4
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
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Страница 9: ...9 4 Specifications ...
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Страница 21: ...21 8 3 2 Removal of the Hood ND Case Unit and Focus Ring Fig D2 8 3 3 Removal of the Side Case R Unit Fig D3 ...
Страница 22: ...22 8 3 4 Removal of the Speaker Fig D4 8 3 5 Removal of the Side R OP P C B Unit Fig D5 Fig D6 ...
Страница 23: ...23 8 3 6 Removal of the Side R Int P C B Unit Fig D7 Fig D8 8 3 7 Removal of the Lens Unit Fig D9 ...
Страница 24: ...24 Fig D10 8 3 8 Removal of the Lens Int P C B Unit and Main P C B Unit Fig D11 Fig D12 ...
Страница 25: ...25 8 3 9 Removal of the SD Holder P C B Unit Fig D13 8 3 10 Removal of the Jack P C B Unit Fig D14 ...
Страница 27: ...27 Fig D18 8 3 14 Removal of the Handle Zoom P C B Unit Fig D19 Fig D20 ...
Страница 28: ...28 8 3 15 Removal of the EVF Case Unit Fig D21 Fig D22 8 3 16 Removal of the EVF Angle Adj Case Unit Fig D23 ...
Страница 29: ...29 8 3 17 Removal of the EVF Unit and EVF Int P C B Unit Fig D24 Fig D25 ...
Страница 31: ...31 Fig D30 8 3 21 Removal of the Front P C B Unit Fig D31 Fig D32 8 3 22 Removal of the LCD Case Unit Fig D33 ...
Страница 32: ...32 Fig D34 8 3 23 Removal of the LCD Unit and Moni tor P C B Unit Fig D35 ...
Страница 33: ...33 Fig D36 8 3 24 Removal of the MOS Unit and IR Fil ter Fig D37 ...
Страница 34: ...34 8 3 25 Removal of the Focus Motor Fig D38 8 3 26 Removal of the Zoom Motor Fig D39 ...
Страница 66: ...S 29 ...
Страница 81: ...S 44 ...
Страница 98: ...S 61 S7 6 LCD Section B87 16 98 133 132 101 100 99 81 97 96 B86 B88 84 ...