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2020-06-04 | Document No.: AN149
Figure 5 shows the principal design of the OSRAM OSTAR
®
Projection Power
devices with connecting board. All the devices are available as a 2-chip, 4-chip
or 6-chip light source, mounted on an IMS with drilled holes for mounting and
connector pads for electrical connections.
Figure 5: Principal design of the OSRAM OSTAR
®
Projection Power with a connecting
board
Delivery
The OSRAM OSTAR
®
Projection Power devices on IMS-PCB (Insulated Metal
Substrate) will be delivered on trays, like illustrated in Figure 6. OSRAM Opto
Semiconductors can be contacted for a detailed drawing.
Figure 6: Example of a tray
Handling recommendations
In addition to general guidelines on the handling of LEDs, additional care should
be taken that mechanical tension on the carrier board and especially stress (e.g.
sheering forces) on the glass cover or ceramic are avoided. This means, that the
LED must not be picked up or handled by the glass or ceramic.
In general, any type of sharp object (e.g. forceps, fingernails, etc.) should be
avoided in order to prevent stress to, or penetration of, the encapsulation since
this can lead to damage to the component. Exerting pressure on the elastic
Globe-Top can lead to the spontaneous failure of the LED (damage to the
contacts).
IMS
Connector pads for
electrical connections
Protective tape
Frame
