General Information
TP-65 ThermoPik Handpiece -
Provides safe, one-handed reflow and removal of a wide variety of
PQFPs and FlatPacks in just seconds. The high thermal efficiency design targets controlled
SensaTemp heat directly at the solder joints, away from sensitive substrate areas and adjacent
components. The ThermoPik’s self-adjusting integral vacuum pick and unique design provide easy, one-
handed operation.
DTP-80 Dual ThermoPik Handpiece -
Provides safe, one-handed reflow and removal of a wide variety of
PQFPs and FlatPacks in just seconds. Its high thermal capacity and targeted heat quickly removes
large SMDs without damage to the board or adjacent components, even on heavy, multilayer assemblies.
The unique, vertically oriented design and a wide variety of quick change tips easily reach into tight work
areas for safe SMD removal. The Dual ThermoPik’s self-adjusting integral vacuum pick and unique design
provide easy, one-handed operation.
TJ-70 ThermoJet Handpiece -
Provides safe, rapid installation of SMDs including chip components,
SOTs, SOICs, PLCCs, LCCCs and FlatPacks. The slim-line design and precision focused air flow lets
you easily target controlled heat right at the solder joints without damaging the board or adjacent
components. A finger-actuated air switch and SensaTemp control provide safe, “on-demand” capability
without constant running of the air pump.
Optional Handpieces
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Содержание MBT 201
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