Pace TF 2000, Руководство пользователя

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are similar to the component body. For reflow, position
the nozzle 1 mm above the component. The time of the
reflow cycle may have to be adjusted to insure
satisfactory results. A thermo-couple should be used to
verify reflow conditions.
Figure 11: Properly Positioned Nozzle in Relation to PCB
6) When the nozzle is properly positioned, press the CYCLE START
button. The PREHEAT LED on the Phase Display Panel will light
and the reflow cycle will begin.
7) The Phase Display Panel (See Figure 8) will indicate the phase of
the reflow cycle (PREHEAT, SOAK, REFLOW and COOLDOWN)
and the time for each phase will be counted down on the LCD
Display. An audible alarm will sound seven (7) seconds before the
end of the reflow phase.
8) When the reflow cycle is complete, the nozzle will automatically
raise and the COOLING FAN will turn on, cooling the soldered
component, PCB and nozzle.
9) Do not remove the PCB from the board holder until the COOLING
LED has gone off and the OFF LED is lighted.
3-4 Adjusting Airflow
1) The knob on the air flow meter adjusts the air flow. Make sure to
match the air flow meter value with the value of FLOW on the
LCD Display. The actual air flow will not be changed by the flow
value of the display panel.
3-5 Component Removal
1) Component removal is accomplished in the same way as the
reflow.
2) When the audible alarm signals 7 seconds before the end of the
reflow phase, push the VACUUM button to turn on the vacuum
pump.
3) Once the reflow head raises up, remove the component by using
the hand held vacuum pick.
4) It is possible to shorten the profile for removals.
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