC
RIN
6
I
Audio input for right channel
LIN
5
I
Audio input for left channel
GAIN0
18
I
Gain select least-significant bit. TTL logic levels with compliance to AVCC
GAIN1
17
I
Gain select most-significant bit. TTL logic levels with compliance to AVCC
Mute signal for quick disable/enable of outputs (high = outputs switch at 50% duty cycle, low =
MUTE
4
I
outputs enabled). TTL logic levels with compliance to AVCC
BSL
21
I/O
Bootstrap I/O for left channel
PVCCL
1, 3
P
Power supply for left-channel H-bridge, not internally connected to PVCCR or AVCC
LOUT
22
O
Class-D 1/2-H-bridge positive output for left channel
PGNDL
23, 24
P
Power ground for left-channel H-bridge
VCLAMP
11
P
Internally generated voltage supply for bootstrap capacitors
BSR
16
I/O
Bootstrap I/O for right channel
ROUT
15
O
Class-D 1/2-H-bridge negative output for right channel
PGNDR
13, 14
P
Power ground for right-channel H-bridge.
PVCCR
10, 12
P
Power supply for right-channel H-bridge, not connected to PVCCL or AVCC
AGND
9
P
Analog ground for digital/analog cells in core
AGND
8
P
Analog ground for analog cells in core
Reference for preamplifier inputs. Nominally equal to AVCC/8. Also controls start-up time via
BYPASS
7
O
external capacitor sizing.
AVCC
19, 20
P
High-voltage analog power supply. Not internally connected to PVCCR or PVCCL
Connect to ground. Thermal pad should be soldered down on all applications to properly
Thermal pad
Die pad
P
secure device to printed wiring board.
Содержание 40PFL8664H/12
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