experience could overheat and damage the PCB foil.
- Flux
Recommended Flux: Specific Gravity 0.82.
Type RMA (lower residue, non-cleaning type)
Note: See
ABOUT LEAD FREE SOLDER (PbF: Pb free)
().
29.2. Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering two
diagonally opposite pins in the correct positions on the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the soldering
iron along the tips of the pins while feeding enough solder to the
tip so that it flows under the pins as they are heated.
29.3. Modification Procedure of Bridge
72
Содержание KX-TCD400HGB
Страница 23: ...Shown in Fig To Remove Remove 1 Lower Cabinet Screws 2 6 12 A 2 2 Main P C Board Main P C Board 9 2 Handset 23...
Страница 53: ...19 FREQUENCY TABLE MHz 53...
Страница 59: ...The BBIC detects this level and power down 24 SIGNAL ROUTE 25 CPU DATA BASE UNIT 25 1 IC2 BBIC 59...
Страница 63: ...45 MICP A I 63...
Страница 74: ...74...
Страница 75: ...31 CABINET AND ELECTRICAL PARTS LOCATION HANDSET 32 ACCESSORIES AND PACKING MATERIALS 75...
Страница 76: ...33 TERMINAL GUIDE OF THE ICs TRANSISTORS AND DIODES 33 1 Base Unit 33 2 Handset 76...