2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the soldering
iron along the tips of the pins while feeding enough solder to the
tip so that it flows under the pins as they are heated.
26.3. Modification Procedure of Bridge
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part of the
pin to draw the solder from between the adjacent pads.
27. CABINET AND ELECTRICAL PARTS LOCATION
(BASE UNIT)
59
Содержание KX-A140EXC
Страница 46: ...18 FREQUENCY TABLE MHz 46 ...
Страница 52: ...24 CPU DATA BASE UNIT 24 1 IC2 BBIC 52 ...
Страница 56: ...45 MICP A I 56 ...
Страница 60: ...60 ...
Страница 61: ...28 CABINET AND ELECTRICAL PARTS LOCATION HANDSET 29 ACCESSORIES AND PACKING MATERIALS 61 ...
Страница 62: ...30 TERMINAL GUIDE OF THE ICs TRANSISTORS AND DIODES 30 1 Base Unit 30 2 Handset 62 ...
Страница 91: ...4 1 5 8 PbF 1 28 18 IC3 IC2 IC1 11 64 1 16 17 32 49 48 33 Marked ...
Страница 93: ...Marked PbF IC1 IC2 100 80 5 8 4 1 50 51 30 31 1 11 18 1 28 IC3 ...
Страница 94: ...Marked 1 PROG PbF BOOK UP POWER CAN DOWN RIGHT REDIAL LEFT 1 2 3 6 5 7 0 R 4 9 8 INT MIC TALK 36 CN2 ...
Страница 95: ...Clip Base PCB G N D S D A S C L ...